No-rinse phosphating process

No-rinse phosphating process

I"" .......' ~ t:.;. bakeoff oven; heating in order to drive off volatile materials and burn off combustible components of the entrapped paint overs...

128KB Sizes 2 Downloads 126 Views

I""

.......' ~ t:.;.

bakeoff oven; heating in order to drive off volatile materials and burn off combustible components of the entrapped paint overspray particles and returning the cleaned filters for reuse in the paint spraybooth.

nese ions, and 50 to 300 gIL of phosphate ions and having a pH value of 1 to 3.6, a free acid content of 0 to 100 points, a total acid content of 40 to 400 points, and a ratio of free acid to total acid not greater than 1:4.

NO·RINSE PHOSPHAnNG PROCESS

DEVICE FOR ELECTROCHEMICAUY MACHINING RECESSES

US. Patent 5,976,272. Nov. 2, 1999 R. Seidel et al., assignors to Henkel, Duesseldorf, Germany

In a process for phosphating a surface of steel, zinc, aluminium, or their alloys by treatment with an acidic, zinc- and phosphatecontaining solution and drying the surface without rinsing, the improvement, which comprises contacting with a phosphating solution containing 2 to 25 gIL of zinc ions, 2 to 25 gIL of manga-

trolyte solution flows; means forming an inflow for the electrolyte solution; and means forming a return arranged so that the electrolyte solutions is conducted through the return opposite to a direction of the inflow between the disk and a component, said means for forming the return being formed as a channel.

US. Patent 5,976,330. Nov. 2, 1999 G. Ziegler and H. Angermaier, assignors to Robert Bosch GmbH, Stuttgart, Germany

EUCTRODEPOSITION APPARATUS FOR COAnNG WAFERS

A device for electrochemical treatment of recesses in an interior of components made of electrically conducting materials, the device comprising a support composed of an electrically conducting material; at least one disk arranged on the support, past which an elec-

US. Patent 5,976,331. Nov. 2, 1999 C. Chang et al., assignors to Lucent Technologies Inc., Murray Hill, N.J.

An electrodeposition apparatus for use in depositing one or more metal or conductive layers on a front surface of a semiconductor wafer.

The Electrodeposition of Tin and Its Alloys lry M. Jordan 409 pages $130.00 The A 1100 offers unrivaled precision .1I1d ;\CCUr
• Improve Process Control • Increase Throughput • Guarantee Quality • In-line Inspection • Insitu Process Control MONITOR • Bath Cleanliness • Oxide Thickness • Barrier Laver Thickness

Analytical

]Jc"~~~(ogies 1<03 W. Flt'l1llng r». • Ph: X2X-41"'-007-t

Moq~.lI1ton. F,lX:

N<: 21<655 X2X-41Vl474

E-1l1.1il: sales: Iilnu hickncss.com www.Iilnu h icknesv.com

This is the definitive book on every conceivable aspect of the electrodeposition (and electroless deposition) of tin and its alloys. All bath types are discussed in detail. Analysis of baths and testing of deposits using both simple methods and more advanced instrumental techniques are covered. National, international, military, and other standards and specifications are also included. Send Orders to:

METAL FINISHING 660 White Plains Rd. Tarrytown, NY 10591-5153 For faster service, call (914) 333-2578 or FAX your order to (914) 333-2570 All book order, must he prepaid .. Please include S5.00 shipping and haodlm~ for dehverv "f e.ich book Via UPS in the U.S .. S10.00 for each book shipped express to Canada; and S20.00 for each hook -hipped express to JII ot her countries.

Circle 005 on reader information card

82

Metal Finishing