Reliab., Vol. 37. No. 4, pp. 687--709. 1997 Copyright pi_!1996 Published by ElsevierScienceLtd Printed in Great Britain 0026-2714197 $17.00+.00
Microelectron.
PII: SOO26-2714(96)00124-2
WORLD
ABSTRACTS
ON MICROELECTRONICS
AND RELIABILITY
Abstract-The abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the article. They are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections. Subjwrs 1. Reliability-General. 2. Reliability of Components, Tubes, Transistors and ICs. 3 Circuit and Systems Reliability. Maintenance and Redundancy. h: Microelectronics-General. 5 Microelectronics-Design and Construction. 6: Microelectronics -Components, Systems and Equipment. I. Semiconductor Integrated Circuits, Devices and Materials. 8. Thick- and Thin-Film Components, Hybrid Circuits and Materials 9. Electron. Ion and Laser Beam Techniques.
horizontal standards activity such as in dependability standards. We present some recent results of this cooperation, in particular, the activities of the QDS (Quality, Dependability and Statistics) committee of IS0 and IEC. We also show specific instances where coordination among international standards bodies has been lacking and indicate potential dangers and pitfalls arising from this, specifically, in terms of contractual conflicts.
I. RELIABILITY-GENERAL Some remarks on rare-event approximation. JEROME COLLET. IEEE Transactions on Reliability, 45 (l), 106 (1996). Two fault-tree analysis methods to compute the minimal cutsets union probability are: the rare-event approximation, and the minimal cutset upper-bound. The rare-event approximation is accurate if all the basic events have low probabilities. The accuracy improvement provided by the minima1 cutset upper-bound approximation is negligible.
Quality enhances reliability. A utility’s big customer will willingly sign up for power that flows smoothly enough not to trip up electronic equipment. D. DANIEL SABIN and ASHOK SUNDARAM. IEEE Spectrum, 34 (February 1996). As deregulation dawns, electric utilities are awakening to the fact that power quality counts with many a customer-and counts for a lot. Even now, the groundwork is being laid worldwide for a new type of service contract between a utility and its large industrial or commercial clients. In brief, the utility promises to supply its customer’s operations with power above a certain level of ‘quality,’ and the customer promises to buy power from no one else for as long as the contract lasts-a valuable concession now that retail wheeling has clients in those categories picking and choosing among suppliers in the electric power industry.
Planning and optimizing environmental stress screening. Y. L. MOK and M. XIE. 1996 Proceedings of the Annual Reliability and Maintainctbility Symposium, 191 (1996). Environmental Stress Screening (ESS) is widely used in the electronics industries as a means to remove early failures. It is a process that calls for proper planning as inadequate duration is ineffective while prolonged screening can incur unnecessary cost. This note describes an approach utilizing mathematical programming to ensure that the right amount of screening is in place at each assembly level. The factors considered include the screening cost and desired operational reliability. Dependability
standards: an international perspective. Proceedings qj” the Annual Reliability and Maintainability Symposium, 13 (1996). This paper is an overview of current activities within the international standards community to harmonize efforts in the dependability field. The author gives his perspective as Chairman of Technical Committee 56 (Dependability) of the International Electrotechnical Commission. Cooperation and coordination among different national and international bodies dealing with standards is essential to achieve coherency within a CLAUIX~
BENSKI. 1996
Proposed new DOD standard for product acceptance. DONALD S. ERMER and DANIEL P. KEDZIE, II. I996 Proceedings of the Annual Reliability and Maintainability Symposium, 24 (1996). Total quality and productivity improvement is a basic tenant in the DOD/Defense Industries Quality Excellence Program. As part of this program, the DOD stated that Military and Federal Specifications which prescribe fixed levels of defects, such as Acceptable Quality Levels (AQLs) and Lot Tolerance Percent Defectives (LTPDs),
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