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ABSTRACTS ON M I C R O E L E C T R O N I C S AND R E L I A B I L I T Y
The effects of the main var/ables in the percussive arc welding of electrical interconnections. J. H. HOLLEYand C. J. BAHUN,IEEE Tram. PMP-1, No. 3, December (1965), p. 17. Before accepting percussive arc welding as a production process for making electrical interconnections, it was necessary to determine the effects of the main variables (materials, equipment and operators) which are certain to be encountered in production. This report deals with a study made to develop the required information. The variables selected for study were materials (wire lots and connector pin lots), operators and welding machines, each variable at two levels. Two different wire types were investigated. Statistically designed experiments were performed to determine the effects of these variables upon flexing strength, tensile strength and electrical resistance. In general, significant effects were found for wire lots, operators and welding machines (nsually as interactions). Although these effects are significant, the magnitude of the change does not appear to be excessive in terms of mean values. These results show that the process is controllable and that initial process standards can be calculated from the data presented. CIR~
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MAINTENANCE, REDUNDANCY
Statistical m e t h o d s in reliability analysis, j. M. W r e s t , Electro Technol., May (1967), p. 57. This article develops the elementary concepts and procedures of statistics from the point of view of the reliability analyst. It does n o t attempt to take up more complex statistical methods such as analysis of variance or regression analysis, nor does it discuss such topics as non-parametric statistics or the Bayesian approach, though all of these aspects are important to the design engineer. By concentrating on a few basic concepts and their application to a single field, the article should lead to a better understanding and confidence in the engineering use of statistical techniques. IC reliability--what does it cost? H. T. Go, EDN March (1967), p. 40. There are reliability problems associated with the use of ICs. But an awareness of these problems and what to do about them can keep the cost of using ICs low. This article points out the major causes of IC failures and provides guidelines for economical system design. Maintainability specs bothering you? JmutY M. OKAMUSA,Electron. Des. 10, May 10 (1967), p. 86. Many requests for proposals from government and other prime contractors now include maintainability requirements. Some elements of this relatively new discipline are vague or even unknown to many designers, with the result that they sometimes bid themselves out of competition by responding to needless maintainability requirements. The best way to avoid this situation is to understand the customer's reasons for requesting specific maintainability requirements and what he has a fight to expect for his money. Reliability of directional t r a n a m i q i o n systems. W. B~zEs, Nachrichtentechnik 17, No. 4 (1967), p. 126. (In German.) For any redundant directional transmission systems a formula is given for calculating the availability from availabilities of the individual devices, including the equivalent circuit installations. The subdivision into equivalent circuit sections ensuring maximum availability is determined for a system with a reserve line.
The compatibility of value engineering and configuration management. M. WASSE~'% Proc. 3rd Space Congr., March (1966), p. 437. This paper is aimed at management people responsible for ensuring system compatibility and mission success. It discusses the philosophies of system management and the inter-relationships of program management, system engineering and management tools. Value Engineering and Configuration Management are discussed as the catalysts to be integrated into the management network, thus ensuring system compatibility and mission success at the lowest over-all cost. The Aerospace Industries Association (AIA) has stated that Configuration Management and Value Engineering are not compatible. This paper is offered in rebuttal to that statement. Infra-red techniques for the reliability enhancement of microelectronics. LEoN H^MI~_~, SCP and Solid State Technology, March (1967), p. 41. The conventional means for the evaluation of design and production of microelectronics are listed, and the need for a new tool capable of investigating areas beyond the reach of conventional test equipment is stated. The infra-red evaluation concept is outlined, and its capability to fulfil the above stated requirements is described. The infra-red micro-