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Thick-film circuits
M/erede, tron/~ and Rd/ab///ty
Pergamon Press 1973. Vol. 12, pp. 31-32
Printed in Great Britain
BOOK REVIEWS " T E S T I N G AND FABRICATION OF WIRE-BOND
E L E C T R I C A L CONNECTIONS m
A COMPREHENSIVE SURVEY " by H A z y A. SCHA~rr. National Bureau of Standards. Wadflngton De. 20234, Technical Note 726, issued September 1972, 140 pp. Price $1.25. (Order prepa/d from the Superintendent of Documents, U.S. Department of Commerce Field Offices as S D Catalog No. C.13.46:726; microfiche copies may be ordered prepa/d for 95 cents a copy from the National Technical Information Service (NTIS) Springfield, Va. 22151, as N B S Tech. Note 726). THE FAnmCATIONand testing of wire-bond electrical connections used in integrated circuits, hybrid circuits and low-power discrete semiconductor devices are surveyed. The survey is generally restricted to wire-bond electrical connections where the wire diameter is less than 2 mils and where the wire is bonded either by thermocompressive or ultrasonic means. Under the general heading of fabrication, the essential features of the thermocompression and ultrasonic bonding pro-
ceases, the fabrication procedures and the characteristics of the constituent materials of the wire bond pertinent to high reliability are surveyed. Also included is a review of the interaction of gold and aluminum as one of the primary failure mechanisms in wire bonds. Both new and old test methods are surveyed with emphasis on their capabilities and limitations. In particular, the following test methods are discussed: visual inspection, pull, shear, air blast, push, ultrasonic stress, centrifuge, mechanical shock, variable frequency vibration, vibration fatigue, shortduration stress pulse, temperature cycling, thermal shock, bond interface resistance, and electrical continuity tests; noise measurement; and ultrasonic bond monitoring. Analyses of some of the methods with regard to the stress that the test imposes on the wire bond have been made and the results are used in discussing the relevant methods. G. W. A. D.
" T H I C K - F I L M CIRCUITS" by G. V. PLAmm and L. S. PHILLIPS. Butterworth Group. London, 4 October 1972. Price
fabrication and testing of thick-film circuits and devices. The aim of this book is to fill this need. After an introduction placing thick films in context and an explanation of the range of current and potential applications, the manufacturing procedures are covered step by step from the bare substrate through to the complete packaged and tested circuit. A chapter laying out the design concepts involved in the translation of typical circuits from paper to thick fibr~ is included. Finally, there is a section on "Trends and Future Developments". G. W. A. D.
£4.00. THICK-FILM techniques have now emerged as a most important factor in microelectronic developments, and by virtue of their versatility and simplicity seem destined to provide the basis of hybrid microcircuit manufacturing procedures for some time to come. A considerably wider range of those concerned with electronic applications and developments will need to have an understanding of the materials, equipments and processes involved in the design, 31
Pergamon Press 1973. Vol. 12, pp. 31-32
Printed in Great Britain
BOOK REVIEWS " T E S T I N G AND FABRICATION OF WIRE-BOND
E L E C T R I C A L CONNECTIONS m
A COMPREHENSIVE SURVEY " by H A z y A. SCHA~rr. National Bureau of Standards. Wadflngton De. 20234, Technical Note 726, issued September 1972, 140 pp. Price $1.25. (Order prepa/d from the Superintendent of Documents, U.S. Department of Commerce Field Offices as S D Catalog No. C.13.46:726; microfiche copies may be ordered prepa/d for 95 cents a copy from the National Technical Information Service (NTIS) Springfield, Va. 22151, as N B S Tech. Note 726). THE FAnmCATIONand testing of wire-bond electrical connections used in integrated circuits, hybrid circuits and low-power discrete semiconductor devices are surveyed. The survey is generally restricted to wire-bond electrical connections where the wire diameter is less than 2 mils and where the wire is bonded either by thermocompressive or ultrasonic means. Under the general heading of fabrication, the essential features of the thermocompression and ultrasonic bonding pro-
ceases, the fabrication procedures and the characteristics of the constituent materials of the wire bond pertinent to high reliability are surveyed. Also included is a review of the interaction of gold and aluminum as one of the primary failure mechanisms in wire bonds. Both new and old test methods are surveyed with emphasis on their capabilities and limitations. In particular, the following test methods are discussed: visual inspection, pull, shear, air blast, push, ultrasonic stress, centrifuge, mechanical shock, variable frequency vibration, vibration fatigue, shortduration stress pulse, temperature cycling, thermal shock, bond interface resistance, and electrical continuity tests; noise measurement; and ultrasonic bond monitoring. Analyses of some of the methods with regard to the stress that the test imposes on the wire bond have been made and the results are used in discussing the relevant methods. G. W. A. D.
" T H I C K - F I L M CIRCUITS" by G. V. PLAmm and L. S. PHILLIPS. Butterworth Group. London, 4 October 1972. Price
fabrication and testing of thick-film circuits and devices. The aim of this book is to fill this need. After an introduction placing thick films in context and an explanation of the range of current and potential applications, the manufacturing procedures are covered step by step from the bare substrate through to the complete packaged and tested circuit. A chapter laying out the design concepts involved in the translation of typical circuits from paper to thick fibr~ is included. Finally, there is a section on "Trends and Future Developments". G. W. A. D.
£4.00. THICK-FILM techniques have now emerged as a most important factor in microelectronic developments, and by virtue of their versatility and simplicity seem destined to provide the basis of hybrid microcircuit manufacturing procedures for some time to come. A considerably wider range of those concerned with electronic applications and developments will need to have an understanding of the materials, equipments and processes involved in the design, 31