Vacuum coating

from a fused sodium chloride-potassium chloride bath. The characteristics of cobalt electrodeposited on p-type silicon were determined by Wisniewski et al. Oda et al. patented a process for electrodeposition of an amorphous, magnetic cobalt-iron-phosphorus alloy. An electrodeposition method for forming a molybdenum black coating for solar energy applications was described by Yousif. Guerfi et al. investigated the stability and characteristics of electrodeposited molybdenum oxide thin films. An automated flow cell electrodeposition system for formation of cadmium telluride thin films was reported by Huang et al. Thouin and Vedel electrodeposited and characterized copper-indium-selenium thin films. References Gray, G.E., et al., Joumal ofthe Electwchemical Society, 142(11):3636; 1995 Guerfi, A., et al., Journal ofrhe Elecrrochemical Society, 142(10):3457; 1995 Huang, B.M., et al., Jownal qf rheElectroclwnzid Society, 142(9):3007; 1995 Kumbhar, P.P., and C.D. Lokhande, Metal Finishing, 93(4):24, 1995 Lantelme, F., and Y. Berghoute, Journal of the Electrochemical Society, 141( 12):3306; 1994 Oda, M., et al., U.S. Patent 5,435,903: assignors to Mitsubishi Rayon Co. Schmidt, K-J., and E. Knaak, U.S. Patent 5,443,714; assignors to Blasberg Oberflachentechnik GmbH Thouin, L., and J. Vedel, Jour-nal of rhe Electrochemical Society. 142(9):2997; 1995 Troup-Packman, S., U.S. Patent 5,368,719; assignor to Hughes Aircraft Co. Wisniewski, C., et al., Jour-nal of the Elecrrochemical Society, 142(11):3889; 1995 Yoshimura, S. et al (I), Tmnsactions of the Insriture of Merul Finishing, 73( 1):3 I; 1995 Yoshimura, S. et al (II), Transacrions of the lnstirure of Metal Finishing, 73(3): 11 I; 1995 Yousif, K.M., M&d Finishing, 93(6):90; 1995

VACUUM

COATING

Durant discussed the key factors involved in differentiating between batch and continuous systems for in-line evaporation and sputtering. Decorative finishing using a cathodic arc plasma for physical vapor deposition (PVD) for preparation of titanium nitride coatings was addressed by Lee (I and II). Baldwin and Falabella described deposition processes utilizing a filtered arc source. The use of ion vapor deposited aluminum coatings as substitutes for cadmium was reviewed by Legge. Srabian noted the drawbacks of water28

based coatings for metallizing applications. Bischer and Small patented a process for vacuum deposition of a highly reflective film onto aluminum consisting of depositing a layer of oxide prior to the reflectance finish. A method for producing a cooking vessel by forming a titanium nitride film and then heat treating to effect colortone stabilization and a coating of titanium oxide was patented by Nagaoka and Kanno. Schultz and Bergmann obtained a patent for hard coating of workpieces with aluminum oxide/chromium oxide crystals. A process for manufacturing bright aluminum parts incorporating a vacuum deposited coating of indium won a patent for Eisfeller and Clark. Jarry patented a process for producing bimaterial parts consisting of coating a PVD titanium-based film onto a metal insert and casting an aluminum alloy around the coated insert. A method for depositing evaporated ceramic coatings won a patent for Bruce et al. Lohwasser obtained a patent for a process for coating a substrate with a permeation barrier using an ionizing electron beam. An ionbeam-assisted method of producing diamondlike films garnered a patent for Dearnaley. Zuhr et al. obtained a patent for a method of selective area deposition from an ion source. Plasma nitrided titanium and titanium alloy products with improved wear- and corrosion-resistance were the subject of a patent granted to Meletis. Narasimhan et al. patented a titanium nitride coated valve. An adherent metal coating for aluminum nitride surfaces comprising chromium, chromium oxide, and a complex of aluminum-nitrogen-oxygen-chromium earned a patent for Arledge et al. Buhl and Hasler patented a method and apparatus for stabilizing an arc between an anode and cathode in a vacuum coating device. An arc ion plating system won a patent for Tsuji. Kempf received a patent for an apparatus for synchronizing loading and unloading of substrates with turntable movement in a coating chamber. A vacuum coating apparatus with rotarydriven substrate carrier garnered a patent for Kunz and Bergmann. Stevenson patented a load-lock, drumtype coating apparatus. An apparatus for the insertion and removal of a mask through the airlock of a vacuum coat-

ing apparatus was the subject of a patent granted to Zejda (I). Lavine described a single-disk sputtering system to produce magnetic media for high storage density hard drive disks. An apparatus for simultaneously coating a magnetic medium onto a plurality of disks won a patent for Huang et al. Hartig and Szczyrbowski (I) obtained a patent for a multichamber coating apparatus. Patents related to vacuum coating of disk-shaped substrates were awarded to Mahler, and to Zejda (II). An apparatus for reactive coating of a substrate was patented by Hartig and Szczyrbowski (II). Vacuum coating equipment was the also the subject of patents issued to Brauer et al., to Szczyrbowski et al., to Arnold et al., to Ahmed, to Mahler and Stang, and to Gorokhovsky. The principles of hollow cathode magnetron sputtering were presented by Glocker. Minato (I and II) described decorative applications for hollow cathode discharge ion plating. Schiller noted the benefits of pulsed technology for magnetron sputtering. Gold color control for sputtering from copperbased alloys was addressed by Plaisted. Kukla et al. described a just-in-time coater for sputtering of three-dimensional plastic parts. A process for forming metal films on resin substrates by plasma sputtering was patented by Matsumaru et al. Barton and McGraw patented a method for metallizing fluoropolymer substrates by bias sputtering in a mixture of ammonia and a noble gas. Low temperature PVD for hard coating of dielectric materials by sputtering was discussed by Leonhardt et al. Anschel patented a process for providing a metallic layer on a polyimide, consisting of sputtering chromium and copper. A method for metallization of integrated circuits, comprising sputtering of titanium, a titanium-palladium alloy, and copper followed by electroplating copper, nickel, and gold won a patent for Frankenthal et al. Sichmann et al. received a patent for a process for coating a polycarbonate with an aluminum-silicon alloy. Advances in plasma emission monitoring for reactive magnetron sputtering of titanium oxide and titanium nitride were reported by Kirchhoff. Mueller et al. patented a method for cleaning the target in the sputtering of METAL FINISHING

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FEBRUARY

1996

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titanium. A method for coating a substrate with an alloy of nickel-chromium-iron won a patent for Kopacz et al. Bergmann obtained a patent for a method and apparatus for regulating the composition of a sputtered coating. Sputtering devices were the subject of patents granted to Moslehi, to Hosokawa and Kim, to Thwaites, to Sugano, to Scherer et al., to Lampkin, to Sieck et al., to Hurwitt et al., to Manley, to Latz, to Harra and Hartsough, to Kugler, to Sato et al., to Krause and Wojewoda, to Mukai and Takakura, and to Yoshikawa. Bouchard and Dittmar patented a method for nondestructively testing a sputtering target. A device for measuring target consumption earned a patent for Eggers and Langowski. Hartig et al. obtained a patent for a tubular cathode. Sputtering targets were the subject of patents granted to La1 and Shinohara, to Szczyrbowski, to Drehman and Hale, to Makowiecki et al., to Demaray et al., to Mashima and Tamura, to Marx, to Satou et al., and to Shinneman and Hurwitt. Kamei and Setoyama obtained a patent for a device for exchanging a target in an in-line sputtering apparatus. A rotatable magnetron including a replacement target structure won a patent for Bower. References Ahmed, N.A.G., U.S. Patent 5,427,671; assignor to Applied Vision Ltd. Anschel, M., U.S. Patent 5,372,685; assignor to IBM Corp. Arledge, J.K., et al., U.S. Patent 5,382,471; assignors to Motorola Inc. Arnold, M., et al., U.S. Patent 5,423,971; assignors to Leybold AG Baldwin, D.A., and S. Falabella, Society of Vacuum Coaters 38th Annual Technical Conference, Chicago, April 1995, p. 309 Barton, C.L., and R.B. McGraw, U.S. Patent 5,413.687; assignors to Rogers Corp. Bergmann, E., U.S. Patent 5,413,684; assignor to Balzers AG Bischer, C.B., and E.A. Small, U.S. Patent 5,395,662; assignors to Dielectric Coating Ind. Bouchard, F., and M.B. Dittmar, U.S. Patent 5,406,850; assignor to Tosoh SMD Inc. Bower, J.H., U.S. Patent 5,445,721; assignor to BOC Group Brauer, G., et al., U.S. Patent 5,372,693; assignors to Leybold AG Bruce, R.W., et al., U.S. Patent 5,418,003; assignors to General Electric Co. Buhl, R., and C. Hasler, U.S. Patent 5.387.326; assignors to Balzers AG Dearnaley, G., U.S. Patent 5,393,572; assignor to Southwest Research Institute

30

Demaray, R.E., et al., U.S. Patent 5,433,835; assignors to Applied Materials Inc. Drehman, A.J., and W.M. Hale, U.S. Patent 5,378,341; assignors to U.S.A. (Secretary of the Air Force) Durant, J.H., Metal Finishing, 93(3):27; 1995 Eggers, G.F., and H-C. Langowski, U.S. Patent 5,380,419; assignors to U.S. Philips Corp., and Du Pont Optical Co. Eisfeller, R.C., and J. Clark, U.S. Patent 5.384,161; assignors to Davidson Textron Inc. Frankenthal, R.P., et al., U.S. Patent 5,356,526; assignors to AT&T Bell Labs. Glocker, D.A., Society of Vacuum Coaters 38th Annual Technical Conference, Chicago, April 1995, p. 298 Gorokhovsky, V.I., U.S. Patent 5,435,900 Harra, D.J., and L.D. Hartsough, U.S. Patent 5,417,833; assignors to Varian Assoc. Inc. Hartig, K., and J. Szczyrbowski (I), U.S. Patent 5,382,126; assignors to Leybold AG Hartig, K., and J. Szczyrbowski (II), U.S. Patent 5,427,665; assignors to Leybold AG Hartig, K., et al., U.S. Patent 5,364,518; assignors to Leybold AG Hosokawa, N., and K. Kim, U.S. Patent 5,382,344; assignors to Anelva Corp. Huang, D-R., et al., U.S. Patent 5,382,345; assignors to Indl. Tech. Res. Inst. and Natl. Tsing Hua Univ. Hurwitt, S., et al., U.S. Patent 5,409,590; assignors to Materials Research Corp. Jarry, P., U.S. Patent 5,377,742; assignor to Pechiney Recherche Kamei, M., and E. Setoyama, U.S. Patent 5,429,729; assignors to Hitachi Ltd. Kempf, S., U.S. Patent 5,407,314; assignor to Leybold AG Kirchhoff, V., Society of Vacuum Coaters 38th Annual Technical Conference, Chicago, April 1995, p. 303 Kopacz, U., U.S. Patent 5,407,548; assignors to Leybold AG and Degussa AG Krause, D.L., and D.C. Wojewoda, U.S. Patent 5,441,614; assignors to AT&T Corp. Kugler, E., U.S. Patent 5,423,970; assignor to Balzers AG Kukla, R., et al., Society of Vacuum Coaters 38th Annual Technical Conference, Chicago, April 1995, p. 340 Kunz, A., and E. Bergmann, U.S. Patent 5,415,694; assignors to Balzers AG Lal, B.B., and T. Shinohara, U.S. Patent 5,366,607; assignors to HMT Technology Corp. Lampkin, C.M., U.S. Patent 5,405,517 Latz, R., U.S. Patent 5,417,834; assignors to Leybold AG Lavine, R., Metal Finishing, 93(1):13; 1995 Lee, B. (I), 16th AESF/EPA Pollution Prevention and Control Conference, Kissimmee, Fla., Feb. 1995, p. 41 Lee, B. (II), Products Finishing, 60( 1):46; 1995 Legge, G., Products Finishing, 60(1):59; 1995 Leonhardt, G., et al., Society of Vacuum Coaters 38th Annual Technical Conference, Chicago, April 1995, p. 317 Lohwasser, W., U.S. Patent 5,436,035; assignor to Alusuisse-Lonza Services Ltd. Mahler, P., U.S. Patent 5,376,180; assignor to Leybold AG

Mahler, P., and W. Stang, U.S. Patent 5,429,705; assignors to Leybold AG Makowiecki, D.M., et al., U.S. Patent 5,428,882; assignors to Regents of the Univ. of Calif. Manley, B.W., U.S. Patent 5,415,754; assignors to Sierra Applied Sciences Inc. Marx, D.R., U.S. Patent 5,439,500; assignor to Materials Research Corp. Mashima, M., and J. Tamura, US. Patent 5,435,965; assignors to Mitsubishi Materials Corp. Matsumaru, S., et al., U.S. Patent 5,431,794; assignors to Nissin Electric Co. Meletis, E., U.S. Patent 5,443,663; assignor to Brd. of Supv. Louisiana St. Univ. and Agricult. and Mech. College Minato, M. (I), Society of Vacuum Coaters 38th Annual Technical Conference, Chicago, April 1995, p. 334 Minato, M. (II), Metal Finishing, 93(9):50; 1995 Moslehi, M.M., U.S. Patent .5,354,443; assignor to Texas Instruments Inc. Mueller, M.A., et al., U.S. Patent 5,427,666; assignors to Applied Materials Inc. Mukai, Y., and H. Takakura; U.S. Patent 5441,615; assignors to Canon KK Nagaoka, H., and H. Kanno, U.S. Patent 5,447,803; assignors to Niigata Engineering Co. Ltd. Narasimhan, S.L., et al., U.S. Patent 5,441,235; assignors to Eaton Corp. Plaisted, A.H., Society of Vacuum Coaters 38th Annual Technical Conference, Chicago, April 1995, p. 460 Sato, T., et al., U.S. Patent 5,427,668; assignors to Ricoh Co. Ltd. Satou, M., et al., U.S. Patent 5,447,616; assignors to KK Toshiba Scherer, M., et al., U.S. Patent 5,399,252; assignors to Leybold AG Schiller, S., Society of Vacuum Coaters 38th Annual Technical Conference, Chicago, April 1995, p. 293 Schulz, H., and E. Bergmann, U.S. Patent 5,447,804; assignors to Balzers AG Shinneman, EM., and S. Hurwitt, U.S. Patent 5,449,445; assignors to Materials Research Corp. Sichmann, E., et al., U.S. Patent 5,403,663; assignors to Leybold AG Sieck, P.A., et al., U.S. Patent 5,407,551; assignors to BOC Group Inc. Srabian, G., Society of Vacuum Coaters 38th Annual Technical Conference, Chicago, April 1995, p. 331 Stevenson, D.E., U.S. Patent 5,421,979; assignor to Photran Corp. Sugano, Y., U.S. Patent 5,393,398; assignor to Sony Corp. Szczyrbowski, J., U.S. Patent 5,372,694; assignor to Leybold AG Szczyrbowski, J., et al., U.S. Patent 5,415,757; assignors to Leybold AG Thwaites, M.J., U.S. Patent 5,384,021; assignor to BOC Group Inc. Tsuji, K., U.S. Patent 5,380,420; assignor to KK Seiko Sho Yoshikawa, T., U.S. Patent 5,449,444; assignor to Canon KK Zejda, J. (I), U.S. Patent 5,354,380; assignor to Leybold AG Zejda, J. (II), U.S. Patent 5,439,522; assignor to Leybold AG

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METALLIZATION OF NONCONDUCTORS AND ELECTROLESS PLATING The evolution of electroless plating processes to meet ever more demanding surface properties was addressed by Baudrand and Bengston. Yoshiki et al. determined the reaction mechanism of electroless metal deposition on glass using a thin film of zinc oxide. Silver metallization for advanced electronic interconnections was the subject of a paper presented by Stepniak et al. Sodervall and Lundeberg patented a method for deposition of silver on a nonconductive substrate for a medical device. A process for the deposition of copper on a catalytically activated surface won a patent for Soltys. New methods for circuit fabrication on polytetrafluoroethylene (PTFE) substrates were discussed by Howard et al. Matsuda et al. studied the effect of surfactants on the suspension of PTFE particles in electroless plating solutions. Feldstein and Dumas obtained a patent for a method of stabilizing a particulate dispersion prior to metallization of a surface. An electroplated thermoplastic grille with improved flexibility garnered a patent for Chase. Ogisu et al. patented a resin product with a decorative plate. A direct metallization process for a plastic substrate earned a patent for Conrod and Sutcliffe. Schrott et al. described a laser-assisted seeding process for electroless plating on polyimide surfaces. A palladium salt solution for selective seeding of metallic interconnections on polyimide dielectrics won a patent for Kaja et al. Rychwalski et al. obtained a patent for a conditioning process for electroless plating of polyetherimides. A metallized polymer textile article was the subject of a patent granted to Silverman. Burch et al. (I and II) garnered a pair of patents for electroless plating of aramid surfaces. Processes for electroless plating of aramid fibers were also the subject of two patents awarded to Hsu (I and II). Rieger patented a process for preparing light metals for electroless plating. A method for selectively providing a pattern on glass by electroless metallization won a patent for De Bakker 32

et al. Wong obtained a patent for a method of electrolessly depositing metals on a silicon substrate. A method for electroless metallization of optical fibers having a silica containing surface was patented by Filas and Jankoski. Legierse et al. received a patent for a method of metallizing a master disk. Metallization processes were also the subject of patents granted to Gottesfeld and Uribe, to Wolf et al., to Straus, to Thorn et al., to Calvert et al., to Bernards et al., to Allardyce et al., to Fisher et al., to Stamp et al., and to Giesecke et al. A metallizable substrate for printed circuit boards was patented by Kawamoto et al. Asrar obtained a patent for a polymeric film that can be selectively activated by heating. A process for reforming and maintaining an electroless plating bath earned a patent for Vaughan. Conrod et al. received a patent for a method of regenerating a post-activator solution for reuse. References Allardyce, G.R., et al., U.S. Patent 5,415,762; assignors to Shipley Co. Inc. Asrar, J., U.S. Patent 5,424,009; assignors to Monsanto Corp. Baudrand, D., and J. Bengsten, Metrrl Finishin
Kawamoto, M., et al., U.S. Patent 5,356,698; assignors to Hitachi Ltd. Legierae, P.E.J.. et al., US. Patent 5,403,625; assignors to U.S. Philips and Du Pont Optical co. Matsuda, H., et al., Trumactiomof the Institute of Metal Finishing.73( 1): 16; 1995 Ogisu, Y., et al., U.S. Patent 5,441,626; assignor to Toyoda Gosei Co. Ltd. Rieger, F., U.S. Patent 5,3X0,451 Rychwalski, J.E., et al., U.S. Patent 5,441,770; assignors to Shipley Co. Inc. Schrott, A.G., et al., Journa/ ofthe Electrochemical Society, 142(3):944; 1995 Silverman, B., U.S. Patent 5,411,795: assignor to Monsanto Co. Sodervall, B.V., and T. Lundeberg, U.S. Patent 5,395,651; assignors to Ad Tech Holdings Ltd. Soltys, J., U.S. Patent 5,419,926; assignor to Lilly London Inc. Stamp, L., et al., U.S. Patent 5,421,9X9; assignors to Atotech Deutschland GmbH Stepniak, F., et al., AESF SUR/FIN ‘95, Baltimore, June 1995, Session F, p. 151 Straus, M., U.S. Patent 5,387,332 Thorn, C.E., et al., U.S. Patent 5,3X9,270; assignors to Electrochemicals Inc. Vaughan, D.J., U.S. Patent 5,419,X21 Wolf, G.D., et al., U.S. Patent 5,378,268; assignors to Bayer AG Wong, K.H., U.S. Patent S.358.907; assignor to Xerox Corp. Yoshiki, H., et al, Joul-nal qf the Electrochrmical So&y, 142(2):428; 1995

Copper Deckert (I and II) provided a twopart review of electroless copper plating. The first part considered bath chemistry, deposit properties, and applications. The second part covered surface preparation, process controls, and environmental requirements. A monomolecular adsorption model for electroless copper plating was proposed by Shigematsu et al., who used a Monte Carlo simulation method. The effects of aeration and accumulation of carbonate on the mechanical properties of electroless copper deposits were reported by Matsuoka et al. Klebe patented a molded waveguide component incorporating an electroless copperplated surface. A method for electroless copper plating won a patent for Olson. Complexation equilibria for the copper-EDTA-cyanide system were studied by Monzyk et al. to determine the mechanism of electroless copper plating. A review of direct-plate methods for primary imaging of printed wiring boards was presented by Dietz (I and II), who compared them to electroless copper plating. New approaches to metallization of through holes in printed wiring boards were described METAL FINISHING

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FEBRUARY

1996