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Solder joint reliability of large plastic ball grid array assemblies under bending, twisting, and vibration conditions
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World abstracts on microelectronics and reliability
Logic synthesis for reliability: an early start to controlling electromigration and hot-carrier effects. KAUSHIKROY and SHARATPRASAD.IEEE Transactions on Reliability, 44 (2), 251 (June 1995). Designing reliable CMOS chips involves careful circuit design with attention directed to some of the potential reliability problems such as electromigration and hot-carrier effects. This paper considers logic synthesis to optimize, early in the design phase, against electromigration and hot-carrier degradation. The electromigration and hot-carrier effects are estimated at the gate level using signal activity measure (average number of transitions at circuit nodes). Results on MCNC synthesis benchmarks show that logic can be synthesized to optimize for higher reliability and lower silicon area. A minimum-area circuit is usually not associated with highest reliability.
3. CIRCUIT AND SYSTEMS RELIABILITY, MAINTENANCE AND REDUNDANCY
common tweaking approach to reliabilty growth is experimental design techniques. However, economic and time constraints generally impose unreplicated experiments where the response is measured by the times between system failures. We show that statistical analysis of these experiments is more difficult because of this condition. Fortunately, several techniques to detect statistically significant effects in unreplicated experiments are available and can be used to identify which factors and interactions have the strongest influence in lengthening the system up-time. These techniques use a variety of principles and, expectedly, perform somewhat differently under various conditions. We present the results of the most extensive Monte Carlo benchmark ever undertaken to test the performance of these techniques. A new figure of merit is introduced, allowing a 1-quantity summary of the statistical behavior of the tested techniques. A numerical example illustrates the problem and its solution.
A correlation study between different types of CDM testers and 'real' manufacturing in-line leakage failure.
Stochastic modelling of aggregates and products of variable failure rates. N. SINGH. IEEE Transactions
MICHAELD. CHAINE,CHENTECK L1ONGand Ho FOCK SAN. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (2) 295 (June 1995). Charged device model (CDM) tests generated ESD failures that correlated closely to assembly/test manufacturing in-line leakage failures. Both the 'field induced noncontact' and 'socketed' CDN testors correctly identified the weakest pins in 0.8 Bm CMOS technology device. A correlation of the initial fail voltage was found between the different field-induced CDM testers and the eight weakest pins. Similar CDM tests found a weak pin to pin correlation between the two different socketed CDM testers.
on Reliability, 44 (2), 279 (June 1995). This paper develops an unconventional but powerful approach to analyzing the observed and/or estimated failure rates of complex systems that operate in series and/or in parallel under varying operational and environmental conditions. Consequently, such failure rates can be construed as time series which are complex in the sense that they are aggregates and/or products of two or more time series. Hence special time series techniques are required for their analysis. Some of the results recently developed apply to the analysis of such time series. These results can also be used for the analysis of the reliability decay (growth) processes, actual failure times, times between failures, and interactions between failure times and maintenance times of complex systems.
Solder joint reliability of large plastic ball grid array assemblies under bending, twisting, and vibration conditions. J. LAU, K. GRATALO, E, SCHNEIDER, T. MARCOTTE and T. BAKER. Circuit World, 22 (1), 27 (1995). The mechanical and vibration responses of 225-pin, 324-pin and 396-pin PBGA (plastic ball grid array) solder joints have been determined in this study. The effects of overload environmental stress factors on the mechanical responses of the solder joints have been determined by bending and twisting experiments. The effects of shipping and functional environmental stress factors on the vibration responses of the solder joints have been determined by out-of-plane vibration experiments and a mathematical analysis.
Reliability analysis of accelerated life-test data from a repairable system. MAURIZIOGUIDAand MASSIMILIANO
GIORGIO. IEEE Transactions on Reliability, 44 (2), 337 (June 1995). This paper analyzes accelerating testing of a repairable item moulded by a nonhomogeneous Poisson process with covariates. We extensively analyze a single accelerating variable with 2 stress levels, and derive closed-form maximum likelihood (ML) solutions. These closed-form solutions provide: (1) an easier way to obtain point estimates of the unknown parameters under usual operating conditions, and (2) a way to obtain confidence intervals on Unreplicated experimental designs in reliability-growth the process parameters and function thereof which are programmes. CLAUDIO BENSKI and EMMANUEL more accurate than those based on asymptotic CAaAU. IEEE Transactions on Reliability, 44 (2), 199 normality of ML estimates. We analyze the circum(June 1995). Reliability-growth programs are usually stances in which a drawback to closed-form estimation implemented through repairs and modifications arises, and guide the extent that our procedures may aimed at lengthening the system times-between- equally apply. An example application drawn from a failures. The many factors that affect system real situation of accelerated testing is presented, and performance suggest that a rational alternative to the numerical estimates based on our procedures are
World abstracts on microelectronics and reliability
Logic synthesis for reliability: an early start to controlling electromigration and hot-carrier effects. KAUSHIKROY and SHARATPRASAD.IEEE Transactions on Reliability, 44 (2), 251 (June 1995). Designing reliable CMOS chips involves careful circuit design with attention directed to some of the potential reliability problems such as electromigration and hot-carrier effects. This paper considers logic synthesis to optimize, early in the design phase, against electromigration and hot-carrier degradation. The electromigration and hot-carrier effects are estimated at the gate level using signal activity measure (average number of transitions at circuit nodes). Results on MCNC synthesis benchmarks show that logic can be synthesized to optimize for higher reliability and lower silicon area. A minimum-area circuit is usually not associated with highest reliability.
3. CIRCUIT AND SYSTEMS RELIABILITY, MAINTENANCE AND REDUNDANCY
common tweaking approach to reliabilty growth is experimental design techniques. However, economic and time constraints generally impose unreplicated experiments where the response is measured by the times between system failures. We show that statistical analysis of these experiments is more difficult because of this condition. Fortunately, several techniques to detect statistically significant effects in unreplicated experiments are available and can be used to identify which factors and interactions have the strongest influence in lengthening the system up-time. These techniques use a variety of principles and, expectedly, perform somewhat differently under various conditions. We present the results of the most extensive Monte Carlo benchmark ever undertaken to test the performance of these techniques. A new figure of merit is introduced, allowing a 1-quantity summary of the statistical behavior of the tested techniques. A numerical example illustrates the problem and its solution.
A correlation study between different types of CDM testers and 'real' manufacturing in-line leakage failure.
Stochastic modelling of aggregates and products of variable failure rates. N. SINGH. IEEE Transactions
MICHAELD. CHAINE,CHENTECK L1ONGand Ho FOCK SAN. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (2) 295 (June 1995). Charged device model (CDM) tests generated ESD failures that correlated closely to assembly/test manufacturing in-line leakage failures. Both the 'field induced noncontact' and 'socketed' CDN testors correctly identified the weakest pins in 0.8 Bm CMOS technology device. A correlation of the initial fail voltage was found between the different field-induced CDM testers and the eight weakest pins. Similar CDM tests found a weak pin to pin correlation between the two different socketed CDM testers.
on Reliability, 44 (2), 279 (June 1995). This paper develops an unconventional but powerful approach to analyzing the observed and/or estimated failure rates of complex systems that operate in series and/or in parallel under varying operational and environmental conditions. Consequently, such failure rates can be construed as time series which are complex in the sense that they are aggregates and/or products of two or more time series. Hence special time series techniques are required for their analysis. Some of the results recently developed apply to the analysis of such time series. These results can also be used for the analysis of the reliability decay (growth) processes, actual failure times, times between failures, and interactions between failure times and maintenance times of complex systems.
Solder joint reliability of large plastic ball grid array assemblies under bending, twisting, and vibration conditions. J. LAU, K. GRATALO, E, SCHNEIDER, T. MARCOTTE and T. BAKER. Circuit World, 22 (1), 27 (1995). The mechanical and vibration responses of 225-pin, 324-pin and 396-pin PBGA (plastic ball grid array) solder joints have been determined in this study. The effects of overload environmental stress factors on the mechanical responses of the solder joints have been determined by bending and twisting experiments. The effects of shipping and functional environmental stress factors on the vibration responses of the solder joints have been determined by out-of-plane vibration experiments and a mathematical analysis.
Reliability analysis of accelerated life-test data from a repairable system. MAURIZIOGUIDAand MASSIMILIANO
GIORGIO. IEEE Transactions on Reliability, 44 (2), 337 (June 1995). This paper analyzes accelerating testing of a repairable item moulded by a nonhomogeneous Poisson process with covariates. We extensively analyze a single accelerating variable with 2 stress levels, and derive closed-form maximum likelihood (ML) solutions. These closed-form solutions provide: (1) an easier way to obtain point estimates of the unknown parameters under usual operating conditions, and (2) a way to obtain confidence intervals on Unreplicated experimental designs in reliability-growth the process parameters and function thereof which are programmes. CLAUDIO BENSKI and EMMANUEL more accurate than those based on asymptotic CAaAU. IEEE Transactions on Reliability, 44 (2), 199 normality of ML estimates. We analyze the circum(June 1995). Reliability-growth programs are usually stances in which a drawback to closed-form estimation implemented through repairs and modifications arises, and guide the extent that our procedures may aimed at lengthening the system times-between- equally apply. An example application drawn from a failures. The many factors that affect system real situation of accelerated testing is presented, and performance suggest that a rational alternative to the numerical estimates based on our procedures are