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R&M 2000—coequality between R&M, cost, performance, and schedule
832
World Abstracts on Microelectronics and Reliability
and NCM. The bounds can be calculated before any Monte Carlo trials. The K L M requires at least 8 times more trials than the NCM. Given sufficient computer memory to implement an alias sampling method, the NCM requires less computation time than the K L M when an accurate estimate is required. The NCM is more favorable when the deterministic bounding practice based on the first and second sums of products yields a smaller relative error. The NCM is consistent with the fact that deterministic bounds have been computed.
R&M 2000--coequality between R&M, cost, performance, and schedule. ROBERT A. JAQUESS.IEEE Trans. Reliab. R-36, 331 (1987). The US Air Force R&M 2000 Action Plan makes R&M equal to technical performance and schedule in source selection, proposal evaluation and contract performance. This paper discusses that coequality. R&M 2000 provides an opportunity for the practitioners to achieve a new high water mark in technology by institutionalizing the objectives toward a common cause. 'Double-R/half-M', a reasonable design objective? CARL M. BIRD. IEEE Trans. Reliab. R-36, 321 (1987). The US Air Force has adopted a policy that next-generation equipment must have "double the reliability and half the maintenance" when compared to like systems currently deployed. A case history of the use of available R&M improvement techniques, and the incorporation of available new technologies, shows that this policy is reasonable and achievable. A test to identify the uniform distribution, with applications to probability plotting and other distributions. SMILEYW. CHENG and F. A. SPIRING. IEEE Trans. Reliab. R-36, 98 (1987). A test and its empirical distribution (n > 4) has been developed to examine whether a set of sample results arise from a population which possesses a uniform distribution. The test statistic is easy to calculate and lends itself nicely to
probability-plot analyses. The test statistic applies the concept of the Shapiro-Wilk W-test to the uniform distribution. The result allows one to examine distributional assumptions regarding any continuous distribution and thus provides practitioners, currently using traditional ChiSquare techniques, with a less subjective testing procedure.
Closed formulas for the failure probability of a strictconsecutive- k- out- of- n:F system. ANDREAS N. PHILIPPOU and FROSSOS. MAKRL IEEE Trans. Reliab. R-36, 80 (1987). A consecutive-k-out-of-n:F system is strict if it operates in such a way that isolated failure strings of length less than k (which do not cause system failure) do not occur, or are immediately corrected. This paper gives closed formulas for the failure probability of a strict-consecutive-k-out-of-n:F system. The Navy's best practices approach to reliability and quality. W. J. WILLOUGHBYJR. IEEE Trans. Reliab. R-36, 310 (1987). For the first time in recent history, the US Army, Navy, and Air Force are in fundamental agreement on the priority of reliability in their weapon system requirements. Even more significant is mutual recognition that reliability is achieved not by setting numerical requirements and testing for compliance, but by focusing on the fundamentals of design and manufacturing; and that quality is achieved not by counting defects but by eliminating their causes. These lessons, long in coming to the Department of Defense and its contractors, are now beginning to be implemented in the acquisition or upgrading of most weapon systems. A major impetus to implementation was the 1982-83 work of the Defense Science Board Task Force on the Transition from Development to Production, which led to DoD Directive 4245.7, its companion DoD Manual 4245.7-M, and Department of Defense Advocacy. Each service is taking a somewhat different approach to the implementation of these similar new initiatives. The purpose of this paper is to outline the Navy's approach, for comparison with the initiatives of the other services.
4. M I C R O E L E C T R O N I C S - - G E N E R A L
Comparison of wafer scale integration with VLSI packaging approaches. CONSTANTINE A. NEUGEBAUERand RICHARD O. CARLSON. IEEE Trans. Compon. Hybrids mfg Technol. CHMT-10, 184 (1987). A comparison is made of various high-density packaging approaches, including printed wiring board, thick-film hybrids, and wafer scale integration (WSI). Criteria include power dissipation, density, delays, and cost.
5. M I C R O E L E C T R O N I C S - - D E S I G N
Electrical performances of devices made in SiO films obtained by lamp ZMR. MICHAEL HAOND, DuY-PHACH VU, AGUST1N MONROY AGUIRRE and SYLVIANE PERRET. IEEE Circuits Devices Mag., 27 (July 1987). Four-inch wafer lots have been processed in a conventional CMOS polysilicon gate process. The electrical parameters are used to study the influence of the problems related to the lamp zone-ineltingrecrystallization technique. Statistical results are available. The n-channel enhancement mode transistors of a 1.7 gm effective channel length exhibit a sharp threshold voltage distribution around 0.9V with a standard deviation of 61mV. The leakage current remains below a 0.1-pA/gm channel width for both p- and n-channel transistors. Two hundred forty-nine stage ring oscillators have been fabricated. They have a 0.5-nsec propagation delay time for an effective channel length of 1.7 I.tm.
It is concluded that thin-film hybrids using state-of-the-art VLSI chips have the potential for WSI density and performance. The requirement for fault tolerance, additional levels of metallization, excess power dissipation, process conservatism to achieve finite yield, and the nonoptimum nature of the A1/SiO2 transmission line for cross wafer communication have made WSI noncompetitive.
AND CONSTRUCTION
Advantages of a floating annular ring in three-layer tab assembly. STEVEN T. HOLZINGER and BRETT SHARENOW. IEEE Trans. Compon. Hybrids mfq Technol. CHMT-10, 332 (1987). A mechanically formed unsupported annular ring in three-layer tape automated bonding (TAB) material offers a number of advantages to the user. Leads are stabilized in x, y, and z axes so as to be in precise alignment for inner lead bonding to integrated circuits. Narrower leads may be designed, increasing packaging density, because they do not have to be self-supporting. Longer cantilever lengths can be used than when a supporting ring is absent. The adhesive holding the leads to the support ring acts as a secondary dielectric, providing high moisture resistance and excellent electrical properties. The adhesive is chemically resistant to processing solutions and, as a thermoset, resists any reflow during soldering or thermode bonding. The floating annular
World Abstracts on Microelectronics and Reliability
and NCM. The bounds can be calculated before any Monte Carlo trials. The K L M requires at least 8 times more trials than the NCM. Given sufficient computer memory to implement an alias sampling method, the NCM requires less computation time than the K L M when an accurate estimate is required. The NCM is more favorable when the deterministic bounding practice based on the first and second sums of products yields a smaller relative error. The NCM is consistent with the fact that deterministic bounds have been computed.
R&M 2000--coequality between R&M, cost, performance, and schedule. ROBERT A. JAQUESS.IEEE Trans. Reliab. R-36, 331 (1987). The US Air Force R&M 2000 Action Plan makes R&M equal to technical performance and schedule in source selection, proposal evaluation and contract performance. This paper discusses that coequality. R&M 2000 provides an opportunity for the practitioners to achieve a new high water mark in technology by institutionalizing the objectives toward a common cause. 'Double-R/half-M', a reasonable design objective? CARL M. BIRD. IEEE Trans. Reliab. R-36, 321 (1987). The US Air Force has adopted a policy that next-generation equipment must have "double the reliability and half the maintenance" when compared to like systems currently deployed. A case history of the use of available R&M improvement techniques, and the incorporation of available new technologies, shows that this policy is reasonable and achievable. A test to identify the uniform distribution, with applications to probability plotting and other distributions. SMILEYW. CHENG and F. A. SPIRING. IEEE Trans. Reliab. R-36, 98 (1987). A test and its empirical distribution (n > 4) has been developed to examine whether a set of sample results arise from a population which possesses a uniform distribution. The test statistic is easy to calculate and lends itself nicely to
probability-plot analyses. The test statistic applies the concept of the Shapiro-Wilk W-test to the uniform distribution. The result allows one to examine distributional assumptions regarding any continuous distribution and thus provides practitioners, currently using traditional ChiSquare techniques, with a less subjective testing procedure.
Closed formulas for the failure probability of a strictconsecutive- k- out- of- n:F system. ANDREAS N. PHILIPPOU and FROSSOS. MAKRL IEEE Trans. Reliab. R-36, 80 (1987). A consecutive-k-out-of-n:F system is strict if it operates in such a way that isolated failure strings of length less than k (which do not cause system failure) do not occur, or are immediately corrected. This paper gives closed formulas for the failure probability of a strict-consecutive-k-out-of-n:F system. The Navy's best practices approach to reliability and quality. W. J. WILLOUGHBYJR. IEEE Trans. Reliab. R-36, 310 (1987). For the first time in recent history, the US Army, Navy, and Air Force are in fundamental agreement on the priority of reliability in their weapon system requirements. Even more significant is mutual recognition that reliability is achieved not by setting numerical requirements and testing for compliance, but by focusing on the fundamentals of design and manufacturing; and that quality is achieved not by counting defects but by eliminating their causes. These lessons, long in coming to the Department of Defense and its contractors, are now beginning to be implemented in the acquisition or upgrading of most weapon systems. A major impetus to implementation was the 1982-83 work of the Defense Science Board Task Force on the Transition from Development to Production, which led to DoD Directive 4245.7, its companion DoD Manual 4245.7-M, and Department of Defense Advocacy. Each service is taking a somewhat different approach to the implementation of these similar new initiatives. The purpose of this paper is to outline the Navy's approach, for comparison with the initiatives of the other services.
4. M I C R O E L E C T R O N I C S - - G E N E R A L
Comparison of wafer scale integration with VLSI packaging approaches. CONSTANTINE A. NEUGEBAUERand RICHARD O. CARLSON. IEEE Trans. Compon. Hybrids mfg Technol. CHMT-10, 184 (1987). A comparison is made of various high-density packaging approaches, including printed wiring board, thick-film hybrids, and wafer scale integration (WSI). Criteria include power dissipation, density, delays, and cost.
5. M I C R O E L E C T R O N I C S - - D E S I G N
Electrical performances of devices made in SiO films obtained by lamp ZMR. MICHAEL HAOND, DuY-PHACH VU, AGUST1N MONROY AGUIRRE and SYLVIANE PERRET. IEEE Circuits Devices Mag., 27 (July 1987). Four-inch wafer lots have been processed in a conventional CMOS polysilicon gate process. The electrical parameters are used to study the influence of the problems related to the lamp zone-ineltingrecrystallization technique. Statistical results are available. The n-channel enhancement mode transistors of a 1.7 gm effective channel length exhibit a sharp threshold voltage distribution around 0.9V with a standard deviation of 61mV. The leakage current remains below a 0.1-pA/gm channel width for both p- and n-channel transistors. Two hundred forty-nine stage ring oscillators have been fabricated. They have a 0.5-nsec propagation delay time for an effective channel length of 1.7 I.tm.
It is concluded that thin-film hybrids using state-of-the-art VLSI chips have the potential for WSI density and performance. The requirement for fault tolerance, additional levels of metallization, excess power dissipation, process conservatism to achieve finite yield, and the nonoptimum nature of the A1/SiO2 transmission line for cross wafer communication have made WSI noncompetitive.
AND CONSTRUCTION
Advantages of a floating annular ring in three-layer tab assembly. STEVEN T. HOLZINGER and BRETT SHARENOW. IEEE Trans. Compon. Hybrids mfq Technol. CHMT-10, 332 (1987). A mechanically formed unsupported annular ring in three-layer tape automated bonding (TAB) material offers a number of advantages to the user. Leads are stabilized in x, y, and z axes so as to be in precise alignment for inner lead bonding to integrated circuits. Narrower leads may be designed, increasing packaging density, because they do not have to be self-supporting. Longer cantilever lengths can be used than when a supporting ring is absent. The adhesive holding the leads to the support ring acts as a secondary dielectric, providing high moisture resistance and excellent electrical properties. The adhesive is chemically resistant to processing solutions and, as a thermoset, resists any reflow during soldering or thermode bonding. The floating annular