Small size mesa structures on Bi2Sr2CaCu2O8+δ single crystals

Small size mesa structures on Bi2Sr2CaCu2O8+δ single crystals

PHYSICA ELSEVIER Physica C 341-348 (2000) 1567-1568 www.elsevier.nl/locate/physc Small Size Mesa Structures on Bi2Sr2CaCu2Os+~ Single Crystals S. He...

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PHYSICA ELSEVIER

Physica C 341-348 (2000) 1567-1568 www.elsevier.nl/locate/physc

Small Size Mesa Structures on Bi2Sr2CaCu2Os+~ Single Crystals S. Heim a, A. Irie b, S. Schromm a, M. MSi31ea, S. Rother a, R. Kleiner a'e , and P. M/iller a aphysikalisches Institut III, Universitgt Erlangen-Niirnberg D-91058 Erlangen, Germany bDepartment of Electrical and Electronic Engineering, Utsunomiya University Utsunomiya 321, Japan ephysikalisches Institut, Lehrstuhl f/ir Experimentalphysik II, Universit/it T/ibingen Auf der Morgenstelle 14, D-72076 T/ibingen, Germany We patterned small size mesa structures on top of single crystals of the high temperature superconductor Bi2Sr2CaCu2Os+a using a combination of photolithography and electron beam lithography. The mesas consisted typically of 4-12 intrinsic Josephson junctions formed between adjacent CuO2 double layers. The smallest lateral mesa size was 1 pro. We discuss the electrical properties of these stacks including current-voltage characteristics and critical current vs. external magnetic fields applied parallel to the layers.

1. I n t r o d u c t i o n For intrinsic Josephson junctions (IJ J) formed between adjacent CuO2 double layers in the high temperature superconductor Bi2Sr2CaCu2Os+6(BSCCO) [1] the Josephson penetration length Aj is well below 0.5 #m [2]. To avoid the formation of Josephson vortices and to reach the limit of short IJJ the fabrication of structures with lateral dimensions below 1 #m is necessary. Furthermore, to avoid heating, the stacks should contain only few junctions [3]. These requirements can be fullfilled with present day fabrication technologies. In this paper we report on results obtained for mesas with lateral dimensions down to 1 #m consisting of 4-12 IJJ.

10-Tftcm 2. Subsequently, quadratic mesa structures with lateral dimensions down to 1/~m were patterned using electron beam lithography and Argon-ion milling. For electrical insulation of the lead contacting the top of the mesa a 250 nm thick SiO layer was evaporated followed by a 300400 nm thick gold or silver layer. The leads and contact pads were patterned by photolithography and Argon-ion milling. Current-voltage (IV) characteristics were measured in a two-point configuration. Low pass filters were used for all leads to minimize external noise. External magnetic fields were applied by a 5T split coil. The field orientation relative to the CuO2 layers could be adjusted to an accuracy of 0.01% 3. R e s u l t s

2. S a m p l e s a n d m e a s u r e m e n t

Mesas were patterned on top of BSCCO single crystals using a combination of conventional electron beam lithography and photolithography [4]. To obtain a sufficiently small contact resistance the crystals were cleaved immediately before mounting them into the vacuum chamber and the crystal surface was covered with silver. The contact resistance was typically 10 -50921-4534/00/$ - see front matter © 2000 Elsevier Science B.~ PII S0921-4534(00)01340-X

Fig.1 shows a typical I-V characteristic of a mesa with a junction area of 1 x 1 #m 2. The mesa consisted of four IJJ. The critical current density was about 2 kAcm -2 yielding a Josephson penetration length of about 0.28 #m and ratio of junction width to Josephson length of about 3.5. The characteristic voltage, defined as the voltage jump at the critical current, was 25-30 mV. On larger current scale (Fig.2) a clear gap structure All rights reserved.

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S. Heim et al./Physica C 341-348 (2000) 1567-1568

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4. Conclusion

We fabricated mesas on top of BSCCO single crystals with lateral dimensions down to 1 ~m containing 4-12 IJJ. Measurements confirm Josephson tunneling as well as the homogeneity of the mesas obtained from our fabrication process. REFERENCES

appears confirming that interlayer transport occurs via tunneling. The gap value A per junction is about 25 mV yielding a ratio 2 A / ( k ~ T c ) of 6.8. When the width of the mesas approaches Ai the critical currents of all junctions in the stack should approach a Fraunhofer pattern with zeros at multiples of 13o = ' ~ o / A [5]. The area A is given by the product of the junction width perpendicular to the external field and the junction thickness of 1.5 nm. For the l # m wide junctions, Bo--1.38T. Fig.3 shows results for a 1 #m 2, 12 junction mesa for both polarities of bias cur-

1. R. Kleiner et al. Phys. Rev. Lett. 68 (15), 2394 (1992). 2. R. Kleiner et al. Rev. B 50, 3942 (1994). 3. M. Suzuki et al. Phys. Rev. B 82, 5361 (1999). 4. A. Yurgens et al. Physica C 235-240, 3269 (1994). 5. Y . I . Latyshev et al. Phys. Rev. Lett. 77 (5), 932 (1996).