- Email: [email protected]
Wet sanding of dried paint, plastics, and the like
0.005 to 50% on the electrodeposited film, and then drying, said acylated polypeptide being solid at ambient room temperature.
Reduced Target
Stress Sputtering
U.S. Patent 5,474,667. Dec. 12, 1995 SD. Hutwit! et al., assignors to Materials Research Corp., Orangeburg, N. Y A method of sputtering an article in a sputtering chamber, comprising placing a sputtering taret in a region in which the backing plate has varying stiffness at different locations thereof correlated to different localized stresses experienced during sputtering at different locations within the target, thereby reducing the stresses in the sputtering target during sputtering.
A method of coating steel tooling for diecasting aluminum and aluminum alloys with an iron content of less than 0.6% iron, comprising cleaning the steel tooling, and applying a coating of chromium nitride to a thickness of at least 4 microns using a physical vapor deposition process.
BasecoatlClearcoat
A sanding liquid auxiliary composition that consists essentially of water and 1.O to 50% of dissolved polyol molecules selected from the group consisting of molecules that include from 2-6 carbon atoms and at least two-thirds as many hydroxyl groups as carbon atoms; and 0.540% of dissolved hydroxy terminated polyoxyethylene having a weight average molecular weight in the range from about 200 to about 4000; and, optionally, 0.01 to 5% total of surfactant.
U.S. Patent5,474,811. Dec. 12, 7995 J. W. Rehfuss and D.L. St. Aubin, assignors to BASF Corp., Southfield, Mich.
Method for Manufacture of Printed Circuit Boards U.S.Patent 5,474,798. Dec. 12, 1995 G.B. Larson et al., assignors Waterbury, Conn.
ding on both exterior surfaces; activating the holes to initiate and accept plating thereon; forming an image with a plating mask upon the exterior surfaces of the substrate, yielding masked surfaces and unmasked surfaces; cleaning the unmasked surfaces; thereafter plating the unmasked surfaces and the surfaces of the holes with an electroless nickel-boron deposit; thereafter plating electroless nickel-phosphorus deposits onto the nickel-boron deposits; thereafter stripping the plating mask to reveal exposed copper surfaces; and thereafter etching to remove the exposed copper surfaces; wherein the process occurs substantially without copper plating.
A composite color-plus-clear utilizing a carbamate-functional composition in the clearcoat.
to MacDermid Inc.,
coating polymer
Diecasting Tools U.S.Patent 5,476,134. Dec. 19, 1995
A process for producing
a printed circuit board, which process comprises forming holes in a substrate, which has copper clad-
N. Whittle et al, assignors to Aluminum Co. of America, Pittsburgh
Wet Sanding of Dried Paint, Plastics, and the Like U.S. Patent 5,476,411. Dec. 19, 1995 TD. Held, assignor fo /-/eke/ Corp., Plymouth Meeting, Pa.
ELECTROPLATING KNOW HOW BASICS A Iwo DAY nwme motmM
O1y7HEWbWWiUCl~ESOF EiEMROMlW@ Knowing the EXACT thickness of your coatings can be the difference between success or failure.
A A
That’s why you need to experience the revolutionary Minitest 100 & 300...the world’s smallest and quickest digital microprocessor coating thickness gauges. And to convince you, we’re offering to let _ you try one 14 days absolutely free! We have models for both ferrous and nonferrous substrate applications.
Cd/ or FAX Us For a Brochurell
So, call now. It’s a deal you can’t refuse.
Kushner Electroplating raining
ElektroPhysik Circle 030 on reader
METAL FINISHING
information
. SEPTEMBER
1996
card
Electroplaters
School
Since1947”
732 GlencoeCourt, Sunnyvale,California 94087 (408) 749-8652 . FAX:(408) 749-0176
Circle 054 on reader information
card
107
Reduced Target
Stress Sputtering
U.S. Patent 5,474,667. Dec. 12, 1995 SD. Hutwit! et al., assignors to Materials Research Corp., Orangeburg, N. Y A method of sputtering an article in a sputtering chamber, comprising placing a sputtering taret in a region in which the backing plate has varying stiffness at different locations thereof correlated to different localized stresses experienced during sputtering at different locations within the target, thereby reducing the stresses in the sputtering target during sputtering.
A method of coating steel tooling for diecasting aluminum and aluminum alloys with an iron content of less than 0.6% iron, comprising cleaning the steel tooling, and applying a coating of chromium nitride to a thickness of at least 4 microns using a physical vapor deposition process.
BasecoatlClearcoat
A sanding liquid auxiliary composition that consists essentially of water and 1.O to 50% of dissolved polyol molecules selected from the group consisting of molecules that include from 2-6 carbon atoms and at least two-thirds as many hydroxyl groups as carbon atoms; and 0.540% of dissolved hydroxy terminated polyoxyethylene having a weight average molecular weight in the range from about 200 to about 4000; and, optionally, 0.01 to 5% total of surfactant.
U.S. Patent5,474,811. Dec. 12, 7995 J. W. Rehfuss and D.L. St. Aubin, assignors to BASF Corp., Southfield, Mich.
Method for Manufacture of Printed Circuit Boards U.S.Patent 5,474,798. Dec. 12, 1995 G.B. Larson et al., assignors Waterbury, Conn.
ding on both exterior surfaces; activating the holes to initiate and accept plating thereon; forming an image with a plating mask upon the exterior surfaces of the substrate, yielding masked surfaces and unmasked surfaces; cleaning the unmasked surfaces; thereafter plating the unmasked surfaces and the surfaces of the holes with an electroless nickel-boron deposit; thereafter plating electroless nickel-phosphorus deposits onto the nickel-boron deposits; thereafter stripping the plating mask to reveal exposed copper surfaces; and thereafter etching to remove the exposed copper surfaces; wherein the process occurs substantially without copper plating.
A composite color-plus-clear utilizing a carbamate-functional composition in the clearcoat.
to MacDermid Inc.,
coating polymer
Diecasting Tools U.S.Patent 5,476,134. Dec. 19, 1995
A process for producing
a printed circuit board, which process comprises forming holes in a substrate, which has copper clad-
N. Whittle et al, assignors to Aluminum Co. of America, Pittsburgh
Wet Sanding of Dried Paint, Plastics, and the Like U.S. Patent 5,476,411. Dec. 19, 1995 TD. Held, assignor fo /-/eke/ Corp., Plymouth Meeting, Pa.
ELECTROPLATING KNOW HOW BASICS A Iwo DAY nwme motmM
O1y7HEWbWWiUCl~ESOF EiEMROMlW@ Knowing the EXACT thickness of your coatings can be the difference between success or failure.
A A
That’s why you need to experience the revolutionary Minitest 100 & 300...the world’s smallest and quickest digital microprocessor coating thickness gauges. And to convince you, we’re offering to let _ you try one 14 days absolutely free! We have models for both ferrous and nonferrous substrate applications.
Cd/ or FAX Us For a Brochurell
So, call now. It’s a deal you can’t refuse.
Kushner Electroplating raining
ElektroPhysik Circle 030 on reader
METAL FINISHING
information
. SEPTEMBER
1996
card
Electroplaters
School
Since1947”
732 GlencoeCourt, Sunnyvale,California 94087 (408) 749-8652 . FAX:(408) 749-0176
Circle 054 on reader information
card
107