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November 2 – 4, 1976: Symposium on adhesion measurement of thin films, thick dilms and bulk coatings
L24
Thin Solid Films, 35 (1976) L24 © Elsevier Sequoia S.A., Lausanne -- Printed in Switzerland
Conference A n n o u n c e m e n t
November 2 - 4, 1976: Symposium on Adhesion Measurement of Thin Films, Thick Films and Bulk Coatings A-symposium on adhesion measurement of thin films, thick films and bulk coatings, sponsored by the American Society for Testing and Materials, is to be" held at the ASTM Headquarters in Philadelphia from November 2nd t o 4th, 1976. Thin films (<1 um), thick films (>1 um) and bulk coatings ( > 2 5 pm) are used for a variety of purposes in electronic, engineering, optical, biomedical, nuclear, space and other applications. Whatever their intended use may be, the properties, structure, functional characteristics and performance all depend i n t e r alia on adhesion between the coating and the substrate. A considerable a m o u n t of effort has been and is being devoted to the development of new methods of measuring adhesion or the improvement of existing methods. This symposium is organized to review and assess current measurement techniques, to provide a forum for exchange of ideas, to define problem areas which need intensified effort, and to galvanize increased interest in developing better techniques. The theme of the symposium will be Adhesion Measurement Techniques: Their Potentialities and Limitations. Various tests -- qualitative, quantitative, non-destructive, destructive etc. -- for measuring adhesion will be considered. Obviously the emphasis will be on the quantitative techniques. Also the factors which interfere with the reliability and reproducibility of the technique or complicate the interpretation of the results obtained should be clearly discussed. Adhesion of all kinds of films and coatings -- metallic, polymeric, ceramic, hybrid, alloys, compounds, thick film inks etc. -- on an assortment of substrates -- metallic, polymeric, ceramic etc. -- will be considered irrespective of the m e t h o d of depositing these films and coatings. The technical program will comprise both invited and contributed papers, and both authoritative reviews and original research papers will be considered. All inquiries should be directed to: Dr. K. L. Mittal Symposium Chairman IBM Corporation Dept. L04, Bldg. 052 Poughkeepsie, N.Y. 12602 U.S.A. (Telephone (914) 463-3382)
Thin Solid Films, 35 (1976) L24 © Elsevier Sequoia S.A., Lausanne -- Printed in Switzerland
Conference A n n o u n c e m e n t
November 2 - 4, 1976: Symposium on Adhesion Measurement of Thin Films, Thick Films and Bulk Coatings A-symposium on adhesion measurement of thin films, thick films and bulk coatings, sponsored by the American Society for Testing and Materials, is to be" held at the ASTM Headquarters in Philadelphia from November 2nd t o 4th, 1976. Thin films (<1 um), thick films (>1 um) and bulk coatings ( > 2 5 pm) are used for a variety of purposes in electronic, engineering, optical, biomedical, nuclear, space and other applications. Whatever their intended use may be, the properties, structure, functional characteristics and performance all depend i n t e r alia on adhesion between the coating and the substrate. A considerable a m o u n t of effort has been and is being devoted to the development of new methods of measuring adhesion or the improvement of existing methods. This symposium is organized to review and assess current measurement techniques, to provide a forum for exchange of ideas, to define problem areas which need intensified effort, and to galvanize increased interest in developing better techniques. The theme of the symposium will be Adhesion Measurement Techniques: Their Potentialities and Limitations. Various tests -- qualitative, quantitative, non-destructive, destructive etc. -- for measuring adhesion will be considered. Obviously the emphasis will be on the quantitative techniques. Also the factors which interfere with the reliability and reproducibility of the technique or complicate the interpretation of the results obtained should be clearly discussed. Adhesion of all kinds of films and coatings -- metallic, polymeric, ceramic, hybrid, alloys, compounds, thick film inks etc. -- on an assortment of substrates -- metallic, polymeric, ceramic etc. -- will be considered irrespective of the m e t h o d of depositing these films and coatings. The technical program will comprise both invited and contributed papers, and both authoritative reviews and original research papers will be considered. All inquiries should be directed to: Dr. K. L. Mittal Symposium Chairman IBM Corporation Dept. L04, Bldg. 052 Poughkeepsie, N.Y. 12602 U.S.A. (Telephone (914) 463-3382)