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Printed wiring boards and methods formaking them
METHOD
AND APPARATUS
OPENINGS
AND
FOR ACTIVATING
FOR JETS PLATING
U.S. 2004084318 Cohen, U. Ultrasonic or megasonic enhanced electroplating for via filling, etc., also using high pressure electrolyte jets to allow electrodeposition into cavities, etc. COPPER
INTERCONNECT
IMMERSION/ELECTROLESS DAMASCENE
BY PLATING
IN DUAL
PROCESS
US. 2004084320 (Xerox Corp.) Wong, K.H.
BRIGHTENER
Fabrication of copper interconnect for integrated circuits by means of copper electroplating. In the conventional method, critical steps such as deposition of copper seed layer and chemical mechanical polishing (CMP) are required. However, in this technique, both the seed layer deposition and CMP are not required. PRINTED
WIRING
MAKING
THEM
BOARDS
AND
graphite) having a m e a n particle size no greater than about 50pro, combined with an organic binding agent, is coated on the conditioned surface to form an electrically conductive carbon coating. The conductive carbon coating is then optionally fixed on the (formerly) nonconductive surface and dried. The resulting coating has a low electrical resistance and is tenacious enough to be plated and exposed to molten solder without creating voids or losing adhesion, yet is easily removable from copper surfaces of the substrate by microetching.
METHODS
FOR
CYANIDE
ADDITIVE
-FREE ZINC
AND
BATH FOR ALKALINE
ELECTROPLATING
U.S. 2004084322 (Columbia Chemical Corp.) Rosenberg, W.E.; Ludwig, R.J. An aqueous alkaline non-cyanide zinc electroplating bath containing zinc ions for producing bright electrodeposits of zinc and a brightening agent comprising a polymeric quaternary amine and a reducing sugar, and a compound that forms a reducing sugar upon hydrolysis.
US. 2004084321 Thorn, C.E.; Polakovic, F.;. et al.
CMP
Metallizing method by applying a conductive carbon coating to a non-conductive surface and a printed circuit board having through holes or other nonconductive surfaces treated with such carbon coatings. A conditioning agent is applied to the non-conductive surface to form a conditioned surface. A liquid dispersion of electrically conductive carbon (such as
U.S. 2004084415 (Taiwan Semiconductor Mfg.) Cheng, Y.; Liu, C.W.; et al.
PROCESS
OR SLURRY
LEAVING
NO RESIDUAL
OXIDE
LAYER
PARTICLES
Two problems seen in conventional CMP are a tendency for slurry particles to remain on the surface and the formation of a final layer of oxide. These problems have been solved by adding to the slurry a quantity of TMAH or TBAH. This has the effect of HES TM High Efficiency System
• Rapid adsorption/filtration of soluble and insoluble metals a n d organics • C l e a n dust free and e a s y t o u s e • Improves plating quality and consistency
Your Source for Wastewater Treatment & RecoveryTechnologies • Conventional Precipitation Separation a Microfiltration & Ultrafiltration
• Eliminateslossesfromdraftscreatedby overhead ventilation,coolingfans,opendoorsetc. • Eliminatesthe needfor an operatorto stand overthe degreaser, , Freestandingwhen machine is removed for service.
* Can be field mountedto existingequipment. . Manual load and unload station. • NESHAP Compliant
Design.
• High hydraulic permeability improves flowrate a n d extends bath service life
• Filter Presses 2-200 cu ft. conventional & membrane
Call 800-249-1990for a FREEECO$ORBSample!
• Clarifiers - complete systems & components New & Used
Graver
58
approved solvents.
• Primaryand ColdTrape Refrigerationprovided by onecompressor*. • ReducesSolvent Consumption
• IntegralSafetyControls . IntegralContainmentPan . Finishedin attractivestainless
*Patent #5,894,881 *Patent #5,865,198
enclosure and provided with wheels for installation ease,
Technotogies
200 Lake Drive, Glasgow, DE 19702-3319 Tel.: 302-731-1700 800-249-]990 Fax: 302-731-1707 Website: www.gravedech.eom
• Accepts all currently
P.O. Box 622 • Pottstown, PA 19464 Phone: 610-326-4771 • Fax: 610-705-1861
~istributors Wonte¢
www.jtequip.com
Circle 019 on reader information card or go to www.thru.to/webconnect
Circle 024 on reader information card or go to www.thru.to/webconnect
tJl¢ll
Ultra-Kool, Inc. PH (610) 367-2019 FAX (610) 367-8396
Website: www.ultra-kool,com Emaih info@ultra-kooLcorn
Circle 056 on reader information card or go to www.thru.to/webcoooect M e t a l Finishing
AND APPARATUS
OPENINGS
AND
FOR ACTIVATING
FOR JETS PLATING
U.S. 2004084318 Cohen, U. Ultrasonic or megasonic enhanced electroplating for via filling, etc., also using high pressure electrolyte jets to allow electrodeposition into cavities, etc. COPPER
INTERCONNECT
IMMERSION/ELECTROLESS DAMASCENE
BY PLATING
IN DUAL
PROCESS
US. 2004084320 (Xerox Corp.) Wong, K.H.
BRIGHTENER
Fabrication of copper interconnect for integrated circuits by means of copper electroplating. In the conventional method, critical steps such as deposition of copper seed layer and chemical mechanical polishing (CMP) are required. However, in this technique, both the seed layer deposition and CMP are not required. PRINTED
WIRING
MAKING
THEM
BOARDS
AND
graphite) having a m e a n particle size no greater than about 50pro, combined with an organic binding agent, is coated on the conditioned surface to form an electrically conductive carbon coating. The conductive carbon coating is then optionally fixed on the (formerly) nonconductive surface and dried. The resulting coating has a low electrical resistance and is tenacious enough to be plated and exposed to molten solder without creating voids or losing adhesion, yet is easily removable from copper surfaces of the substrate by microetching.
METHODS
FOR
CYANIDE
ADDITIVE
-FREE ZINC
AND
BATH FOR ALKALINE
ELECTROPLATING
U.S. 2004084322 (Columbia Chemical Corp.) Rosenberg, W.E.; Ludwig, R.J. An aqueous alkaline non-cyanide zinc electroplating bath containing zinc ions for producing bright electrodeposits of zinc and a brightening agent comprising a polymeric quaternary amine and a reducing sugar, and a compound that forms a reducing sugar upon hydrolysis.
US. 2004084321 Thorn, C.E.; Polakovic, F.;. et al.
CMP
Metallizing method by applying a conductive carbon coating to a non-conductive surface and a printed circuit board having through holes or other nonconductive surfaces treated with such carbon coatings. A conditioning agent is applied to the non-conductive surface to form a conditioned surface. A liquid dispersion of electrically conductive carbon (such as
U.S. 2004084415 (Taiwan Semiconductor Mfg.) Cheng, Y.; Liu, C.W.; et al.
PROCESS
OR SLURRY
LEAVING
NO RESIDUAL
OXIDE
LAYER
PARTICLES
Two problems seen in conventional CMP are a tendency for slurry particles to remain on the surface and the formation of a final layer of oxide. These problems have been solved by adding to the slurry a quantity of TMAH or TBAH. This has the effect of HES TM High Efficiency System
• Rapid adsorption/filtration of soluble and insoluble metals a n d organics • C l e a n dust free and e a s y t o u s e • Improves plating quality and consistency
Your Source for Wastewater Treatment & RecoveryTechnologies • Conventional Precipitation Separation a Microfiltration & Ultrafiltration
• Eliminateslossesfromdraftscreatedby overhead ventilation,coolingfans,opendoorsetc. • Eliminatesthe needfor an operatorto stand overthe degreaser, , Freestandingwhen machine is removed for service.
* Can be field mountedto existingequipment. . Manual load and unload station. • NESHAP Compliant
Design.
• High hydraulic permeability improves flowrate a n d extends bath service life
• Filter Presses 2-200 cu ft. conventional & membrane
Call 800-249-1990for a FREEECO$ORBSample!
• Clarifiers - complete systems & components New & Used
Graver
58
approved solvents.
• Primaryand ColdTrape Refrigerationprovided by onecompressor*. • ReducesSolvent Consumption
• IntegralSafetyControls . IntegralContainmentPan . Finishedin attractivestainless
*Patent #5,894,881 *Patent #5,865,198
enclosure and provided with wheels for installation ease,
Technotogies
200 Lake Drive, Glasgow, DE 19702-3319 Tel.: 302-731-1700 800-249-]990 Fax: 302-731-1707 Website: www.gravedech.eom
• Accepts all currently
P.O. Box 622 • Pottstown, PA 19464 Phone: 610-326-4771 • Fax: 610-705-1861
~istributors Wonte¢
www.jtequip.com
Circle 019 on reader information card or go to www.thru.to/webconnect
Circle 024 on reader information card or go to www.thru.to/webconnect
tJl¢ll
Ultra-Kool, Inc. PH (610) 367-2019 FAX (610) 367-8396
Website: www.ultra-kool,com Emaih info@ultra-kooLcorn
Circle 056 on reader information card or go to www.thru.to/webcoooect M e t a l Finishing