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Thin film structures with a gap width comparable to the film thickness fabricated by sputter etching
284
World Abstracts on Microelectronics and Reliability
Hybrid passive components--packaging. ALAN P. MANDEL. Proc. Int. Packaging & Production Conf. Brighton p. 37, 16-18 October, (1973). The development of a packaging process to achieve hybrid passive components, networks and arrays was a natural extension of the ever increasing demand for precision hybrid microelectronic circuits. Military, commercial and industrial demands for improvement in component and circuit performance, as well as reduced space, lower costs and no high start-up costs coupled with short development times, pointed directly to thick film hybrid techniques.
adhesion, resistivity and thermocompression bondability of the film produced. Tantalum nitride coated, aluminum oxide substrates were used in this work. The adhesion was checked using the standard tape test; the resistivity was measured using a four point probe; and the bondability was evaluated using both fine wires and lead frames. Auger Electron Spectroscopy was used to monitor the surface of the film. The results of this work permitted selection of chromium-gold deposition parameters for hybrid microcircuit production.
Screen: Essential tool for thick film printing. F. FRANCONV1LLE, K. KURZWEIL and S. G. STALNECKER. Solid St. Technol. 61 (1974). Many variables in thick-film printing have been studied and described in the literature. They refer generally to paste behavior and printing conditions. A relatively neglected item in the thick-film process is the stencil screen which must be of high quality for successful, repeatable printing. Different screen types are reviewed and comparison of the metal mask vs the emulsion screen for different applications are presented. The main characteristics and advantages of direct-emulsion type screens are discussed in terms of screen quality control for repeatable printing with special attention to screen tension evolution during its lifetime and to selection of the proper solvent for screen cleaning. The influence of various screen parameters will be documented by typical printed examples and methods of control of these parameters in production will be described.
New alumina substrate for hybrid integrated circuits. K. NIWA, J. NAKAMURA, K. MURAKAWAand M. NAKAMURA. IEEE Trans. Parts, Hybrids and Packaging. PHP-10, 262 (1974). A new alumina substrate with an extremely smooth surface was developed. This new alumina substrate includes Cr203 and MgO as the additives. Reliability data and characteristics of tantalum nitride or tantalum and tantalum oxide films on the new substrate were compared with those on the glazed alumina.
Towards a better understanding of screen print thickness control. R. J. HORWOOD. Electrocomponent Science and Technology. 1, 129 (1974). In recent years, a more scientific approach to the age-old craft of silk screen printing has resulted in the evolution of complex precision-built printing machines for use in the electronics micro-circuit industry. Even so, our knowledge of the physical processes involved in screen printing is still far from complete. An attempt is made here to provide a better understanding of the screen printing mechanism and more specifically of print thickness control. Two different printing modes are described and the effect of and interaction between some of the more important machine parameters in this respect are discussed. A simple pillar theory is offered which allows a prediction to be made of the quantity of ink fundamentally deposited by a given screen. Screenahility and Rheology. L. F. MILLER. Solid St. Technol. 54 (1974). A brief summary of some of the characteristics of polymer solutions which affect rheology is presented. Certainly, the rheology of thick film pastes is very pertinent to their screenability. However, theological phenomena are so complex, and it is so difficult to formulate a universal definition of screenability, that screening performance cannot always be predicted on the basis of rheological measurements. For example, the rates of shear observed in actual screening processes, and the more subtle implications of viscoelasticity, which are examined here, can limit predictions of screenability. The article has three purposes: to provide a background on the theology of polymer solutions, to show how rheology can be modified and controlled, and to provide some examples relating to these considerations in thick film pastes. It is intended to complement recent papers on the prediction of screenability. Characterization of a chromium-gnld deposition process for the production of thin film hybrid microcircuits. F. A. CLAY, N. T. PANOUSISand R. W. PIERCE JR., IEEE Trans. on Parts Hybrids and Packaging. PHP-10, 258 (1974). This paper describes the effect of chromium deposition rate, gold deposition rate and substrate temperature on the
*A low power RC-coupled VHF amplifier designed for fabrication by hybrid microcircuit techniques. Technical memo. G. R. SEYLAR. Johns Hopkins Univ. Silver Spring Md Applied Physics Lab. APL-TG-1232. N00017-72-C4401 March, 1974. 33 p. A low power, high gain, VHF amplifier was designed for use in the RF amplifier chain of a tuned radio frequency receiver for satellite applications. The circuit design was directed toward a topology and component use compatible with efficient fabrication as a hybrid microcircuit. Operating parameters were selected to optimize the relationship of using the least number of components while achieving the highest gain efficiency (ratio of RF gain to DC power consumption). The report describes both the circuit design and the packaging techniques. Detailed electrical characterization of the resulting five-stage amplifier is also presented. *Thin film 7 G//, Non-degenerate paramp. R. DAVIES and I. D. HIOGINS. Mullard Res. Labs. UK. 1973. 6 p. A parametric amplifier is frequently used as the first stage in low noise microwave receiving systems. Improvements in the quality of varactor diodes and use of high pump frequencies have resulted in paramps that without cooling can satisfy the sensitivity requirements of most systems. However, the paramp remains a costly, large and fairly complex sub-system. Recent trends towards Microwave Integrated Circuits (MIC's) have enabled fairly complex sub-systems to be reproduced on small substrates using thin film techniques. These techniques are suitable for quantity production. The circuits are cheaper, smaller and lighter than their conventional waveguide counterparts.
Thin film structures with a gap width comparable to the film thickness fabricated by sputter etching. T. RICKER and C. SCHWINO. Solid St. Technol. 69 (1974). For special applications in microwave integrated circuits or optical waveguides, distances between conductors are needed which are on the order of or smaller than the conducting layer thickness. Obviously such a structure cannot be realized by chemical etching because of the undercutting which allows no gap widths smaller than about twice the film thickness. A DC diode sputter etch process is described yielding a sputter etch rate of the insulating masking layer which is considerably smaller than that of the conducting material. With this technique wall angles of about 60 ° are achieved with no undercutting. An approach for evaluating Polymer materials as protective coatings on hybrid microcircuits. J. R. SZEDON. IEEE
World Abstracts on Microelectronics and Reliability
Hybrid passive components--packaging. ALAN P. MANDEL. Proc. Int. Packaging & Production Conf. Brighton p. 37, 16-18 October, (1973). The development of a packaging process to achieve hybrid passive components, networks and arrays was a natural extension of the ever increasing demand for precision hybrid microelectronic circuits. Military, commercial and industrial demands for improvement in component and circuit performance, as well as reduced space, lower costs and no high start-up costs coupled with short development times, pointed directly to thick film hybrid techniques.
adhesion, resistivity and thermocompression bondability of the film produced. Tantalum nitride coated, aluminum oxide substrates were used in this work. The adhesion was checked using the standard tape test; the resistivity was measured using a four point probe; and the bondability was evaluated using both fine wires and lead frames. Auger Electron Spectroscopy was used to monitor the surface of the film. The results of this work permitted selection of chromium-gold deposition parameters for hybrid microcircuit production.
Screen: Essential tool for thick film printing. F. FRANCONV1LLE, K. KURZWEIL and S. G. STALNECKER. Solid St. Technol. 61 (1974). Many variables in thick-film printing have been studied and described in the literature. They refer generally to paste behavior and printing conditions. A relatively neglected item in the thick-film process is the stencil screen which must be of high quality for successful, repeatable printing. Different screen types are reviewed and comparison of the metal mask vs the emulsion screen for different applications are presented. The main characteristics and advantages of direct-emulsion type screens are discussed in terms of screen quality control for repeatable printing with special attention to screen tension evolution during its lifetime and to selection of the proper solvent for screen cleaning. The influence of various screen parameters will be documented by typical printed examples and methods of control of these parameters in production will be described.
New alumina substrate for hybrid integrated circuits. K. NIWA, J. NAKAMURA, K. MURAKAWAand M. NAKAMURA. IEEE Trans. Parts, Hybrids and Packaging. PHP-10, 262 (1974). A new alumina substrate with an extremely smooth surface was developed. This new alumina substrate includes Cr203 and MgO as the additives. Reliability data and characteristics of tantalum nitride or tantalum and tantalum oxide films on the new substrate were compared with those on the glazed alumina.
Towards a better understanding of screen print thickness control. R. J. HORWOOD. Electrocomponent Science and Technology. 1, 129 (1974). In recent years, a more scientific approach to the age-old craft of silk screen printing has resulted in the evolution of complex precision-built printing machines for use in the electronics micro-circuit industry. Even so, our knowledge of the physical processes involved in screen printing is still far from complete. An attempt is made here to provide a better understanding of the screen printing mechanism and more specifically of print thickness control. Two different printing modes are described and the effect of and interaction between some of the more important machine parameters in this respect are discussed. A simple pillar theory is offered which allows a prediction to be made of the quantity of ink fundamentally deposited by a given screen. Screenahility and Rheology. L. F. MILLER. Solid St. Technol. 54 (1974). A brief summary of some of the characteristics of polymer solutions which affect rheology is presented. Certainly, the rheology of thick film pastes is very pertinent to their screenability. However, theological phenomena are so complex, and it is so difficult to formulate a universal definition of screenability, that screening performance cannot always be predicted on the basis of rheological measurements. For example, the rates of shear observed in actual screening processes, and the more subtle implications of viscoelasticity, which are examined here, can limit predictions of screenability. The article has three purposes: to provide a background on the theology of polymer solutions, to show how rheology can be modified and controlled, and to provide some examples relating to these considerations in thick film pastes. It is intended to complement recent papers on the prediction of screenability. Characterization of a chromium-gnld deposition process for the production of thin film hybrid microcircuits. F. A. CLAY, N. T. PANOUSISand R. W. PIERCE JR., IEEE Trans. on Parts Hybrids and Packaging. PHP-10, 258 (1974). This paper describes the effect of chromium deposition rate, gold deposition rate and substrate temperature on the
*A low power RC-coupled VHF amplifier designed for fabrication by hybrid microcircuit techniques. Technical memo. G. R. SEYLAR. Johns Hopkins Univ. Silver Spring Md Applied Physics Lab. APL-TG-1232. N00017-72-C4401 March, 1974. 33 p. A low power, high gain, VHF amplifier was designed for use in the RF amplifier chain of a tuned radio frequency receiver for satellite applications. The circuit design was directed toward a topology and component use compatible with efficient fabrication as a hybrid microcircuit. Operating parameters were selected to optimize the relationship of using the least number of components while achieving the highest gain efficiency (ratio of RF gain to DC power consumption). The report describes both the circuit design and the packaging techniques. Detailed electrical characterization of the resulting five-stage amplifier is also presented. *Thin film 7 G//, Non-degenerate paramp. R. DAVIES and I. D. HIOGINS. Mullard Res. Labs. UK. 1973. 6 p. A parametric amplifier is frequently used as the first stage in low noise microwave receiving systems. Improvements in the quality of varactor diodes and use of high pump frequencies have resulted in paramps that without cooling can satisfy the sensitivity requirements of most systems. However, the paramp remains a costly, large and fairly complex sub-system. Recent trends towards Microwave Integrated Circuits (MIC's) have enabled fairly complex sub-systems to be reproduced on small substrates using thin film techniques. These techniques are suitable for quantity production. The circuits are cheaper, smaller and lighter than their conventional waveguide counterparts.
Thin film structures with a gap width comparable to the film thickness fabricated by sputter etching. T. RICKER and C. SCHWINO. Solid St. Technol. 69 (1974). For special applications in microwave integrated circuits or optical waveguides, distances between conductors are needed which are on the order of or smaller than the conducting layer thickness. Obviously such a structure cannot be realized by chemical etching because of the undercutting which allows no gap widths smaller than about twice the film thickness. A DC diode sputter etch process is described yielding a sputter etch rate of the insulating masking layer which is considerably smaller than that of the conducting material. With this technique wall angles of about 60 ° are achieved with no undercutting. An approach for evaluating Polymer materials as protective coatings on hybrid microcircuits. J. R. SZEDON. IEEE