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Total quality management: an approach and a case study
Microelectron. Reliab., Vol. 31, No. 5, pp. 1037-1056, 1991. Printed in Great Britain.
0026--2714/9153.00+ .00 Pergamon Press pie
WORLD ABSTRACTS ON MICROELECTRONICS A N D RELIABILITY
The abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the article. They are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections.
Subjects 1. Reliability---General. 2. Reliability of Components, Tubes, Transistors and ICs. 3. Circuit and Systems Reliability, Maintenance and Redundancy. 4. Microelectronics---General. 5. Microelectronics--Design and Construction. 6. Microelectronics---Components, Systems and Equipments. 7. Semiconductor Integrated Circuits, Devices and Materials. 8. Thick- and Thin-Film Components, Hybrid Circuits and Materials. 9. Electron, Ion and Laser Beam Techniques.
1. R E L I A B I L I T Y - - G E N E R A L Total quality management: an approach and a case study. NAEL A. AL¥ et al. Computers ind. Engng 19(1~,), 111 (1990). For the last decade, American companies have been playing catch-up in the area of quality and productivity. Japanese companies and other foreign competitors have moved into markets that were once dominated by American companies, by producing higher quality products. The problem to date in the U.S. has obviously not been the lack of resources or documentation on quality and improvement programs, but the misdirection of these programs and the lack of total management commitment. Total Quality Management (TQM) is seen as an effective method that will accomplish the task of higher quality levels, and increased productivity. The purpose of Total Quality Management is to implement a process that is long-term and continuous, in which all of the management participates in establishing continuous improvement initiatives throughout the organization, beginning with their own function in the organization. TQM integrates the fundamental techniques and principles of Quality Function Deployment, Taguchi Methods, Statistical Processing Control, Just-In-Time, and existing management tools into a structured approach. The primary objective of this approch is to incorporate quality and integrity into all functions at all levels of the organization. This paper examines the TOM process, philosophy, concepts, attributes and how it can be used to develop a quality-based culture. The paper also examines the introduction and implementation of the TQM process at an electronics manufacturer. A discussion of yield modeling with defect clustering, circuit repair and circuit redundancy. TIMOTHY L. MICHALKA, RAMESH C. VARSHNEYand JAMESD. MEINDL. IEEE Trans. Semicond. Mfg. 3(3), 116 (1990). The mathematical foundation of common integrated circuit yield models based on the assumption that the yield is dominated by random point defects is discussed. Various mathematical models which are commonly used to account for defect clustering are given a physical interpretation and are compared mathematically
and graphically. A yield model applicable when the repair of some defects in a chip is possible is developed and discussed. Simple yield models for systems with two fold block redundancy and triple modular redundancy in the presence of defect clustering are developed and the implications for overall system yield are discussed. It is shown that the yield of systems with circuit redundancy can be substantially affected by defect clustering and hence that a correct understanding of defects and yield is essential to predict the yields and costs of wafer scale products.
Mechanical engineering issues and electronic equipment reliability: incurred costs without compensating benefits. CHARLES T. LEONARD. IEEE Trans. Compon. Hybrids mfg TechnoL 13(4), 895 (1990). Temperature is widely viewed as a major influence on failures of electronic equipment. Failure prediction methodology (FPM), such as MILHDBK-217 is an often quoted reference describing the temperature influence, often depicted as being exponential in effect, affecting wide classes of electronic component parts. The FPM concept of a constant failure rate that is accelerated by various environmental influences is widely applied beyond its validity. Misapplications of the reliability models in current use may cause failure avoidance efforts such as temperature reduction and parts quality selection not to yield anticipated overall results. The cost and complexity effects can be significant: temperature reduction, for example, can result in expensive system implementations in some cases. Due to industry, with continuing improvements in component quality over the years, the continuing quest for electronics reliability should change emphasis from attention to electronic parts to activities that address assembly and processes. This paper discusses the ways the temperature ingredient of reliability and similar concepts may be currently applied, with examples to illustrate disparities between anticipations and realizations. Alternative approaches are offered and their possible implementations are discussed.
1037
0026--2714/9153.00+ .00 Pergamon Press pie
WORLD ABSTRACTS ON MICROELECTRONICS A N D RELIABILITY
The abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the article. They are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections.
Subjects 1. Reliability---General. 2. Reliability of Components, Tubes, Transistors and ICs. 3. Circuit and Systems Reliability, Maintenance and Redundancy. 4. Microelectronics---General. 5. Microelectronics--Design and Construction. 6. Microelectronics---Components, Systems and Equipments. 7. Semiconductor Integrated Circuits, Devices and Materials. 8. Thick- and Thin-Film Components, Hybrid Circuits and Materials. 9. Electron, Ion and Laser Beam Techniques.
1. R E L I A B I L I T Y - - G E N E R A L Total quality management: an approach and a case study. NAEL A. AL¥ et al. Computers ind. Engng 19(1~,), 111 (1990). For the last decade, American companies have been playing catch-up in the area of quality and productivity. Japanese companies and other foreign competitors have moved into markets that were once dominated by American companies, by producing higher quality products. The problem to date in the U.S. has obviously not been the lack of resources or documentation on quality and improvement programs, but the misdirection of these programs and the lack of total management commitment. Total Quality Management (TQM) is seen as an effective method that will accomplish the task of higher quality levels, and increased productivity. The purpose of Total Quality Management is to implement a process that is long-term and continuous, in which all of the management participates in establishing continuous improvement initiatives throughout the organization, beginning with their own function in the organization. TQM integrates the fundamental techniques and principles of Quality Function Deployment, Taguchi Methods, Statistical Processing Control, Just-In-Time, and existing management tools into a structured approach. The primary objective of this approch is to incorporate quality and integrity into all functions at all levels of the organization. This paper examines the TOM process, philosophy, concepts, attributes and how it can be used to develop a quality-based culture. The paper also examines the introduction and implementation of the TQM process at an electronics manufacturer. A discussion of yield modeling with defect clustering, circuit repair and circuit redundancy. TIMOTHY L. MICHALKA, RAMESH C. VARSHNEYand JAMESD. MEINDL. IEEE Trans. Semicond. Mfg. 3(3), 116 (1990). The mathematical foundation of common integrated circuit yield models based on the assumption that the yield is dominated by random point defects is discussed. Various mathematical models which are commonly used to account for defect clustering are given a physical interpretation and are compared mathematically
and graphically. A yield model applicable when the repair of some defects in a chip is possible is developed and discussed. Simple yield models for systems with two fold block redundancy and triple modular redundancy in the presence of defect clustering are developed and the implications for overall system yield are discussed. It is shown that the yield of systems with circuit redundancy can be substantially affected by defect clustering and hence that a correct understanding of defects and yield is essential to predict the yields and costs of wafer scale products.
Mechanical engineering issues and electronic equipment reliability: incurred costs without compensating benefits. CHARLES T. LEONARD. IEEE Trans. Compon. Hybrids mfg TechnoL 13(4), 895 (1990). Temperature is widely viewed as a major influence on failures of electronic equipment. Failure prediction methodology (FPM), such as MILHDBK-217 is an often quoted reference describing the temperature influence, often depicted as being exponential in effect, affecting wide classes of electronic component parts. The FPM concept of a constant failure rate that is accelerated by various environmental influences is widely applied beyond its validity. Misapplications of the reliability models in current use may cause failure avoidance efforts such as temperature reduction and parts quality selection not to yield anticipated overall results. The cost and complexity effects can be significant: temperature reduction, for example, can result in expensive system implementations in some cases. Due to industry, with continuing improvements in component quality over the years, the continuing quest for electronics reliability should change emphasis from attention to electronic parts to activities that address assembly and processes. This paper discusses the ways the temperature ingredient of reliability and similar concepts may be currently applied, with examples to illustrate disparities between anticipations and realizations. Alternative approaches are offered and their possible implementations are discussed.
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