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Tin and tin alloys
Institute
of Meta, Finishing. 74(2):! 1; 1996
Palladium and Palladium Alloys A high-efficiency, neutral pH pallat iium plating system for decorative aplllications was de,
METAL FINISHING
??
FEBRUARY
1997
Kadija, I. et al., AESF SUR/FIN ‘96, Cleveland, June 1996, Session M, p. 459 Kinghom, D.H., U.S. Patent 5,454,929, assignor to National Semiconductor Corp. Kudrak, E.J. et al., AESF SUR/FIN ‘96, Cleveland, June 1996, Session M, p. 471 Lim, J.K., Plating and Surface Finishing, 83(3): 64; 1996 Moon, S.S., U.S. Patent 5552,031; assignor to Hanyang Chemical Ind. Co. Schetty, R., AESF SUR/FIN ‘96, Cleveland, June 1996, Session M, p. 449 Tsuji, K. et al., U.S. Patent 5521,432; assignors to Fujitsu Ltd.
Silver and Silver Alloys Jayakrishnan et al. investigated the effects of bath composition and operating conditions for producing deposits from an electrolyte based on the succinimide complex of silver. A noncyanide silver bath capable of producing deposits up to 5 mils in thickness was the subject of a paper by Dini et al. Sanchez et al. studied the electrodeposition of silver from a low cyanide bath containing potassium pyrophosphate. The electrodeposition of silver arrays on gold utilizing an alkanethiolate photoresist was reported by Liang et al. Hepel and Rice found that the conductivity of thin polypyrrole films could be substantially increased by incorporating silver particles into the matrix or by plating with a thin film of silver. Mocofan et al. developed silver-cadmium alloy plating processes based on an iodide electrolyte for electrical contact applications. An electroplating bath for deposition of silver-tin alloys comprising a mercapto compound selected from mercaptoalkanecarboxylic acids, mercaptoalkanesulfonic acids, or salts of the acids earned a patent for Herklotz et al.
References Dini, J.W. et al., 17th AESF/EPA Pollution Prevention and Control Conference, Orlando, Fla., Feb. 19%, p.269 Hepel, M. and C. Rice, AESF SUR/FIN ‘96, Cleveland, June 1996, Session B, p. 53 Herklotz, G. et al., U.S. Patent 5,514,261; assignors to W.C. Heraeus GmbH Jayakrishnan, S. et al., Metal Finishing, 94(5): 12; 1996 Liang, M. et al., Journal of the Electrochemical Society, 143(10):3117; 1996 Mocofan, M. et al., INTERFINISH 96, Birmingham, U.K., September 12, 1996, p. 359 Sanchez, H. et al., Journal of the Electrochemical Society, 143(9):2799; 19%
Tin and Tin Alloys The effect of halogen plating bath parameters on tin coating buildup and dendrites at strip edges was investigated by Diem et al. Steinbicker et al. patented a ferrocyanide-free halogen tin plating process. A technique for measuring the covering power of a tin halogen plating bath using a scanning electron microscope was described by Rajam et al. Silaimani et al. compared the performance of electrochemically prepared tin fluoborate to commercial solutions and found fewer impurities led to less porous, more corrosion resistant, and more solderable deposits. Federman et al. determined the interactive effects of process variables in tin plating using a methane sulfonic acid bath. Methane sulfonic acid baths were considered a cost-effective, environmentally friendly option over fluoborate and phenol sulfonic acid baths by Espenhahm. Hirano et al. investigated high-current density tin plating from phenol sulfonic acid baths. A sulfan&-based electrolyte for tin plating was described by Paramonov et al. Bortle offered guidelines and troubleshooting hints for operation of standard and high-throw tin-lead plating baths. The deposition of bumps with tin-lead alloys for flip chip applications was the subject of papers by GemmIer et al. and by Ritzdorf and Batz. Lin and Chang determined the morphologies and compositions of electroplated solder bumps on a silicon wafer. Lead-free tin alloys as substitutes for tin-lead plating were addressed by Jordan. Zhang and Abys proposed pure tin as an alternative to tin-lead. The solderability of bismuth/tin double layer deposits from methane sulfonic acid solutions was studied by Katayarna et al. Vasantha et al. (I) reported on the alloy composition, current efficiency, and throwing power of tin-zinc alloys deposited from a gluconate-based bath. The role of peptone in the electrodeposition of tin and tinzinc alloys from gluconate baths was determined by Vasantha et al. (II). Vaughan described an electrodialytic process for removing iron from starmous electrolytes. A method for regenerating tin or tin alloy plating baths won a patent for Murayama. Aoki and Yoshida obtained a patent for a process
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of Meta, Finishing. 74(2):! 1; 1996
Palladium and Palladium Alloys A high-efficiency, neutral pH pallat iium plating system for decorative aplllications was de,
METAL FINISHING
??
FEBRUARY
1997
Kadija, I. et al., AESF SUR/FIN ‘96, Cleveland, June 1996, Session M, p. 459 Kinghom, D.H., U.S. Patent 5,454,929, assignor to National Semiconductor Corp. Kudrak, E.J. et al., AESF SUR/FIN ‘96, Cleveland, June 1996, Session M, p. 471 Lim, J.K., Plating and Surface Finishing, 83(3): 64; 1996 Moon, S.S., U.S. Patent 5552,031; assignor to Hanyang Chemical Ind. Co. Schetty, R., AESF SUR/FIN ‘96, Cleveland, June 1996, Session M, p. 449 Tsuji, K. et al., U.S. Patent 5521,432; assignors to Fujitsu Ltd.
Silver and Silver Alloys Jayakrishnan et al. investigated the effects of bath composition and operating conditions for producing deposits from an electrolyte based on the succinimide complex of silver. A noncyanide silver bath capable of producing deposits up to 5 mils in thickness was the subject of a paper by Dini et al. Sanchez et al. studied the electrodeposition of silver from a low cyanide bath containing potassium pyrophosphate. The electrodeposition of silver arrays on gold utilizing an alkanethiolate photoresist was reported by Liang et al. Hepel and Rice found that the conductivity of thin polypyrrole films could be substantially increased by incorporating silver particles into the matrix or by plating with a thin film of silver. Mocofan et al. developed silver-cadmium alloy plating processes based on an iodide electrolyte for electrical contact applications. An electroplating bath for deposition of silver-tin alloys comprising a mercapto compound selected from mercaptoalkanecarboxylic acids, mercaptoalkanesulfonic acids, or salts of the acids earned a patent for Herklotz et al.
References Dini, J.W. et al., 17th AESF/EPA Pollution Prevention and Control Conference, Orlando, Fla., Feb. 19%, p.269 Hepel, M. and C. Rice, AESF SUR/FIN ‘96, Cleveland, June 1996, Session B, p. 53 Herklotz, G. et al., U.S. Patent 5,514,261; assignors to W.C. Heraeus GmbH Jayakrishnan, S. et al., Metal Finishing, 94(5): 12; 1996 Liang, M. et al., Journal of the Electrochemical Society, 143(10):3117; 1996 Mocofan, M. et al., INTERFINISH 96, Birmingham, U.K., September 12, 1996, p. 359 Sanchez, H. et al., Journal of the Electrochemical Society, 143(9):2799; 19%
Tin and Tin Alloys The effect of halogen plating bath parameters on tin coating buildup and dendrites at strip edges was investigated by Diem et al. Steinbicker et al. patented a ferrocyanide-free halogen tin plating process. A technique for measuring the covering power of a tin halogen plating bath using a scanning electron microscope was described by Rajam et al. Silaimani et al. compared the performance of electrochemically prepared tin fluoborate to commercial solutions and found fewer impurities led to less porous, more corrosion resistant, and more solderable deposits. Federman et al. determined the interactive effects of process variables in tin plating using a methane sulfonic acid bath. Methane sulfonic acid baths were considered a cost-effective, environmentally friendly option over fluoborate and phenol sulfonic acid baths by Espenhahm. Hirano et al. investigated high-current density tin plating from phenol sulfonic acid baths. A sulfan&-based electrolyte for tin plating was described by Paramonov et al. Bortle offered guidelines and troubleshooting hints for operation of standard and high-throw tin-lead plating baths. The deposition of bumps with tin-lead alloys for flip chip applications was the subject of papers by GemmIer et al. and by Ritzdorf and Batz. Lin and Chang determined the morphologies and compositions of electroplated solder bumps on a silicon wafer. Lead-free tin alloys as substitutes for tin-lead plating were addressed by Jordan. Zhang and Abys proposed pure tin as an alternative to tin-lead. The solderability of bismuth/tin double layer deposits from methane sulfonic acid solutions was studied by Katayarna et al. Vasantha et al. (I) reported on the alloy composition, current efficiency, and throwing power of tin-zinc alloys deposited from a gluconate-based bath. The role of peptone in the electrodeposition of tin and tinzinc alloys from gluconate baths was determined by Vasantha et al. (II). Vaughan described an electrodialytic process for removing iron from starmous electrolytes. A method for regenerating tin or tin alloy plating baths won a patent for Murayama. Aoki and Yoshida obtained a patent for a process
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