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Reliability growth: a survey
Microelectron. Reliab., Vol, 21, No, 4. pp. 609-622, 1981. Pergamon Press Ltd. Printed in Great Britain.
0026-2714/81/040609-14502.00/0
WORLD ABSTRACTS ON MICROELECTRONICS AND RELIABILITY The abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the article. They are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections.
Subjects 1. 2. 3. 4. 5. 6. 7. 8. 9.
Reliability--General. Reliability of Components, Tubes, Transistors and ICs. Circuit and Systems Reliability, Maintenance and Redundancy. Microelect ronics--General. Microelectronics-- Design and Construction. Microelectronics--Components, Systems and Equipments. Semiconductor Integrated Circuits, Devices and Materials. Thick- and Thin-Film Components, Hybrid Circuits and Materials. Electron, Ion and Laser Beams.
1. RELIABILITY--GENERAL Reliability growth: a survey. BALBIR S. DHILLON. Microelectron. Reliab. 20, 743 (1980). This paper surveys the research which has been in the area of reliability growth. An extensive list of references is presented. On human reliability--bibliography. BALBIR S. DHILLON. Microelectron. Reliab. 20, 371 (1980). This review article presents a brief introduction and an up-to-date list of selective bibliography on h u m a n reliability.
Principles of screening and cost effective product assurance. C. M. RYERSON. Mieroelectron. Reliab. 20, 693 (1980). From the introduction of the term as an industrial rigor many years ago, the purpose of Product Assurance has been to provide visibility of manufacturing status and trends as an aid to management in "doing it right as soon as possible", if not the first time. Forty years of experience by the author in analyzing the reasons for success or failure of specific program controls and approaches has resulted in a mass of well established principles and techniques. This report represents an extension of a long series of efforts to identify and come to grips with the factors basic to the achievement of m a x i m u m reliability in manufactured products. This is believed to be a vital link in putting visibility and understanding on the basic principles of screening and cost effective product assurance.
Electronics reliability: a state-of-the-art survey. HENRY S. BLANKS. Microelectron. Reliab. 20, 219 (1980). This paper gives an overview, as seen at the end of 1979, of the state-ofthe-art of reliability physics of electronic components, reliability screening and testing of components and higher levels of assembly, simple M T B F prediction based on component failure rate data, and the modelling and interpretation of "reliability growth" programs.
Reliability assurance and the growing complexity of electronic devices. R. LOMBARDINI. Proc. C N E T Conference on Reli-
ability and Maintainability, Tregastel, France, p. 195 (8-12 September 1980). The introduction and the use of LSI and VLSI-IC's have been a challenge for the traditional reliability engineer. In fact, while on the one hand the use of complex IC's can help to improve system reliability, especially where a classical circuit, once realized with hundreds of components, is replaced by a few LSI or VLSI-IC's, the introduction of microprocessors has on the other hand brought software into the designer's area and thus intensified the influence of software on the system's reliability. Furthermore, LSI and VLSI-IC's shown a high percentage of defectives and early failures. Therefore, testing and screening the complex components should be the first step to achieve high system reliability. But testing and screening LSI and VLSI can be a real problem for a small or medium size company which cannot afford an own highly sophisticated test center and the related personnel. Solutions to these problems may depend very heavily on the size of the production (large or small volume production).
Human performance reliability modelling for time-continuous type tasks. A. RAOUE, g. S. LASHKARIand M. A. RAHIM. Proc. CNET Conference on Reliability and Maintainabilio,, Tregastel, France, p. 88 (8-12 September 1980). H u m a n performance reliability functions for time-continuous type of tasks are modelled from generated data on operator's error in performing a given task executed in time interval (to, t), subject to the stress constraints inherent in the nature of the task. Two types of operator's errors namely, Type e t and Type e 2 are considered. Type e I error indicates that the operator did not detect the failed event at the due time tl, but detected it at a later time t2, while Type e 2 error indicates that the operator by anticipation pointed to the failed event at an earlier time t o whereas the actual event occurred at time t~. In order to assess h u m a n reliability for such continuous type of tasks, a three state Markovian model is developed. Numerical example is given for illustrating the application of the model.
2. RELIABILITY OF COMPONENTS, TUBES, TRANSISTORS AND ICs New resin molded tantalum capacitors designed fur severe environment. KOlCHI SHIRAI, TAKEHIKO NAKATA, KOICHI MORIMOTO, YOSHINOBU KAWAKAMI and YOSHIHIKO SAIKI. 609
NEC Research and Development, No. 59, p. 28 (October 1980). In recent years, solid tantalum electrolytic capacitors coated with resin have become prevalent. The authors have
0026-2714/81/040609-14502.00/0
WORLD ABSTRACTS ON MICROELECTRONICS AND RELIABILITY The abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the article. They are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections.
Subjects 1. 2. 3. 4. 5. 6. 7. 8. 9.
Reliability--General. Reliability of Components, Tubes, Transistors and ICs. Circuit and Systems Reliability, Maintenance and Redundancy. Microelect ronics--General. Microelectronics-- Design and Construction. Microelectronics--Components, Systems and Equipments. Semiconductor Integrated Circuits, Devices and Materials. Thick- and Thin-Film Components, Hybrid Circuits and Materials. Electron, Ion and Laser Beams.
1. RELIABILITY--GENERAL Reliability growth: a survey. BALBIR S. DHILLON. Microelectron. Reliab. 20, 743 (1980). This paper surveys the research which has been in the area of reliability growth. An extensive list of references is presented. On human reliability--bibliography. BALBIR S. DHILLON. Microelectron. Reliab. 20, 371 (1980). This review article presents a brief introduction and an up-to-date list of selective bibliography on h u m a n reliability.
Principles of screening and cost effective product assurance. C. M. RYERSON. Mieroelectron. Reliab. 20, 693 (1980). From the introduction of the term as an industrial rigor many years ago, the purpose of Product Assurance has been to provide visibility of manufacturing status and trends as an aid to management in "doing it right as soon as possible", if not the first time. Forty years of experience by the author in analyzing the reasons for success or failure of specific program controls and approaches has resulted in a mass of well established principles and techniques. This report represents an extension of a long series of efforts to identify and come to grips with the factors basic to the achievement of m a x i m u m reliability in manufactured products. This is believed to be a vital link in putting visibility and understanding on the basic principles of screening and cost effective product assurance.
Electronics reliability: a state-of-the-art survey. HENRY S. BLANKS. Microelectron. Reliab. 20, 219 (1980). This paper gives an overview, as seen at the end of 1979, of the state-ofthe-art of reliability physics of electronic components, reliability screening and testing of components and higher levels of assembly, simple M T B F prediction based on component failure rate data, and the modelling and interpretation of "reliability growth" programs.
Reliability assurance and the growing complexity of electronic devices. R. LOMBARDINI. Proc. C N E T Conference on Reli-
ability and Maintainability, Tregastel, France, p. 195 (8-12 September 1980). The introduction and the use of LSI and VLSI-IC's have been a challenge for the traditional reliability engineer. In fact, while on the one hand the use of complex IC's can help to improve system reliability, especially where a classical circuit, once realized with hundreds of components, is replaced by a few LSI or VLSI-IC's, the introduction of microprocessors has on the other hand brought software into the designer's area and thus intensified the influence of software on the system's reliability. Furthermore, LSI and VLSI-IC's shown a high percentage of defectives and early failures. Therefore, testing and screening the complex components should be the first step to achieve high system reliability. But testing and screening LSI and VLSI can be a real problem for a small or medium size company which cannot afford an own highly sophisticated test center and the related personnel. Solutions to these problems may depend very heavily on the size of the production (large or small volume production).
Human performance reliability modelling for time-continuous type tasks. A. RAOUE, g. S. LASHKARIand M. A. RAHIM. Proc. CNET Conference on Reliability and Maintainabilio,, Tregastel, France, p. 88 (8-12 September 1980). H u m a n performance reliability functions for time-continuous type of tasks are modelled from generated data on operator's error in performing a given task executed in time interval (to, t), subject to the stress constraints inherent in the nature of the task. Two types of operator's errors namely, Type e t and Type e 2 are considered. Type e I error indicates that the operator did not detect the failed event at the due time tl, but detected it at a later time t2, while Type e 2 error indicates that the operator by anticipation pointed to the failed event at an earlier time t o whereas the actual event occurred at time t~. In order to assess h u m a n reliability for such continuous type of tasks, a three state Markovian model is developed. Numerical example is given for illustrating the application of the model.
2. RELIABILITY OF COMPONENTS, TUBES, TRANSISTORS AND ICs New resin molded tantalum capacitors designed fur severe environment. KOlCHI SHIRAI, TAKEHIKO NAKATA, KOICHI MORIMOTO, YOSHINOBU KAWAKAMI and YOSHIHIKO SAIKI. 609
NEC Research and Development, No. 59, p. 28 (October 1980). In recent years, solid tantalum electrolytic capacitors coated with resin have become prevalent. The authors have