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Microdectronics and Reliability
Pergamon Press 1972. Vol. 11, pp. 319-334.
Printed in Great Britain
WORLD ABSTRACTS ON MICROELECTRONICS AND RELIABILITY THE abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the article. T h e y are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections.
Subjects: 1. 2. 3. 4. 5. 6. 7. 8. 9.
Reliability--General. Reliability of Components, Tubes, Transistors and ICs. Circuit and Systems Reliability, Maintenance and Redundancy. Microelectronics--General. Microelectronics Design and Construction. Microelectronies--Components, Systems and Equipments. Semiconductor Integrated Circuits, Devices and Materials. Thick- and T h i n - F i l m Components, Circuits and Materials. Electron, Ion and Laser Beams.
Abstracts marked * are acknowledged from R and D Abstracts, published by Mintech Reports Centre (TRC), Orpington, Kent, BR5 3RF.
1. RELIABILITY--GENERAL S y n t h e s i s o f f a u l t d i a g n o s a b l e c o m b i n a t i o n a l logic circuits. M. YAMAMOTO and K. KINOSHITA. Trans. Inst. Elec. Commun. Engrs. ~Tapan 55-D, No. 1 (1972), p. 31. (In Japanese.) As the reliability and availability of circuits are demanded, it has become an important problem to develop dlagnosable circuits. I n this paper, we discuss a method of synthesis and failure diagnosis of combinational circuits. First, we introduce a combinational circuit suitable for fault diagnosis, and present a method for realizing a given logical function. Second, we investigate the fault diagnosis and repair method for the combinational circuits. It is shown that these combinational circuits can be systematically diagnosed.
N e w automatic checklng-out procedures for t r a n s m i s s i o n equipment. J. L. HURAULT and M. BOURGUIGNON. Cables ~ Transmission 26e, A., No. 1 (1972), p. 95. (In French.) T w o recent C I T - A L C A T E L (Compagnie Indnstrielle des T~l~communications A L C A T E L ) development studies are described, both concerning automatic checking-out procedures for transmission equipment. In the final inspection phase, one of the systems provides a numerical hard-print listing of the inspection results, and in addition qualifies them as "good" or "bad". T h e other system deals with subassembly inspection during manufacture and assigns only a "good" or " b a d " rating to each test operation result.
2. RELIABILITY OF COMPONENTS, TUBES, TRANSISTORS AND ICs Effects o f a l u m i n a substrate defects on t h l n - f i l m interconnect p a t t e r n s . R. C. SUNDAHL and E. J. SF~3ORA. Proc. IEEE. 59, No. 10 (1971), p. 1462. A n investigation was made into the occurrence of substrate surface defects, such as surface pits, low-density regions and burrs, and their effect on fine-line thin-film conductor patterns fabricated on the substrate. Substrate surface quality was characterized through examination of fine-line thin-film test patterns (50-vm lines on
100-gin centers). T h e results of these observations are summarized in terms of N, the substrate surface defect density, and f, the frequency of resultant conductor-line imperfections greater in width than some critical size 8. T h e parameter f is directly related to the expected yield Y for a thin-film interconnect circuit with fine-line conductor length L. A quantitative model_ is developed which accurately relates N and f to N(x), the size 319
Pergamon Press 1972. Vol. 11, pp. 319-334.
Printed in Great Britain
WORLD ABSTRACTS ON MICROELECTRONICS AND RELIABILITY THE abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the article. T h e y are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections.
Subjects: 1. 2. 3. 4. 5. 6. 7. 8. 9.
Reliability--General. Reliability of Components, Tubes, Transistors and ICs. Circuit and Systems Reliability, Maintenance and Redundancy. Microelectronics--General. Microelectronics Design and Construction. Microelectronies--Components, Systems and Equipments. Semiconductor Integrated Circuits, Devices and Materials. Thick- and T h i n - F i l m Components, Circuits and Materials. Electron, Ion and Laser Beams.
Abstracts marked * are acknowledged from R and D Abstracts, published by Mintech Reports Centre (TRC), Orpington, Kent, BR5 3RF.
1. RELIABILITY--GENERAL S y n t h e s i s o f f a u l t d i a g n o s a b l e c o m b i n a t i o n a l logic circuits. M. YAMAMOTO and K. KINOSHITA. Trans. Inst. Elec. Commun. Engrs. ~Tapan 55-D, No. 1 (1972), p. 31. (In Japanese.) As the reliability and availability of circuits are demanded, it has become an important problem to develop dlagnosable circuits. I n this paper, we discuss a method of synthesis and failure diagnosis of combinational circuits. First, we introduce a combinational circuit suitable for fault diagnosis, and present a method for realizing a given logical function. Second, we investigate the fault diagnosis and repair method for the combinational circuits. It is shown that these combinational circuits can be systematically diagnosed.
N e w automatic checklng-out procedures for t r a n s m i s s i o n equipment. J. L. HURAULT and M. BOURGUIGNON. Cables ~ Transmission 26e, A., No. 1 (1972), p. 95. (In French.) T w o recent C I T - A L C A T E L (Compagnie Indnstrielle des T~l~communications A L C A T E L ) development studies are described, both concerning automatic checking-out procedures for transmission equipment. In the final inspection phase, one of the systems provides a numerical hard-print listing of the inspection results, and in addition qualifies them as "good" or "bad". T h e other system deals with subassembly inspection during manufacture and assigns only a "good" or " b a d " rating to each test operation result.
2. RELIABILITY OF COMPONENTS, TUBES, TRANSISTORS AND ICs Effects o f a l u m i n a substrate defects on t h l n - f i l m interconnect p a t t e r n s . R. C. SUNDAHL and E. J. SF~3ORA. Proc. IEEE. 59, No. 10 (1971), p. 1462. A n investigation was made into the occurrence of substrate surface defects, such as surface pits, low-density regions and burrs, and their effect on fine-line thin-film conductor patterns fabricated on the substrate. Substrate surface quality was characterized through examination of fine-line thin-film test patterns (50-vm lines on
100-gin centers). T h e results of these observations are summarized in terms of N, the substrate surface defect density, and f, the frequency of resultant conductor-line imperfections greater in width than some critical size 8. T h e parameter f is directly related to the expected yield Y for a thin-film interconnect circuit with fine-line conductor length L. A quantitative model_ is developed which accurately relates N and f to N(x), the size 319