M E T H O D OF C O A T I N G A L U M I N U M
THE C O A T I N G OF S U R F A C E S
AND ALUMINUM
A L L O Y S U B S T R A T E S A N D COATED A R T I C L E S
US. 6679952 (Nippon Paint Co Ltd) Oguri, T; Sato, T et al. A method of coating aluminum and aluminum alloy substrates not only imparts a corrosion resistance comparable or even superior to that afforded by chromate treatment but also improved the adhesion to the coating film, while the luster of aluminum is fully retained, notwithstanding the use of a chromium-free treating solution, resulting in an improved coated article with the coated surface having a metallic luster. The method comprises treating an aluminum or aluminum alloy substrate with an acidic solution containing sulfuric acid and 0.2 to 0.4 g/L of a ferric ion and having a pH value of 0.6 to 2.0, subjecting the same to chemical conversion treatment with an acidic coat-forming agent containing 0.01 to 0.125 g/L of a zirconium or titanium ion, 0.01 to 1.0 g/L of a phosphate ion, and 0.01 to 0.5 g/L fluoride ion and having a pH value of 1.5 to 4.0, followed by coating.
US. 6680085 (Grillo Werke AG) Kley, D. Thermal spraying, especially of metals, for the coating of surfaces, wherein the material employed for coating is supplied in the form of a wire, molten and sprayed, uses a plasma arc. A P P A R A T U S A N D M E T H O D FOR D E P O S I T I N G LARGE A R E A C O A T I N G S O N N O N - P L A N A R SURFACES
US. 6681716 (Gen. Electric) Schaepkens, M. Multiple plasma source with inert and reactant gases and automatic compensation for changes in local changes in distance between source and work surface. SEED REPAIR A N D ELECTROPLATING B A T H
US. 6682642 (Shipley Co LLC) Calvert, J.M.; Mikkola, R.A. Compositions useful for repair and e]ectroplating of seed layers & methods of repairing and electroplating such seed layers.
METHOD OF ELECTRODEPOSlTING COPPER
US. 6679983 (Shipley Co LLC) Calvert, J.M.; Morrissey, D. et al. Electrolytes for copper electroplating that provide enhanced fill of small features with less overplate & methods of plating substrates, such as electronic devices, using such electrolytes. M E T H O D A N D DEVICE FOR T H E R M A L S P R A Y I N G FOR
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PROCESS FOR P R O D U C I N G A L U M I N U M
US. 6682645 (Fuji Photo Film Co. Ltd) Nishino, A.; Uesugi, A. et al. In a process for producing an aluminum support of a lithographic printing plate, the desired aluminum support is produced by imparting fine asperities to an aluminum plate and then roughening it electro-
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chemically in an acidic aqueous solution. The roughened a l u m i n u m plate m a y be electropolished or chemically etched.
stronger bond b e t w e e n the particle base and the metal even at elevated temperature and exhibits a high and stable conductivity and heat resistance.
INDUCTIVE P L A S M A LOOP E N H A N C I N G M A G N E T R O N SPUTTERING
A P P A R A T U S FOR ELECTROPOLISHING A STENT
U.S. 6679981 (Applied Materials Inc.) Hanawa, H.; Pan, S.X. et al. P l a s m a reaction chamber such as DC m a g n e t r o n sputter reactor. METHOD FOR RECOVERY OF GOLD A N D SILVER
U.S. 6679984 (Summit Valley Equipment & Eng
(u.s.) Weldon, TA.; Gale, G.C.O. Stripper solution to remove gold or silver from activated carbon columns. PROTECTIVE C O M P O S I T I O N FOR PRESSURE WASHER A N D APPLICATOR
U.S. 6680001 Krueger, D.J. A composition for lubricating, preventing mineral deposit buildup, and expelling any standing water from the internal parts of a pressure washer, as well as a pressurized container for applying such composition across the internal parts of the pressure washer through the water inlet valve is provided.
U.S. 6679980 (Advanced Cardiovascular System) Andreacchi, A. Apparatus and a process for electropolishing a product or metallic device made from a metal alloy. The electropolishing a p p a r a t u s includes a cathode formed of a tubular member and an anode formed by the metallic device to be electropolished. Both the t u b u l a r m e m b e r and the metallic device are positioned within an electrolytic solution and current is passed through the anode to effect the electropolishing process. The invention is useful for electropolishing metal stents formed of metallic alloys, such as cobalt-chromium-tungsten, in which the stent is positioned within the tubular member and immersed in an electrolytic solution for a predetermined time. The electropolishing process using the apparatus of the invention provides an u l t r a s m o o t h and shiny metallic surface on the metallic device for metal stents. TUBULAR ELECTRODIALYSlS A N U ELECTRODEPOSITION M E M B R A N E ELECTRODE DEVICE
EP 1377361 (Olpiduerr SPA) Weschke, J.; Pizzamiglio, R.
ELECTRICALLY CONDUCTIVE POWDER A N D M A K I N G PROCESS
U.S. 6680081 (Shinetsu Chemical Co.) Aramata, M.; Fukushima, M. A conductive powder having an organic silicon polymer layer on the surface of each particle and a metal layer enclosing the silicon polymer layer possesses a
A P P A R A T U S A N D METHOD FOR R E M O V I N G HYDROGEN PEROXIDE FROM SPENT PICKLE LIQUOR
EP 1377523 (Properties Inc AK) Leeker, J.W.; Madi, V.N. Process for the removal of hydrogen peroxide from spent pickle liquor used in a steel strip pickling
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Metal Finishing