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The 24th Symposium on Plasma Science for Materials (SPSM-24)
Thin Solid Films 523 (2012) 1
Contents lists available at SciVerse ScienceDirect
Thin Solid Films journal homepage: www.elsevier.com/locate/tsf
Preface
The 24th Symposium on Plasma Science for Materials (SPSM-24)
The 24th Symposium of Plasma Science for Materials (SPSM-24) was held at Osaka University in Japan from July 19th to July 20th, 2011. This symposium originated in 1988 as the “Japanese Symposium on Plasma Chemistry” in commemoration of having held the 8th International Symposium on Plasma Chemistry (ISPC8) in Tokyo, Japan, in 1987. Since 1993, the symposium has been renamed “Symposium on Plasma Science for Materials” to expand and activate the international interdisciplinary field in both basic science and industrial applications based on “Plasma Materials Science”. SPSM is held annually under the sponsorship of the 153rd Committee on Plasma Materials Science, Japan Society for the Promotion of Science. The symposium is one of the major activities of the committee, which is organized by researchers from academia and industry for the purpose of exploring frontiers of “Plasma Materials Science”. This special issue of Thin Solid Films contains peer-reviewed papers presented at SPSM-24 and selected from a total of 94 presentations including 1 special lecture, 1 award lecture, 10 keynote lectures, 7 invited lectures, 23 oral presentations and 52 poster presentations covering the following topics: [Special topics] S-1: Plasma Technologies for Environmental Issues, S-2: Plasma Medicine and Biotechnologies, S-3: Plasma Processes for Development of Energy-Saving/Energy-Creation Devices, S-4: Plasma Fabrications of Functional Carbon Nano Materials and Devices, and S-5: Plasma Processes for Development of Nano Devices and Flexible Electronics; and [General topics] G-1: Basics, G-2: Electronics, G-3: Organic Materials Processing, G-4: Inorganic Materials Processing, and G-5: Thermal Plasma. The organizing committee would like to express sincere thanks to the Editorial Office of Thin Solid Films and the committee members for their cooperation with the Guest Editors and to all the participants for their invaluable contributions to the success of SPSM-24. Organized by The 153rd Committee on Plasma Materials Science, Japan Society for the Promotion of Science. Co-organized by Joining and Welding Research Institute, Osaka University. Organizing Committee Chair Y. Setsuhara, Osaka University, Japan.
0040-6090/$ – see front matter © 2012 Published by Elsevier B.V. http://dx.doi.org/10.1016/j.tsf.2012.10.002
Organizing Committee Y. Inoue, Chiba Institute of Technology, Japan. T. Kaneko, Tohoku University, Japan. T. Nakatani, Toyo Advanced Technologies Co., Ltd., Japan. N. Ohtake, Tokyo Institute of Technology, Japan. M. Shiratani, Kyushu University, Japan. T. Shirafuji, Osaka City University, Japan. K. Takahashi, Kyoto Institute of Technology, Japan. T. Watanabe, Tokyo Institute of Technology, Japan. T. Shirafuji Manager Guest Editor Osaka City University, Japan Y. Setsuhara Guest Editor Osaka City University, Japan Corresponding author. E-mail address: [email protected]. M. Shiratani Guest Editor Kyushu University, Japan T. Kaneko Guest Editor Tohoku University, Japan T. Watanabe Guest Editor Tokyo Institute of Technology, Japan N. Ohtake Guest Editor Tokyo Institute of Technology, Japan
Contents lists available at SciVerse ScienceDirect
Thin Solid Films journal homepage: www.elsevier.com/locate/tsf
Preface
The 24th Symposium on Plasma Science for Materials (SPSM-24)
The 24th Symposium of Plasma Science for Materials (SPSM-24) was held at Osaka University in Japan from July 19th to July 20th, 2011. This symposium originated in 1988 as the “Japanese Symposium on Plasma Chemistry” in commemoration of having held the 8th International Symposium on Plasma Chemistry (ISPC8) in Tokyo, Japan, in 1987. Since 1993, the symposium has been renamed “Symposium on Plasma Science for Materials” to expand and activate the international interdisciplinary field in both basic science and industrial applications based on “Plasma Materials Science”. SPSM is held annually under the sponsorship of the 153rd Committee on Plasma Materials Science, Japan Society for the Promotion of Science. The symposium is one of the major activities of the committee, which is organized by researchers from academia and industry for the purpose of exploring frontiers of “Plasma Materials Science”. This special issue of Thin Solid Films contains peer-reviewed papers presented at SPSM-24 and selected from a total of 94 presentations including 1 special lecture, 1 award lecture, 10 keynote lectures, 7 invited lectures, 23 oral presentations and 52 poster presentations covering the following topics: [Special topics] S-1: Plasma Technologies for Environmental Issues, S-2: Plasma Medicine and Biotechnologies, S-3: Plasma Processes for Development of Energy-Saving/Energy-Creation Devices, S-4: Plasma Fabrications of Functional Carbon Nano Materials and Devices, and S-5: Plasma Processes for Development of Nano Devices and Flexible Electronics; and [General topics] G-1: Basics, G-2: Electronics, G-3: Organic Materials Processing, G-4: Inorganic Materials Processing, and G-5: Thermal Plasma. The organizing committee would like to express sincere thanks to the Editorial Office of Thin Solid Films and the committee members for their cooperation with the Guest Editors and to all the participants for their invaluable contributions to the success of SPSM-24. Organized by The 153rd Committee on Plasma Materials Science, Japan Society for the Promotion of Science. Co-organized by Joining and Welding Research Institute, Osaka University. Organizing Committee Chair Y. Setsuhara, Osaka University, Japan.
0040-6090/$ – see front matter © 2012 Published by Elsevier B.V. http://dx.doi.org/10.1016/j.tsf.2012.10.002
Organizing Committee Y. Inoue, Chiba Institute of Technology, Japan. T. Kaneko, Tohoku University, Japan. T. Nakatani, Toyo Advanced Technologies Co., Ltd., Japan. N. Ohtake, Tokyo Institute of Technology, Japan. M. Shiratani, Kyushu University, Japan. T. Shirafuji, Osaka City University, Japan. K. Takahashi, Kyoto Institute of Technology, Japan. T. Watanabe, Tokyo Institute of Technology, Japan. T. Shirafuji Manager Guest Editor Osaka City University, Japan Y. Setsuhara Guest Editor Osaka City University, Japan Corresponding author. E-mail address: [email protected]. M. Shiratani Guest Editor Kyushu University, Japan T. Kaneko Guest Editor Tohoku University, Japan T. Watanabe Guest Editor Tokyo Institute of Technology, Japan N. Ohtake Guest Editor Tokyo Institute of Technology, Japan