Plating machine and process for producing film carrier tapesfor mounting electronic parts

bubbles. The formation of a slope toward the opening on the plate makes it possible to further promote the removal of the bubbles from the treatment liquid.

Selective plating with special means to avoid adhesion of bubbles using reel-to-reel methods to form wiring patterns. Tin Plating Method

Plating Machine and Process for Producing Film Carrier Tapes for Mounting Electronic Parts U.S. 2004245111 (Mitsui Mining & Smelting Co.) Fujimoto, A.

U.S. 2004256239 (Rohm Haas Electronic Materials) Whitlaw, K.L., et al. A method for plating tin or alloy on a s u b s t r a t e such whiskers are p r e v e n t e d

and

a tin that from

FINISHING EQUIPMENT SYSTEMS Auto Technology Company acquired UNIFIED EQUIPMENT SYSTEMS (UES) l'onzaerly UDYLITE EQUIPMENT CO. Standard, custom and "hard to find" parts for all UDYLrFE machines are available using the original engineering and design data. The Company will continue to engineer and manufacture the CYCLEMASTER, SENIOR SPLIT-RAIL, C and E OBLIQUE m aBARREL chines., "

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• Hoist systems for Barrel, or Rack • Batch and/or random processing capabilities

Environmental Test Chambers

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Centrifugal Dryers

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• 75 to 800 pound capacity • Choice of six sizes • Heating available for fast drying

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RECOVER NICKEL All Your Dragout. The LeastExpensiveWayOver 10 years of use has proven that the Evaporative TankTM will recover all your dragout so inexpensively that your payback can be as quick as 30 daysJ And use the ET III-W for dewatering waste water.

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forming or the number and/or size of the whiskers are reduced. Coating with Controlled Grain Size and Morphology for Enhanced Wear Resistance and

Toughness US. 2004265541 Ruppi, S. The wear resistance of titanium carbide-nitride coating is enhanced by optimizing grain size and microstructure. Moderatet e m p e r a t u r e CVD is used to obtain controlled, fine equiaxed grain morphology in Ti(C,N) layers. Doping with carbon monoxide, dioxide, zirconium, and/or aluminium chlorides is used. Treatment of Carbon NanoStructure Using Fluidization

US. 2004253374 Jung, K.T, et al. Carbon n a n o s t r u c t u r e s are gas fluidized in a reactor using carrier gas, then introducing reactive gas to purify and surface treat Cnanostructures. Plating Method U.S. 2004262165 Kanda, H., et al. Electrodeposition of, e.g., copper with high adhesion onto and into high-aspect ratio holes as in a printed circuit board or semiconductor using two-stage plating process--the first for high aspect ratio features having deep throwing power, the second electrolyte for filling wider recesses.

Electroplating Compositions and Methods U.S. 2004253804 (Rohm and Haas Electronic Materials) Beica, R., et al. Electrolyte compositions for depositing a tin alloy including tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene www.metalfinishing.com