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Tolerance field and yield comparisons of integrated RC active networks
268
World Abstracts on Microelectronics and Reliability
5. MICROELECTRONICS DESIGN AND CONSTRUCTION Recent advances in LIC processing and packaging technology. L~!s Avt!t',Y. Microeleclron. and Reliah. 15, 75 (1976l. This paper is dhided into two sections. The first deals with the C-MOS bipolar fabrication process and its uses in the industrial and consumer fields: the second is devoted to the tri-metal process, its adwmtages both electrically and environmentally. The concept of hermetic chips in plastic packages is discussed and reliability data presented.
The closed boat: a new approach for semiconductor batch processing. E. W. HIiARN, E. H. T~KAA1 and G. H. SCHW/'TTKJ!. Alicroelectron. and Reliah. 15, 61 (1976). Temperature gradient measurements and X-ray topography are used to characterize silicon wafers before and after batch processing. Experiments are performed at a temperature range from 900 to 120OC. Wafers are processed using standard and modified quartz boats. Temperature gradients in wafers during heat cycling are measured and related to crystal perfection. It is sho~vn that defects in wafers due to heat cycling are substantially reduced through closed boat processing. Similar investigations are reported for wafer warpage. Finally, successful processing of large area silicon slabs (115 x 57mm area and (I.375 mm thickl is discussed.
An evaluation of techniques for bonding beam-lead devices to gold thick films C. ,I. D/,wlis. Solid-State Technol. p. 23 IMarch 1976). Microcircuits arc employed today in many areas of advanced technology such as computers, con> munication systems, and control circuits for vehicles. In recent years the reliability of microcircuits has been inaproved by the development of circuits which incorporate terminal connections that are suitable for attachment to substrate circuitry by' one-shot solid-phase bonding techniques. Such a device is the beam-lead microcircuit ahich has been prc~iously described. These devices arc COl> sidered to be vet\ reliable and arc used extensively in the hybrid control systems of advanced aircraft such a> the new Panavia MRCA. Computer controls IC "wet cycles'. BFRNARD COLE. tih'~ironies p. 135. (April 29 1976}. In wafer fabrication, master controller with microcomputer directs coating and developing processes, wafer transport, protective devices. Single-chip multiplier expands digital role in signal processing. JOHN R. MICX and JOHN SPRIN(iER. Electronics p. 103 (May 13 1976L The many multiplications in such systems are handled by implementing Booth's algorithm and by storing the carries temporarily in a flip-flop.
6. MICROELECTRONICS~-COMPONENTS, SYSTEMS AND EQUIPMENTS What can CCD do for you. M. Ross. Microeh'ctron. and Reliab. 14, 363 (1975). Just two years have elapsed between conception of the charge coupled device and the marketing of the first commercial device, a sure sign of the progress being made with the application of this new technology. The development laboratories are making great claims about future device performance. The flexibility of the CCD concept is such that applications in the diverse areas of digital memories, programmable delay lines, analogue signal processing and optical imaging have been proposed and devices fabricated. This paper summarises the progress achieved to date in performance of the digital memory. analogue signal processing and optical imaging types of charge coupled devices. A micropower complementary-MOS d.c. amplifier. RI('ItARI) A. RIROSKI and MARl() DIANORA. Int. J. Electronics 40 (3). 237 (1976). Two chopper stabilized d.c. amplifier circuits are presented using only CMOS devices for active elements. The operation of each circuit is discussed and experimental data for voltage gain. output impedance and power dissipation are given. Power circuits go monolithic. L. ARMSTRONG. Electronics p. 138 (April 29 1976). Low-cost, self-contained, integrated regulators, both switching and shunt types, simplify powersupply design for a variety of applications. A study and implementation of a semiconductor memory board. S. BROVVH,,IO and G. RAI~VA.Alta Frequen=a XLV. 13t. 181 (1976). (In ltalianL Digital television transmission systems wtth lngh redundancy reduction rates require a flame memor 3. The present paper describes a modular memory realized with dynamic MOS random access memories components. The basic module has the capacity of 16,000 words, 16 bits each. Refreshing of the module c:m be either internally or externally triggered: in former case cycle time is 500 ns, in the latter maximum cycle time is 1.3 ps. The implementation has completely been carried
out at the Electrical Communication Laboratory of tile Politecnico di Milano.
Tolerance field and yield comparisons of integrated RC active networks. P. R. ADBY and J. R. BAXJ~R. Int. J. Eh,crronics 40 (3). 267 (1976). RC active networks contain components which are closely correlated when realized as integrated circuits. Correlation coefficients for typical circuits arc derived and a standard set of component tolerances is proposed which can be used to assess the relative merits of different integrated realizations of the same transfL'r function. Comparison may then be made through the tolerance field or yield. Similar comparisons using multiparameter sensitivity are shown to be inadequate. Current noise in surface layer integrated resistors. K. ( HsuH, E. R. CHENETTE and A. vAN I)t!R ZIIL. Solid-State Electronics. 19. 451 (1976). The excess noise ratio n-1, defined as the excess noise intensity over the thermal noise intensity, is used as a parameter for characterizing the current noise of integrated resistors. Theoretically n-1 is proportional to the square of the device current, inverseh proportional to the square of the device width, and independent of the device length. This is well verified h\ experiment. The noise spectrum is of the form l j " with :/ practically equal to unity, as expected for flicker noise. The effect of current crowding near the currellt-carrying contacts is investigated. A single-chip 16-bit microprocessor for general application. W. A. Fox and G. F. RIYLING Jr. MicroelectrmL and Reliah. 14, 389 (1975L The development of the microprocessor as a high volume production part has pro,,ided design engineers with a means of realizing the benefits of LSI in many digital electronic applications. Microprocessor based products have already been designed in such diverse applications as building control and protection systems, test and medical instruments, machine tool control. navigation systems, electronic games, automated assembly.
World Abstracts on Microelectronics and Reliability
5. MICROELECTRONICS DESIGN AND CONSTRUCTION Recent advances in LIC processing and packaging technology. L~!s Avt!t',Y. Microeleclron. and Reliah. 15, 75 (1976l. This paper is dhided into two sections. The first deals with the C-MOS bipolar fabrication process and its uses in the industrial and consumer fields: the second is devoted to the tri-metal process, its adwmtages both electrically and environmentally. The concept of hermetic chips in plastic packages is discussed and reliability data presented.
The closed boat: a new approach for semiconductor batch processing. E. W. HIiARN, E. H. T~KAA1 and G. H. SCHW/'TTKJ!. Alicroelectron. and Reliah. 15, 61 (1976). Temperature gradient measurements and X-ray topography are used to characterize silicon wafers before and after batch processing. Experiments are performed at a temperature range from 900 to 120OC. Wafers are processed using standard and modified quartz boats. Temperature gradients in wafers during heat cycling are measured and related to crystal perfection. It is sho~vn that defects in wafers due to heat cycling are substantially reduced through closed boat processing. Similar investigations are reported for wafer warpage. Finally, successful processing of large area silicon slabs (115 x 57mm area and (I.375 mm thickl is discussed.
An evaluation of techniques for bonding beam-lead devices to gold thick films C. ,I. D/,wlis. Solid-State Technol. p. 23 IMarch 1976). Microcircuits arc employed today in many areas of advanced technology such as computers, con> munication systems, and control circuits for vehicles. In recent years the reliability of microcircuits has been inaproved by the development of circuits which incorporate terminal connections that are suitable for attachment to substrate circuitry by' one-shot solid-phase bonding techniques. Such a device is the beam-lead microcircuit ahich has been prc~iously described. These devices arc COl> sidered to be vet\ reliable and arc used extensively in the hybrid control systems of advanced aircraft such a> the new Panavia MRCA. Computer controls IC "wet cycles'. BFRNARD COLE. tih'~ironies p. 135. (April 29 1976}. In wafer fabrication, master controller with microcomputer directs coating and developing processes, wafer transport, protective devices. Single-chip multiplier expands digital role in signal processing. JOHN R. MICX and JOHN SPRIN(iER. Electronics p. 103 (May 13 1976L The many multiplications in such systems are handled by implementing Booth's algorithm and by storing the carries temporarily in a flip-flop.
6. MICROELECTRONICS~-COMPONENTS, SYSTEMS AND EQUIPMENTS What can CCD do for you. M. Ross. Microeh'ctron. and Reliab. 14, 363 (1975). Just two years have elapsed between conception of the charge coupled device and the marketing of the first commercial device, a sure sign of the progress being made with the application of this new technology. The development laboratories are making great claims about future device performance. The flexibility of the CCD concept is such that applications in the diverse areas of digital memories, programmable delay lines, analogue signal processing and optical imaging have been proposed and devices fabricated. This paper summarises the progress achieved to date in performance of the digital memory. analogue signal processing and optical imaging types of charge coupled devices. A micropower complementary-MOS d.c. amplifier. RI('ItARI) A. RIROSKI and MARl() DIANORA. Int. J. Electronics 40 (3). 237 (1976). Two chopper stabilized d.c. amplifier circuits are presented using only CMOS devices for active elements. The operation of each circuit is discussed and experimental data for voltage gain. output impedance and power dissipation are given. Power circuits go monolithic. L. ARMSTRONG. Electronics p. 138 (April 29 1976). Low-cost, self-contained, integrated regulators, both switching and shunt types, simplify powersupply design for a variety of applications. A study and implementation of a semiconductor memory board. S. BROVVH,,IO and G. RAI~VA.Alta Frequen=a XLV. 13t. 181 (1976). (In ltalianL Digital television transmission systems wtth lngh redundancy reduction rates require a flame memor 3. The present paper describes a modular memory realized with dynamic MOS random access memories components. The basic module has the capacity of 16,000 words, 16 bits each. Refreshing of the module c:m be either internally or externally triggered: in former case cycle time is 500 ns, in the latter maximum cycle time is 1.3 ps. The implementation has completely been carried
out at the Electrical Communication Laboratory of tile Politecnico di Milano.
Tolerance field and yield comparisons of integrated RC active networks. P. R. ADBY and J. R. BAXJ~R. Int. J. Eh,crronics 40 (3). 267 (1976). RC active networks contain components which are closely correlated when realized as integrated circuits. Correlation coefficients for typical circuits arc derived and a standard set of component tolerances is proposed which can be used to assess the relative merits of different integrated realizations of the same transfL'r function. Comparison may then be made through the tolerance field or yield. Similar comparisons using multiparameter sensitivity are shown to be inadequate. Current noise in surface layer integrated resistors. K. ( HsuH, E. R. CHENETTE and A. vAN I)t!R ZIIL. Solid-State Electronics. 19. 451 (1976). The excess noise ratio n-1, defined as the excess noise intensity over the thermal noise intensity, is used as a parameter for characterizing the current noise of integrated resistors. Theoretically n-1 is proportional to the square of the device current, inverseh proportional to the square of the device width, and independent of the device length. This is well verified h\ experiment. The noise spectrum is of the form l j " with :/ practically equal to unity, as expected for flicker noise. The effect of current crowding near the currellt-carrying contacts is investigated. A single-chip 16-bit microprocessor for general application. W. A. Fox and G. F. RIYLING Jr. MicroelectrmL and Reliah. 14, 389 (1975L The development of the microprocessor as a high volume production part has pro,,ided design engineers with a means of realizing the benefits of LSI in many digital electronic applications. Microprocessor based products have already been designed in such diverse applications as building control and protection systems, test and medical instruments, machine tool control. navigation systems, electronic games, automated assembly.