Treating solution for surfacetreatment of metal and surface treatment method

Treating solution for surfacetreatment of metal and surface treatment method

N e w Developments in the Metal Finishing Field Compiled by Anselm Kuhn, Metal Finishing Information R e c e n t l y p u b l i s h e d patents M e t ...

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N e w Developments in the Metal Finishing Field Compiled by Anselm Kuhn, Metal Finishing Information

R e c e n t l y p u b l i s h e d patents M e t h o d and D e v i c e for L o c a l l y R e m o v i n g C o a t i n g f r o m Parts

US .2004244910 Albrecht, A.; Eberlein, A., et al. Method and device for locally stripping coatings from components, an absorbent medium being provided, the medium being supplied with a coating removal liquid, and the medium containing the coating removal liquid being brought into contact with the area of the component from which the coating is to be removed. Treating S o l u t i o n for S u r f a c e T r e a t m e n t of M e t a l and Surface Treatment Method

U.S. 2004244874 Nakayama, T.; Sato, H., et al. Conversion coating for iron, steel, zinc, and mixed metals of these including one or more of titanium, hafnium, zirconium, silicon, fluo-

fine. Compounds containing other named metals can be added. E l e c t r o l y t i c P r o c e s s for D e p o s i t i n g a Layer of C o p p e r on a S t e e l W i r e

U.S. 2004247865 Pavan, F. Electrolytic process for depositing copper on a steel wire in which the wire travels through an acidic electrolytic bath of an aqueous solution of Cu (II) ions in the form of a salt of an acid. A direct electric current passes through the solution between at least one anode and the wire acting as the cathode. The bath also has from 1.9 to 6 mM/1 of a thiourea and from 1.9 to 6 raM/1 of an amino acid. Electrolytic Processing A p p a r a t u s and M e t h o d

U.S. 2004256237

Kobata, I.; Shirakashi, M., et al. Electrolytic processing apparatus and method which, while omitting

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a CMP t r e a t m e n t entirely or reducing a load upon a CMP t r e a t m e n t to the least possible extent, can process a conductive material formed in the surface of a substrate to flatten (planarize) the material, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The electrolytic processing a p p a r a t u s includes a pair of electrodes disposed at a given distance, an ion exchange m e m b r a n e disposed b e t w e e n the pair of electrodes, and a liquid supply section for supplying a liquid b e t w e e n the pair of electrodes. The electrolytic processing method includes providing an electrode section having a pair of electrodes disposed at a given distance with an ion exchanger being interposed; and bringing the electrode into contact with or close to a workpiece while supplying a fluid to the ion exchanger, thereby pro-

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