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Precoated aluminum alloy articles
material on the conductive top surface of the conductive layer. G. Jonschker; et al., assignors to Institut fur Neue Materialien gemeinnutzige GmbH, Sowbruckw, Germany JA. Sekhar and I? de Nora, assignors to Moltech Invent S.A., Luxembourg, Luxembourg
A method of producing a metal by electrolysis in a cell containing a metal oxide or other metal compound dissolved in a molten salt electrolyte and electrolysis cell components.
US. Patent 6,402,931. June 11,2002 C. Zhou, et al., assignors to Faraday Technology Marketing
A process for protecting a metallic substrate against corrosion resulting from the formation of at least one species derived from at least one metal if the metallic substrate, the process comprising coating the metal with a composition comprising at least one polysiloxane of heteropolysiloxane prepared by hydrolysis and condensation of at least one hydrolysable silane, and curing the composition to form an inorganic network.
Group LLC,
Troy, Ohio
A method for electrochemical deburring of a metal substrate comprising interposing an electrolyte between a metallic substrate including burrs and an electrically conductive tool and passing an electric current between the tool and substrate to effect anodic dissolution of the burrs, wherein the electric current is a pulsed current comprised of anodic pulses and cathodic pulses.
U.S. Patent 6,403,168. June II,2002 H. Meyer and R. Schulz, assignors to Atotech Deutschland
GmbH, Berlin,
Germany
A process for depositing metal coatings on polymide surfaces comprising deposition of a first metal coating on the polyimide surfaces by decomposition of volatile metal compounds by means of a glow discharge process to provide a coating catalytically active for subsequent electroless deposition from an acidic or neutral metallizing bath.
US. Patent 6,402,978. June 11,2002 L. Levin, assignor to MPM Ltd., Haifa, Israel
US. Patent 6,403,213. June 11,2002
A magnetic polishing fluid composition comprising colloidal size magnetic particles with a mean particle size range from O.Olm to 0.15m; colloidal size polishing particles with a mean particle size range O.Olm to O.lm; at least one stabilizer for the colloidal size particles; at least one oxidizer; at least one inhibitor for controlling the rate of oxidation of the oxidizer; and a carrying fluid; wherein the pH is in the range from 0.5 to 5.5.
PL. Huesmann,
assignor to E.I. du
Pont de Nemours and Co., Wilmington, Del.
A substrate coated with a nonstick coating, comprising on undercoat and a fluoropolymer overcoat, the undercoat containing inorganic filler of ceramic particles, the particles having a particle size of 1 micrometer or less and an aspect ratio of not greater than 2.5; at least one adhesion promoter, wherein the weight pro-
portion of inorganic filler to adhesion promoter is in the range of 5:l to 1.7:l; and 0 to 25% of a fluoropolymer based on the weight of the composition of the undercoat layer after baking.
US. Patent 6,403,230. June 11,2002 S.G. Keener, assignor to McDonnell Douglas Corp. Long Beach, Calif An article prepared by a method com-
prising providing an article precursor stock made an aluminum alloy; solution treating and annealing the article precursor; deforming the article precursor; aging the article at room temperature; providing a curable, crosslinkable, phenolic resin-containing organic coating material in an organic solvent; applying the organic coating material to the aluminum alloy article precursor; and heat treating the coated aluminum article precursor to an ultimate shear strength at a temperature and for a time sticient to simultaneously cure the organic coating.
VS. Patent 6,403,234. June 11,2002 A. Kodama and K. Fukamachi,
assig-
nors to Nippon Mining & Metals Co., Ltd., Tokyo
A plated material for connectors having superior insertion and withdrawal properties comprising an intermediate layer consisting of nickel alloy plating and at least one of phosphorous and boron and having a Vickers hardness of 450 to 750 and a thickness of 0.3 to 2m provided on a base metal consisting of copper or copper alloy; a reflowed tin or tin alloy plated surface layer provided thereon; and an alloy layer consisting primarily of tin-nickel and having a thickness of 0.05 to 2m formed by diffusion between the intermediate layer and surface layer, in which average grain size of the tin-nickel compound is 0.05 to lm.
A method of producing a metal by electrolysis in a cell containing a metal oxide or other metal compound dissolved in a molten salt electrolyte and electrolysis cell components.
US. Patent 6,402,931. June 11,2002 C. Zhou, et al., assignors to Faraday Technology Marketing
A process for protecting a metallic substrate against corrosion resulting from the formation of at least one species derived from at least one metal if the metallic substrate, the process comprising coating the metal with a composition comprising at least one polysiloxane of heteropolysiloxane prepared by hydrolysis and condensation of at least one hydrolysable silane, and curing the composition to form an inorganic network.
Group LLC,
Troy, Ohio
A method for electrochemical deburring of a metal substrate comprising interposing an electrolyte between a metallic substrate including burrs and an electrically conductive tool and passing an electric current between the tool and substrate to effect anodic dissolution of the burrs, wherein the electric current is a pulsed current comprised of anodic pulses and cathodic pulses.
U.S. Patent 6,403,168. June II,2002 H. Meyer and R. Schulz, assignors to Atotech Deutschland
GmbH, Berlin,
Germany
A process for depositing metal coatings on polymide surfaces comprising deposition of a first metal coating on the polyimide surfaces by decomposition of volatile metal compounds by means of a glow discharge process to provide a coating catalytically active for subsequent electroless deposition from an acidic or neutral metallizing bath.
US. Patent 6,402,978. June 11,2002 L. Levin, assignor to MPM Ltd., Haifa, Israel
US. Patent 6,403,213. June 11,2002
A magnetic polishing fluid composition comprising colloidal size magnetic particles with a mean particle size range from O.Olm to 0.15m; colloidal size polishing particles with a mean particle size range O.Olm to O.lm; at least one stabilizer for the colloidal size particles; at least one oxidizer; at least one inhibitor for controlling the rate of oxidation of the oxidizer; and a carrying fluid; wherein the pH is in the range from 0.5 to 5.5.
PL. Huesmann,
assignor to E.I. du
Pont de Nemours and Co., Wilmington, Del.
A substrate coated with a nonstick coating, comprising on undercoat and a fluoropolymer overcoat, the undercoat containing inorganic filler of ceramic particles, the particles having a particle size of 1 micrometer or less and an aspect ratio of not greater than 2.5; at least one adhesion promoter, wherein the weight pro-
portion of inorganic filler to adhesion promoter is in the range of 5:l to 1.7:l; and 0 to 25% of a fluoropolymer based on the weight of the composition of the undercoat layer after baking.
US. Patent 6,403,230. June 11,2002 S.G. Keener, assignor to McDonnell Douglas Corp. Long Beach, Calif An article prepared by a method com-
prising providing an article precursor stock made an aluminum alloy; solution treating and annealing the article precursor; deforming the article precursor; aging the article at room temperature; providing a curable, crosslinkable, phenolic resin-containing organic coating material in an organic solvent; applying the organic coating material to the aluminum alloy article precursor; and heat treating the coated aluminum article precursor to an ultimate shear strength at a temperature and for a time sticient to simultaneously cure the organic coating.
VS. Patent 6,403,234. June 11,2002 A. Kodama and K. Fukamachi,
assig-
nors to Nippon Mining & Metals Co., Ltd., Tokyo
A plated material for connectors having superior insertion and withdrawal properties comprising an intermediate layer consisting of nickel alloy plating and at least one of phosphorous and boron and having a Vickers hardness of 450 to 750 and a thickness of 0.3 to 2m provided on a base metal consisting of copper or copper alloy; a reflowed tin or tin alloy plated surface layer provided thereon; and an alloy layer consisting primarily of tin-nickel and having a thickness of 0.05 to 2m formed by diffusion between the intermediate layer and surface layer, in which average grain size of the tin-nickel compound is 0.05 to lm.