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Reliability study of aluminum electrolytic capacitors for space use
World abstracts on microelectronics and reliability the resistance change of lap shear (60% Sn-40% Pb) solder joints as a function of fatigue. The expected dependence of electrical resistance on elastic strain, plastic deformation and cyclic fatigue is reviewed. An analytical framework is developed to examine the observed electrical resistance change. A technique called resistance spectroscopy was used to measure the small resistance change resulting from the strain and fatigue in the presence of much larger resistance changes resulting from temperature and other fluctuations. The level of the noise in the resistance measuring system used for the lap shear joints was less than 1 nfL The lap shear solder joints exhibited a systematic resistance change as the specimens were cycled toward failure. Initially the average resistance increased, followed by a much stronger decrease, and lastly increased markedly as crack propagation began. The decreasing-resistance portion of this signature occurs prior to crack initiation, and can be used to detect incipient solder joint failure more quickly and with greater ease than present techniques.
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications. SUN MAN TAM. IEEE Transactions on Reliability, 44(1), 8 (March 1995). For the past decade, overall reliability improvement and product availability have enabled plasticencapsulated microcircuits (PEM) to move from consumer electronics beyond the relatively large and reliability-conscious (due to harsh usage environments) automotive market, into the military market. Based on the analysis of the worst-case PEM scenario for military applications, demonstrating the moisture reliability under long-term (20 years) dormant storage environments has become the last hurdle for PEM. Recent studies have demonstrated that PEM can meet the typical missile environments in long-term storage. To further validate PEM reliability in missile applications, Texas Instruments (TI) recently conducted three separate studies involved 6 years of PEM moisture-life monitoring and assessment, testing of the standard PEM electrical characteristics under the military temperature ranges ( - 55°C to + 125°C), and assessing their robustness in moisture environments after the assembly processes. These TI studies support the use of PEM in missile (or similar) applications. However, "not all parts (PEM as well as hermetic packaged devices) are created equal." Effective focus on part and supplier selection, supplier teaming, and process monitoring is necessary to maintain the PEM reliability over the required environments at the lowest cost. This paper assesses PEM reliability for a selected missile storage environment using the industry-standard moisture testing, such as biased HAST or 85°C/85~ r.h. (relative humidity), for demonstrating the PEM noise survivability. The moisture, reliability (MTTF) or average moisture lifetime of PEM is assessed to correlate PEM capability to anticipated field-performance environments. P~ 36:4-F
535
Reliability test on chip type of high capacitance multilayer ceramic capacitors. KENJI MURATA and TOSHIMI KAWAKAMI. Proceedings of the 24th Symposium on Reliability and Maintainability, Tokyo, Japan, 19 (6-8 July 1994). Reliability testing on new ceramic capacitors of four 6.8 ~F products and three 10 ~tF products from four makers was done as a stand point of a user for a decoupling application in circuit boards instead of tantalum capacitors. A superior reliability data was obtained, and an influence of different inner electrode materials and dielectric materials on reliability is discussed.
High
reliability
internal
capacitor
of
LTCC.
YASUYUKI BABA, HORISHI OCHI and SHIGETOSHI SEGAWA. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18(1), 170 (March 1995). This paper discusses the internal capacitor of LTCC. It includes the material study, manufacturing process, electronic properties, and reliability of the internal capacitor. After this study, a highly reliable internal capacitor is developed and this result makes this technology closer to real application.
Reliability study of aluminum electrolytic capacitors for space use. M U N E A K I NAKAI et al., Proceedings of the 24th Symposium on Reliability and Maintainability, Tokyo, Japan, 17 (6-8 July 1994). Reliability of aluminum electrolytic capacitor for space use sealed with polytetrafluoroethylene (PTFE) is investigated. Evolved gas pressure of the capacitor during electrical bias is estimated and reliability under simulated space environmental thermal stress is studied. Failure behavior of the capacitor under electrical overstress is also studied comparing with that of wet tantalum electrolytic capacitor.
Performance and reliability of optical fibre connectors in the outside plant environment. ARUN K. AGARWAL and LYNN D. HUTCHESON. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, 18(2), 221 (May 1995). Telecommunication (telco) systems for telephony, video and other broadband services will use a large number of fiber optic connectors and many of these connectors may be deployed in the outside plant (OSP). To meet telco plant expectations, these connectors must maintain their performance for at least 15-20 years. Are the available fiber optic connector designs capable of meeting these requirements? Is there a concern about connector performance or reliability? To answer these questions and develop some understanding of the behavior of fiber optic connectors in the OSP environment, SC type connectors from four manufacturers were evaluated by subjecting them to a sequence of tests simulating OSP conditions. This paper presents the results of the environmental tests.
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications. SUN MAN TAM. IEEE Transactions on Reliability, 44(1), 8 (March 1995). For the past decade, overall reliability improvement and product availability have enabled plasticencapsulated microcircuits (PEM) to move from consumer electronics beyond the relatively large and reliability-conscious (due to harsh usage environments) automotive market, into the military market. Based on the analysis of the worst-case PEM scenario for military applications, demonstrating the moisture reliability under long-term (20 years) dormant storage environments has become the last hurdle for PEM. Recent studies have demonstrated that PEM can meet the typical missile environments in long-term storage. To further validate PEM reliability in missile applications, Texas Instruments (TI) recently conducted three separate studies involved 6 years of PEM moisture-life monitoring and assessment, testing of the standard PEM electrical characteristics under the military temperature ranges ( - 55°C to + 125°C), and assessing their robustness in moisture environments after the assembly processes. These TI studies support the use of PEM in missile (or similar) applications. However, "not all parts (PEM as well as hermetic packaged devices) are created equal." Effective focus on part and supplier selection, supplier teaming, and process monitoring is necessary to maintain the PEM reliability over the required environments at the lowest cost. This paper assesses PEM reliability for a selected missile storage environment using the industry-standard moisture testing, such as biased HAST or 85°C/85~ r.h. (relative humidity), for demonstrating the PEM noise survivability. The moisture, reliability (MTTF) or average moisture lifetime of PEM is assessed to correlate PEM capability to anticipated field-performance environments. P~ 36:4-F
535
Reliability test on chip type of high capacitance multilayer ceramic capacitors. KENJI MURATA and TOSHIMI KAWAKAMI. Proceedings of the 24th Symposium on Reliability and Maintainability, Tokyo, Japan, 19 (6-8 July 1994). Reliability testing on new ceramic capacitors of four 6.8 ~F products and three 10 ~tF products from four makers was done as a stand point of a user for a decoupling application in circuit boards instead of tantalum capacitors. A superior reliability data was obtained, and an influence of different inner electrode materials and dielectric materials on reliability is discussed.
High
reliability
internal
capacitor
of
LTCC.
YASUYUKI BABA, HORISHI OCHI and SHIGETOSHI SEGAWA. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18(1), 170 (March 1995). This paper discusses the internal capacitor of LTCC. It includes the material study, manufacturing process, electronic properties, and reliability of the internal capacitor. After this study, a highly reliable internal capacitor is developed and this result makes this technology closer to real application.
Reliability study of aluminum electrolytic capacitors for space use. M U N E A K I NAKAI et al., Proceedings of the 24th Symposium on Reliability and Maintainability, Tokyo, Japan, 17 (6-8 July 1994). Reliability of aluminum electrolytic capacitor for space use sealed with polytetrafluoroethylene (PTFE) is investigated. Evolved gas pressure of the capacitor during electrical bias is estimated and reliability under simulated space environmental thermal stress is studied. Failure behavior of the capacitor under electrical overstress is also studied comparing with that of wet tantalum electrolytic capacitor.
Performance and reliability of optical fibre connectors in the outside plant environment. ARUN K. AGARWAL and LYNN D. HUTCHESON. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, 18(2), 221 (May 1995). Telecommunication (telco) systems for telephony, video and other broadband services will use a large number of fiber optic connectors and many of these connectors may be deployed in the outside plant (OSP). To meet telco plant expectations, these connectors must maintain their performance for at least 15-20 years. Are the available fiber optic connector designs capable of meeting these requirements? Is there a concern about connector performance or reliability? To answer these questions and develop some understanding of the behavior of fiber optic connectors in the OSP environment, SC type connectors from four manufacturers were evaluated by subjecting them to a sequence of tests simulating OSP conditions. This paper presents the results of the environmental tests.