Partnering on InGaP

Technology: Microelectronics

Jointech from EVG and APMI

Partnering on InGaP

EV G r o u p (EVG), m a n u f a c t u r e r

EVG301 single w a f e r a n d m a s k

Taiwan, staffed w i t h t h e region-

of MEMS a n d s e m i c o n d u c t o r

c l e a n e r a n d an EVG560 p r o d u c -

al r e p r e s e n t a t i v e c o m p a n y for

wafer processing equipment,

tion w a f e r b o n d e r for perform-

EVG e q u i p m e n t in Taiwan.

h a s c o n c l u d e d a multimiUion

ing t h e m o s t critical s t e p s in

Major s h a r e h o l d e r T s e m i n Tsai,

Philips controlled access to

dollar e q u i p m e n t p u r c h a s e

microfabrication. Double-side

w h o h a s w o r k e d w i t h EVG for

TriQuint's InGaP Heterojunc-

a g r e e m e n t w i t h Asia Pacific

alignment and wafer bonding

m a n y years, h a s b e e n a p p o i n t e d

M i c r o s y s t e m s Inc of Taiwan.

(anodic, fusion, eutectic) play a

as President o f EVG-Jointech

tion Bipolar Transistor (HBT) 150rrml wafer p r o c e s s i n g fab,

T h e order, w h i c h h a s already

significant role t h r o u g h o u t t h e

C o r p . T h e e x p a n s i o n is a logical

b e e n s h i p p e d a n d successfully

w h o l e MEMS m a n u f a c t u r i n g

step to c o m e closer to t h e

a n d provides for JD of future advanced high-performance

installed, l b r m s part of a com-

p r o c e s s technologies.

Philips S e m i c o n d u c t o r s and TriQuint Semiconductor, have signed a p a r t n e r s h i p that gives

p r o c e s s e s at APM.

T a i w a n e s e c u s t o m e r base,

plete MEMS (micro-electro-

T h e MEMS s e n s o r fabrication

w h i c h i n c l u d e s industrial

mechanical systems) produc-

involves several p r o c e s s steps,

MEMS foundries, a d v a n c e d

tion line.APM is involved in t h e

w h i c h t h e EVG w a f e r process-

packaging production compa-

design a n d m a n u f a c t u r i n g of

ing s y s t e m s c a n easily m a n a g e ,

nies a n d k e y players in MEMS

MEMS s e n s o r s a n d wireless

d u e to t h e ability to h a n d l e var-

and semiconductors.

in t h e p o w e r amplifer a n d front e n d m o d u l e s it d e s i g n s

communication components

ious w a f e r sizes a n d materials.

EVG-Jointech will b e a core site

a n d m a n u f a c t u r e s for m o b i l e

a n d i n a u g u r a t e d its MEMS

"We e x p e c t to see o u r v o l u m e s

for t e c h n o l o g y transfer a n d cus-

p h o n e s , e n s u r i n g TriQuint is a

w a f e r f o u n d r y in N o v e m b e r

go u p a n d n o w w e have fully

t o m e r s u p p o r t . Dr. Peter

lead s u p p l i e r for GaAs devices.

last year.

capable e q u i p m e n t to h a n d l e o u r v o l u m e r e q u i r e m e n t s " , says

Part o f this o r d e r w a s for a fully

Prof. Star Huang, CTO a n d exec-

a u t o m a t e d EVG620 p r e c i s i o n

utive VP of APMI.

a l i g n m e n t a n d l i t h o g r a p h y sys-

This gives Philips i m p o r t a n t a c c e s s to t h e technology-ofc h o i c e for critical c o m p o n e n t s

Podesser, CEO o f EVG said: "Our

"Mobile p h o n e m a n u f a c t u r e r s

conLmon goal is to w o r k as

increasingly look to m o d u l e s to

closely as possible w i t h cus-

simplify d e s i g n a n d p r o d u c -

t o m e r s by c o m b i n i n g local

tion p r o c e s s a n d g u a r a n t e e i n g

tem, t w o EVG150 a u t o m a t e d

EVG f o r m e d a n e w JV c o m p a n y

expertise with the European

RF p e r f o r m a n c e ; ' says T h i e r r y

resist p r o c e s s i n g s y s t e m s , an

EWG-Jointech Corp w i t h APM, in

k n o w l e d g e base."

Laurent, e x e c u t i v e VR, b u s i n e s s unit Mobile C o m m u n i c a t i o n s at Philips S e m i c o n d u c t o r s . "In a

Celeritek's active hire and passive free launch

m o d u l e y o u have t h e o p p o r t u nity to m i x a range of technolo-

ate t h r e e - d i m e n s i o n a l micro-

Celeritek Inc h a s l a t m c h e d a

called t h e Celeritek Shareholder

f a b r i c a t e d s t r u c t u r e s is report-

p o w e r amplifier m o d u l e u s i n g

Protective C o m m i t t e e . T h e

best t e c h n o l o g y in w h i c h to implement components such

ed b y r e s e a r c h e r s at

Passive-Free T e c h n o l o g y (PFT).

group, m a d e u p o f t w o individ-

as t h e o u t p u t stage o f linear

Massachusetts Institute of

In w h a t is claimed an i n d u s t r y

ual s h a r e h o l d e r s a n d t w o

a n d high-efficient p o w e r ampli-

Technology. T h e a p p r o a c h

milestone, Celeritek is t h e first

S o u t h e r n California i n v e s t m e n t

fier a n d front-end modules,"

involves t h e u s e o f a p a t t e r n e d

to offer p o w e r amplifier m o d -

firms, h o l d s 10.26% o f t h e stock

"Philips' s t r o n g RF m a r k e t pres-

conductive template followed

ules for data e n a b l e d t e r m i n a l s

a n d is s e e k i n g to o u s t Celeri-

e n c e offers u s i n c r e a s e d m a n u -

b y an e l e c t r o d e p o s i t i o n step.

a n d h a n d s e t s that are free of

tek's board o f directors.

facturing v o l u m e s , starting w i t h

E x p a n s i o n o f t h e material, eg,

passive c o m p o n e n t s . T h e com-

p o l y p y r r o l e , b o t h vertically

plete p o w e r amplifier m o d u l e

In filings w i t h t h e Securities &

a n d horizontally o c c u r s as it is

consists o f a m o l d e d lead f r a m e

Exchange Commission, the

d e p o s i t e d . T h e d e p o s i t e d film

a n d InGaP HBT die.

g r o u p ' s biggest issue is that t h e

t h e n b r i d g e s to n e w r e g i o n s

C o m p e t i t o r s are claimed to

c o m p a n y rebuffed a m e r g e r

o n t h e t e m p l a t e f o r m i n g an

require b e t w e e n 4 a n d 7 pas-

offer f r o m A n a r e n Microwave,

a n d GM o f F o u n d r y Services at

electrical c o n n e c t i o n w i t h that

sive c o m p o n e n t s w i t h i n t h e

o n e o f its c u s t o m e r s , last year.

TriQuint.

region and deposition contin-

package.Targeting 3G m a r k e t s

Celeritek h a s retained L e h m a n

u e s . T h i s way, s t e p p e d 3-D

in Asia, N o r t h A m e r i c a a n d

Brothers, as financial advisor,

s t r u c t u r e s , b r a n c h e d struc-

Europe, Celeritek's n e w e s t PFT

a n d Wilson Sonsini Goodrich &

tures, t a p e r e d lines, c o n c a v e

m o d u l e , t h e CHP2219-ML sets a

Rosati, as outside legal counsel,

a n d c o n v e x features c a n be

n e w standard in cost, perform-

to assist it explore e n h a n c i n g

formed.This technique opens

a n c e a n d integration for

t h e w a y to fabricate multilevel

W-CDMA p o w e r amplifier

s t r u c t u r e s s u c h as p h o t o n i c

modules.

lattices.

Contact: [email protected]

3D micro fabrication A s i m p l e t e c h n i q u e to gener-

III-Vs REVI EW

;'

~'

~

gies to offer c u s t o m e r s t h e best p r i c e : p e r f o r m a n c e ratio.We believe that InGaP HBT is t h e

o u r current, 2G InGaP HBT process. This c o m p l e m e n t s o u r strategy of driving for t h e lowest m a n u f a c t u r i n g cost structure," says Bruce Fournier, VP

Collaboration h a s already resulted in a n e w W-CDMA PA m o d u l e (BGY402, n o w sampling) a n d PA/FE m o d u l e s for GSM p h o n e s f r o m Philips.

s h a r e h o l d e r value a n d advise

TriQuint is s h i p p i n g PA prod-

t h e Board. It has created a lead

ucts a n d offers this InGaP HBT

i n d e p e n d e n t director, William

p r o c e s s , as well as o t h e r GaAs

The company has come under

Rasdale, to liase b e t w e e n senior

p r o c e s s e s to t h e m a r k e t

attack f r o m an investor g r o u p

m a n a g e m e n t a n d t h e board.

t h r o u g h its o p e n foundry.

C7 :

VO L ~6 - N0 3 "APRI L 2oo3