- Email: [email protected]
Polyimides: Synthesis, characterisation and applications
"Corona discharge treatment of surfaces for bonded joints" A. Beavers and /~ Njegic (UK) 'Surface treatments to improve adhesion to nylon plastics" B.C. Cope (UK) "The performance of joint sealants between porous surfaces in wet conditions" D.W. Aubrey and J.C. Beech (UK) 'Kinetics of shear strength delaminetion of rubber joints' M. Barquins (France)
'High performance bonding of oily/wet surfaces' A.L. Burns (UK) "The effect on service life of encapsulation of the reinforcing components of hydraulic hoses subject to stress' F.W. Hampson and T.R. Manley (UK)
Applications: Assembly 'Assembly with hot melt adhesives' D.G. Carter (UK) 'Equipment for the mixing, metering and dispensing of 2-part resin systems' J.E. Allen (UK)
Day 3 Environmental effects "Adhesives and sealants for severe environments" L.-H. Lea (USA) "High temperature adhesives" S,J. Shaw (UK) "Influence of pretrestment rinse waters on the durability of adhesives bonded alurninium alloys" HJ~. Fsrhnam and W. McGsrel (UK) "l'he durability of adhesively bonded sluminium for automobile structures' A. Meddison, P.G. Selwood and P.G. Sheasby (UK)
'Heat curing adhesives and sealants for body construction in the automobile industry pert I : Toughened epoxy adhesives and vulcanising rubber based systems' B.D. Ludbrook (UK) 'Part I1: Precurable PVC-plastisol and hot pumpable rubber based systems' HJ. B0cken (FRG) "Rubber to metal bonding' M.J. Gregory (UK) "Adhesives in the automotive industry' E.D. Lawley (UK) "Use of adhesives and sealants on mechanical fasteners to improve performance' W.J. Charles (UK)
"Natural weathering of phenolic and epoxy structural adhesives' J. Bishopp
(UK) 'An interpretation of the effects of different curing systems on the water resistance of polysulfide sealants' P,J. Hsnhels, R.H.E. Huang, D.B. Paul and T.E.F. Symes (Australia) Applications: Off-shoro "Adhesive bonding underwater' M.R. Bowditch and ILJ. Stannard (UK)
tool #mv|lw
These papers have been published by Network Events Ltd in three volumes for the three days of the conference. The Proceedings are available (priced £25.00 per volume) from: Network Events Ltd, Printers Mews, Market Hill, Buckingham, MKI8 1JK, England.
i e O ¢ FupmVFliW
Polyimides: Synthesis, Characterisation and Applications Edited by: K.L. Mittal
Plenum Press, 1984, volume 1 614 pp, volume 2 568 pp ($89.50 per volume; $155.00 for two-volume set) This work, divided into two volumes, is the proceedings of the First Technical Conference on Polyimides: Synthesis, Characterisation and Applications held at Ellenville, New York, NY, USA on 10-12 November 1982. The two volumes contain a total of 71 papers covering a very broad range of polyimide science and technology. Areas covered include: synthesis, properties and characterization, metal-containing polyimides, cure kinetics, structure-property relationships, adhesion and adhesives, mechanical properties, microelectronic applications, photosensitive polyimides, aerospace applications, polyimide blends, electrophoretic deposition and applications in electrochemical and medical fields. Of the 71 papers only five deal virtually exclusively with polyimides as adhesives and, rather unfortunately,
these are divided between the two volumes, Consequently, in this review I have considered it necessary to itemize these and other relevant papers and provide a very brief description which, I hope, will be of use to a potential buyer. In volume 1, two papers are of particular interest to those concerned with high temperature adhesives. A paper by St Clair and Yamaki discusses the development of a thermoplastic polyimidesulphone, designed to combine the excellent solvent resistance of polyimides with the good processing characteristics of polysulphones. Adhesive joint properties are discussed in some depth, where a good compromise is claimed between high temperature properties and processability. A paper by Landman describes results obtained from tests conducted on bismaleimidemodified epoxy resin adhesives. The data are taken
INT.J.ADHESION AND ADHESIVES JANUARY 1986
47
iOq t t i V i m W
•
•
from a programme aimed at producing adhesives with high temperature capabilities (232-280°C) together with processing characteristics similar to those found for conventional epoxy resins. There are three papers in volume 2 which deal almost exclusively with polyimides as adhesives. Bolger describes the use Of polyimide adhesives in microelectronics applications where the advantages in terms of shrinkage stresses of polyimide-based adhesives over more traditional techniques of bonding silicon dies to ceramic substrates (eg, gold eutectic solder) are discussed. St Clair and St Clair provide a detailed and concise account of recent developments in aerospace polyimide adhesives. Included are accounts of linear condensation polyimide adhesives, thermoplastic polyimide adhesives and adhesives based upon addition polymerizable imide prepolymers. The basic theme is centred around the need for both high temperature resistance and processability. Hendricks and Hill discuss the evaluation of a range of high temperature structural adhesives for extended service. Conclusions are given as to the adhesive systems considered most suitable for the bonding of titanium for supersonic aerospace environments.
'T S Y O U R FIRST R E S O R T Working with plastics, rubber or polyurethane needn't present problems. Now there's somewhere to turn for expert advice on all these materials. Immediate answers on what to buy, where to buy, and how to get top results. Advice that will cost you nothing. The Plastics and Rubber Advisory Service PRAS - is a logical progression from the successful Plastics Advisory Service, which helped so many businesses. That's w h y - with the full backing of the BPF and BRMA - rubber and polyurethane are now included in the new service. With today's expansion in high technology you need to know how to best exploit the materials available to you. So make PRAS your starting point - your first, rather than your last resort. 5 BELGRAVE SQUARE LONDON SWlX 8PH TEL: 01-235 9888 TELEX 8951528
48
Plastics & Rubber Advisory Service
INT.J.ADHESION AND ADHESIVES JANUARY 1986
•
lOOl i i l i i W
A number of papers describe or review the development and evaluation of polyimides considered suitable for a range of applications, including adhesive bonding. Three are of particular interest. Burks and St Clair describe the development of a melt processable polyphenylene ethersulphideimide which apparently has many of the good processing attributes of polyphenylene oxides and sulphides together with the thermal stability and solvent resistance of polyimides (volume 1). The polymer is exceptionally tough, as reflected in a high room temperature lap shear strength (using titanium adherends) of between 40 and 43 MPa. A low glass transition temperature (Tg) of approximately 160°C would seem to be its major drawback. A paper by Taylor and St Clair discusses the effects of incorporating metal ions on the mechanical, electrical and spectroscopic properties of polyimides (volume 2). Included is a brief account of the effects of metal ion addition on the lap shear strengths of polyimide-bonded titanium. A chapter by Adduci reviews the broad field of polyimide blends with a number of references to adhesives (volume 2). Several papers, mainly in volume 2, discuss adhesion aspects between polyimide insulating layers and substrates in microelectronic applications. In particular, papers by Greenblatt (volume 1) and Lacombe and Greenblatt (volume 2) describe the use of organosilane coupling agents as adhesion promoters for polyimide-silicon dioxide interfaces. Will these volumes be useful to those interested in adhesives? Clearly, polyimides would only be considered by those with a high temperature requirement. Many manufacturers and current users of adhesives would probably not, therefore, find them useful. For those with high temperature applications in mind, the limited information available on adhesives may well be sufficient to justify the high cost which invariably accompanies books of this nature. To this end I hope the brief information given above will be useful. It is also worthwhile to remember that information concerning a particular subject can often be found in unexpected places. Several examples exist in both volumes where information potentially useful to those interested in high temperature adhesives is 'hidden' under other subject headings. There can be absolutely no doubt that both volumes contain a wealth of valuable information regarding recent and on-going developments in the rapidly expanding field of polyimide science and technology. Both volumes are extremely well produced and edited with, apart from the very occasional typographical misprint (in particular Figure 14, page 991), very few errors. Both volumes would be worthwhile library additions for universities and research-oriented organizations interested and involved in various aspects of high temperature polymers. S.J. Shaw
'High performance bonding of oily/wet surfaces' A.L. Burns (UK) "The effect on service life of encapsulation of the reinforcing components of hydraulic hoses subject to stress' F.W. Hampson and T.R. Manley (UK)
Applications: Assembly 'Assembly with hot melt adhesives' D.G. Carter (UK) 'Equipment for the mixing, metering and dispensing of 2-part resin systems' J.E. Allen (UK)
Day 3 Environmental effects "Adhesives and sealants for severe environments" L.-H. Lea (USA) "High temperature adhesives" S,J. Shaw (UK) "Influence of pretrestment rinse waters on the durability of adhesives bonded alurninium alloys" HJ~. Fsrhnam and W. McGsrel (UK) "l'he durability of adhesively bonded sluminium for automobile structures' A. Meddison, P.G. Selwood and P.G. Sheasby (UK)
'Heat curing adhesives and sealants for body construction in the automobile industry pert I : Toughened epoxy adhesives and vulcanising rubber based systems' B.D. Ludbrook (UK) 'Part I1: Precurable PVC-plastisol and hot pumpable rubber based systems' HJ. B0cken (FRG) "Rubber to metal bonding' M.J. Gregory (UK) "Adhesives in the automotive industry' E.D. Lawley (UK) "Use of adhesives and sealants on mechanical fasteners to improve performance' W.J. Charles (UK)
"Natural weathering of phenolic and epoxy structural adhesives' J. Bishopp
(UK) 'An interpretation of the effects of different curing systems on the water resistance of polysulfide sealants' P,J. Hsnhels, R.H.E. Huang, D.B. Paul and T.E.F. Symes (Australia) Applications: Off-shoro "Adhesive bonding underwater' M.R. Bowditch and ILJ. Stannard (UK)
tool #mv|lw
These papers have been published by Network Events Ltd in three volumes for the three days of the conference. The Proceedings are available (priced £25.00 per volume) from: Network Events Ltd, Printers Mews, Market Hill, Buckingham, MKI8 1JK, England.
i e O ¢ FupmVFliW
Polyimides: Synthesis, Characterisation and Applications Edited by: K.L. Mittal
Plenum Press, 1984, volume 1 614 pp, volume 2 568 pp ($89.50 per volume; $155.00 for two-volume set) This work, divided into two volumes, is the proceedings of the First Technical Conference on Polyimides: Synthesis, Characterisation and Applications held at Ellenville, New York, NY, USA on 10-12 November 1982. The two volumes contain a total of 71 papers covering a very broad range of polyimide science and technology. Areas covered include: synthesis, properties and characterization, metal-containing polyimides, cure kinetics, structure-property relationships, adhesion and adhesives, mechanical properties, microelectronic applications, photosensitive polyimides, aerospace applications, polyimide blends, electrophoretic deposition and applications in electrochemical and medical fields. Of the 71 papers only five deal virtually exclusively with polyimides as adhesives and, rather unfortunately,
these are divided between the two volumes, Consequently, in this review I have considered it necessary to itemize these and other relevant papers and provide a very brief description which, I hope, will be of use to a potential buyer. In volume 1, two papers are of particular interest to those concerned with high temperature adhesives. A paper by St Clair and Yamaki discusses the development of a thermoplastic polyimidesulphone, designed to combine the excellent solvent resistance of polyimides with the good processing characteristics of polysulphones. Adhesive joint properties are discussed in some depth, where a good compromise is claimed between high temperature properties and processability. A paper by Landman describes results obtained from tests conducted on bismaleimidemodified epoxy resin adhesives. The data are taken
INT.J.ADHESION AND ADHESIVES JANUARY 1986
47
iOq t t i V i m W
•
•
from a programme aimed at producing adhesives with high temperature capabilities (232-280°C) together with processing characteristics similar to those found for conventional epoxy resins. There are three papers in volume 2 which deal almost exclusively with polyimides as adhesives. Bolger describes the use Of polyimide adhesives in microelectronics applications where the advantages in terms of shrinkage stresses of polyimide-based adhesives over more traditional techniques of bonding silicon dies to ceramic substrates (eg, gold eutectic solder) are discussed. St Clair and St Clair provide a detailed and concise account of recent developments in aerospace polyimide adhesives. Included are accounts of linear condensation polyimide adhesives, thermoplastic polyimide adhesives and adhesives based upon addition polymerizable imide prepolymers. The basic theme is centred around the need for both high temperature resistance and processability. Hendricks and Hill discuss the evaluation of a range of high temperature structural adhesives for extended service. Conclusions are given as to the adhesive systems considered most suitable for the bonding of titanium for supersonic aerospace environments.
'T S Y O U R FIRST R E S O R T Working with plastics, rubber or polyurethane needn't present problems. Now there's somewhere to turn for expert advice on all these materials. Immediate answers on what to buy, where to buy, and how to get top results. Advice that will cost you nothing. The Plastics and Rubber Advisory Service PRAS - is a logical progression from the successful Plastics Advisory Service, which helped so many businesses. That's w h y - with the full backing of the BPF and BRMA - rubber and polyurethane are now included in the new service. With today's expansion in high technology you need to know how to best exploit the materials available to you. So make PRAS your starting point - your first, rather than your last resort. 5 BELGRAVE SQUARE LONDON SWlX 8PH TEL: 01-235 9888 TELEX 8951528
48
Plastics & Rubber Advisory Service
INT.J.ADHESION AND ADHESIVES JANUARY 1986
•
lOOl i i l i i W
A number of papers describe or review the development and evaluation of polyimides considered suitable for a range of applications, including adhesive bonding. Three are of particular interest. Burks and St Clair describe the development of a melt processable polyphenylene ethersulphideimide which apparently has many of the good processing attributes of polyphenylene oxides and sulphides together with the thermal stability and solvent resistance of polyimides (volume 1). The polymer is exceptionally tough, as reflected in a high room temperature lap shear strength (using titanium adherends) of between 40 and 43 MPa. A low glass transition temperature (Tg) of approximately 160°C would seem to be its major drawback. A paper by Taylor and St Clair discusses the effects of incorporating metal ions on the mechanical, electrical and spectroscopic properties of polyimides (volume 2). Included is a brief account of the effects of metal ion addition on the lap shear strengths of polyimide-bonded titanium. A chapter by Adduci reviews the broad field of polyimide blends with a number of references to adhesives (volume 2). Several papers, mainly in volume 2, discuss adhesion aspects between polyimide insulating layers and substrates in microelectronic applications. In particular, papers by Greenblatt (volume 1) and Lacombe and Greenblatt (volume 2) describe the use of organosilane coupling agents as adhesion promoters for polyimide-silicon dioxide interfaces. Will these volumes be useful to those interested in adhesives? Clearly, polyimides would only be considered by those with a high temperature requirement. Many manufacturers and current users of adhesives would probably not, therefore, find them useful. For those with high temperature applications in mind, the limited information available on adhesives may well be sufficient to justify the high cost which invariably accompanies books of this nature. To this end I hope the brief information given above will be useful. It is also worthwhile to remember that information concerning a particular subject can often be found in unexpected places. Several examples exist in both volumes where information potentially useful to those interested in high temperature adhesives is 'hidden' under other subject headings. There can be absolutely no doubt that both volumes contain a wealth of valuable information regarding recent and on-going developments in the rapidly expanding field of polyimide science and technology. Both volumes are extremely well produced and edited with, apart from the very occasional typographical misprint (in particular Figure 14, page 991), very few errors. Both volumes would be worthwhile library additions for universities and research-oriented organizations interested and involved in various aspects of high temperature polymers. S.J. Shaw