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Tutorial: temperature as an input to microelectronics-reliability models
World abstracts on microelectronics and reliability reliability estimation that is input-domain based. It was developed to overcome some of the difficulties in using existing reliability models in critical applications. The method classifies the faults that could be in a software program. Then it accounts for the distribution over the input-domain of input values which could activate each fault-type. The method assumes that these distributions change, by reducing their extent, with the number of test cases correctly executed. Using a simple example, the paper suggests a convenient fault classification and a choice of distributions for each fault-type. The introduction of the distributions permit better use of the information collected during the testing phase.
A comparison of fault-tolerant state machine architectures for space-borne electronics. SHAILE~HNIRANJAN and JAMES F. FRENZEL. IEEE Transactions on Reliability, 45 (1 ), 109 ( 1996). Very large scale integrated (VLSI) circuits used in the space & nuclear industry are continuously subjected to ion radiation. As the limits of VLSI technology are pushed towards sub-micron levels in order to achieve higher levels of devices become more vulnerable to integration radiation induced errors. These radiation induced errors can lead to system failure, particularly if they affect the memory portion of vita1 subsystems, such as state machine controllers. This paper explores the use ofclassical fault-tolerant state machine architectures based on hardware & information redundancy to design radiation-immune controllers. Those architectures particularly suitable for VLSI-implementation using ordinary, low power CMOS technology are identified, with the primary objective of correcting single flip-flop errors. Each architecture was implemented on a set of benchmark sequential circuits and evaluated in terms of circuitsize and maximum path-delay. The best overall architectures, ‘SEU-I TMR’ and ‘Modified Explicit EC’, used a non-redundant excitation circuit and redundant flip-flops, followed by error correction circuitry to tolerate single flip-flop errors.
Solving ML equations for 2-parameter Poisson-process models for ungrouped software-failure data. GEORGE J. KNAFL and JOSEPHMORGAN. IEEE Transactions on Reliability, 45 (1) 42 (1996). Existence conditions are given for maximum likelihood (ML) parameter estimates for several families of 2-parameter softwarereliability Poisson-process models. For each such model, the ML equations can be expressed in terms of 1 equation in 1 unknown. Bounds are given on solutions to these l-equation problems to serve as initial intervals for search algorithms like bisection. Uniqueness of the solutions is established in some cases. Solutions are also tabulated for certain simple cases. Results are given for ungrouped failure data (exact times are available for all failures). ML estimation problems for such a situation are treated
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as limiting cases of problems based on failure times grouped into intervals of decreasing mesh. How to model reliability-growth when times of design modifications are known. NADER EBRAHIMI. IEEE Transactions on Reliability, 45 (l), 54 (1996). Engineers often make changes during system development in order to correct design weaknesses. If done well this results in reliability growth as development continues. Since no reliability-growth mode1 is adequate for all time (any growth mode1 is valid only for some finite amount of time) it is prudent to use a different reliability model between each two design modifications. This paper assumes that the reliability growth model between each two design modifications is either a Poisson process or power-law process. Maximum likelihood estimates of the parameters are obtained for two cases: (1) no constraints on parameters, and (2) some constraints on parameters. Tutorial: temperature as an input to microelectronicsreliability models. PRADEEPLALL. IEEE Transactions on Reliability, 45 (1 ), 3 (1996). This tutorial discusses various modeling methodologies for temperature acceleration of microelectronic-device failures; there are situations in which some methodologies give misleading results. The aim is to raise the level of understanding of the impact of temperature on reliability and to define the objectives of physics-based temperature modeling. There are alternatives to both the Arrhenius relation and the Mil-Hdbk-217 approach to reliability. In Japan, Taiwan, Singapore, and Malaysia, a physics-of-failure approach is used by most companies. Philips in the Netherlands and the CADMP Alliance in the USA have developed methods & software to conduct physics-based reliability assessments. Dynamic analysis of qualitative circuits for failure mode and effects analysis. DAVID R. PUGH and NEAL SNOOKE. 1996 Proceedings of the Annual Reliability and Maintainability Symposium, 37 (1996). There are a number of reasons for wanting to generate FMEAs as soon in the design process as possible; three of the more notable being safety, reliability and cost. The Flame system provides electrical engineers with a means of automating FMEA using, amongst other techniques, qualitative circuit analysis. Until recently, the qualitative circuit simulator with Flame has only been able to generate failure descriptions for circuits containing a set of relatively simple components; for example, bulbs, resistors. connectors, wires and switches. Representing and reasoning about the operation of CPUs, multi-way switches, sensors, multi-speed motors, and other complex components was not possible due to their intricate effect on a circuit. The paper describes how the behaviour of such components and their failure modes can now be presented; and gives an example
A comparison of fault-tolerant state machine architectures for space-borne electronics. SHAILE~HNIRANJAN and JAMES F. FRENZEL. IEEE Transactions on Reliability, 45 (1 ), 109 ( 1996). Very large scale integrated (VLSI) circuits used in the space & nuclear industry are continuously subjected to ion radiation. As the limits of VLSI technology are pushed towards sub-micron levels in order to achieve higher levels of devices become more vulnerable to integration radiation induced errors. These radiation induced errors can lead to system failure, particularly if they affect the memory portion of vita1 subsystems, such as state machine controllers. This paper explores the use ofclassical fault-tolerant state machine architectures based on hardware & information redundancy to design radiation-immune controllers. Those architectures particularly suitable for VLSI-implementation using ordinary, low power CMOS technology are identified, with the primary objective of correcting single flip-flop errors. Each architecture was implemented on a set of benchmark sequential circuits and evaluated in terms of circuitsize and maximum path-delay. The best overall architectures, ‘SEU-I TMR’ and ‘Modified Explicit EC’, used a non-redundant excitation circuit and redundant flip-flops, followed by error correction circuitry to tolerate single flip-flop errors.
Solving ML equations for 2-parameter Poisson-process models for ungrouped software-failure data. GEORGE J. KNAFL and JOSEPHMORGAN. IEEE Transactions on Reliability, 45 (1) 42 (1996). Existence conditions are given for maximum likelihood (ML) parameter estimates for several families of 2-parameter softwarereliability Poisson-process models. For each such model, the ML equations can be expressed in terms of 1 equation in 1 unknown. Bounds are given on solutions to these l-equation problems to serve as initial intervals for search algorithms like bisection. Uniqueness of the solutions is established in some cases. Solutions are also tabulated for certain simple cases. Results are given for ungrouped failure data (exact times are available for all failures). ML estimation problems for such a situation are treated
691
as limiting cases of problems based on failure times grouped into intervals of decreasing mesh. How to model reliability-growth when times of design modifications are known. NADER EBRAHIMI. IEEE Transactions on Reliability, 45 (l), 54 (1996). Engineers often make changes during system development in order to correct design weaknesses. If done well this results in reliability growth as development continues. Since no reliability-growth mode1 is adequate for all time (any growth mode1 is valid only for some finite amount of time) it is prudent to use a different reliability model between each two design modifications. This paper assumes that the reliability growth model between each two design modifications is either a Poisson process or power-law process. Maximum likelihood estimates of the parameters are obtained for two cases: (1) no constraints on parameters, and (2) some constraints on parameters. Tutorial: temperature as an input to microelectronicsreliability models. PRADEEPLALL. IEEE Transactions on Reliability, 45 (1 ), 3 (1996). This tutorial discusses various modeling methodologies for temperature acceleration of microelectronic-device failures; there are situations in which some methodologies give misleading results. The aim is to raise the level of understanding of the impact of temperature on reliability and to define the objectives of physics-based temperature modeling. There are alternatives to both the Arrhenius relation and the Mil-Hdbk-217 approach to reliability. In Japan, Taiwan, Singapore, and Malaysia, a physics-of-failure approach is used by most companies. Philips in the Netherlands and the CADMP Alliance in the USA have developed methods & software to conduct physics-based reliability assessments. Dynamic analysis of qualitative circuits for failure mode and effects analysis. DAVID R. PUGH and NEAL SNOOKE. 1996 Proceedings of the Annual Reliability and Maintainability Symposium, 37 (1996). There are a number of reasons for wanting to generate FMEAs as soon in the design process as possible; three of the more notable being safety, reliability and cost. The Flame system provides electrical engineers with a means of automating FMEA using, amongst other techniques, qualitative circuit analysis. Until recently, the qualitative circuit simulator with Flame has only been able to generate failure descriptions for circuits containing a set of relatively simple components; for example, bulbs, resistors. connectors, wires and switches. Representing and reasoning about the operation of CPUs, multi-way switches, sensors, multi-speed motors, and other complex components was not possible due to their intricate effect on a circuit. The paper describes how the behaviour of such components and their failure modes can now be presented; and gives an example