SCM anti bu deal boost for copper use

SCM anti bu deal boost for copper use

news SCM anti bug deal boost for copper use NORTH Carolina-based copper powder producer SCM Metal Products has formed a joint venture with Cupron hav...

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SCM anti bug deal boost for copper use NORTH Carolina-based copper powder producer SCM Metal Products has formed a joint venture with Cupron have formed a joint venture - Cupron Advanced Materials -- to manufacture products for antimicrobial applications. The newly formed company will be based at the SCM manufacturing site in its own segregated building. Under the joint venture agreement, SCM will supply Cupron Advanced Materials with cuprous oxide made from recycled copper. Cupron Advanced Materials will use the powder as a component in a wide range of antimicrobial products. Major markets served by this joint venture include the healthcare, medical, military and clothing industries. Terms of the transaction were not disclosed. “Our joint venture with Cupron furthers our longstanding commitment to grow our company through innovation and new product development,” said Barton White, SCM’s president. “We will be offering the public access to products that will improve their quality of life by protecting them from exposure to odour and stain-causing bacteria, fungi, mould, and microbes.” “We view this joint venture as a key to our strategic growth plan which builds on Cupron’s tradition of serving the public while protecting the environment,” said Cupron CEO Jeffrey Gabbay.

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MPR January 2008

“Copper’s antimicrobial properties have been known for more than five millennia. The ancient Egyptians used copper pipes to transport water to destroy parasites and other waterborne pathogens. Shipbuilders have used copper for thousands of years to keep algae from encrusting on the hulls of ships. French vintners have used a copper sulfate compound to fight fungus on grapevines for centuries, and this application makes it possible to use these powerful and wide-ranging antimicrobial properties in new ways.” The Cupron technology is based on the development of techniques to impregnate and to bond a copper oxide compound and other metallic compounds to a range of textile fibers. Cupron’s manufacturing technology permanently binds its proprietary copper compound to textile fibers, non-woven fabrics, paper, latex and other polymeric products. While highly sophisticated, implementation of this technology does not involve complicated or hazardous manufacturing methods. And best of all, testing indicates that the protection offered by Cupron-based products will last as long as the products themselves, regardless of multiple hot water washings, abrasion, or bleach, as long as fabric softener is not used.

Heaney to head CISP

DON HEANEY has been appointed the director of the Center for Innovative Sintered Products (CISP) at Pennsylvania State University. Dr Heaney has served as the Associate Director of CISP since 2000. His immediate goal for CISP is to engage the Board of Directors; develop strategic initiatives that will lead to increased industrial memberships; new sponsored research projects, collaborations and student support across the University; and create a long-term vision for CISP’s future. Dr Heaney is an associate professor of Engineering Science and Mechanics (ESM), has been a member of Penn State’s graduate faculty since 2000 and a member of the ESM faculty since 2006. His group conducts research in the areas of micro component fabrication, titanium powder metallurgy, metal/ceramic brazing, and organic selection for the net shape fabrication of powdered materials. While associate director of CISP, he was responsible for powder processing equipment acquisitions and member contract research. Don Heaney has published more than 50 refereed technical publications in the area of powder processing and is an expert in the area of metal injection moulding. He received his Professional Engineer License in Metallurgy in 2005. He teaches a senior level course on PM processing. He can be reached via e-mail at [email protected]

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