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Thermal characterization of a tape carrier packages
548
World abstracts on microelectronics and reliability
(typical thin film design rules). With the exposure being a mask projection, mask damage and subsequent yield problems are generally avoided.
Electrical design of an MCM package for a multi-processor digital system. ALl SAFARAZ et al. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(1), 127 (February 1995). The electrical design of a Ceramic Multichip Module (MCM-C) CPU node for a multiprocessor parallel system have been presented. The electrical performance of the package has been evaluated through modeling and simulation using models that provide both qualitative as well as quantitative measures on signal integrity, coupled noise and switching noise that are required to guarantee proper system operation. Details on the techniques used to optimize the MCM package have also been explained in this paper.
Liquid cooling performance for a 3D multichip module and miniature heat sink. MARLIN R~ VOGEL. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, 18(1), 68 (March 1995). Measured thermal performance is presented for a single phase liquid-cooled module. Tape automated bonded (TAB) thermal test chips and their associated substrates are stacked in a compact, 3D liquid-tight module. A dielectric liquid, polyalphaolefin (PAO), is forced to flow past the active and inactive sides of TAB chips. At a volumetric flowrate of 0.05 gallons per minute (gpm) and an estimated pressure loss less than 0.5 psi, the measured junction-to-liquid thermal resistance is 2.0 C/W for a 0.50 in × 0.50 in x 0.015 in thermal test chip. The thermal resistance was also measured for an indirect liquid-cooling approach. PAO was used to cool a miniature sink mounted directly to a 0.50 in x 0.50 in heat source. The heat source was used to simulate the thermal characteristics of a chip carrier package [1]. The overall dimension of the liquid heat sink is 1.0 in x 1.0 in x 0.28 in. The measured junction-to-liquid thermal resistance is 0.52 C/W for a flowrate of 0.05 gpm, and for an estimated pressure loss less than 1.0 psi. Numerical computational techniques yielded results which were comparable to the measured thermal resistances for both the 3D module and the miniature heat sink. Enhanced thermal performance gained by introducing microencapsulated phase change material (microPCM) to the PAO is estimated for both the 3D module and the miniature heat sink I-2]. MCM-L Technology: a systems cost analysis for a high volume automotive electronic application. JOHN L. EVANS, LARRY E. BOSLEY, CHRIS S. R O M A N C Z U K and R. WAYNE JOHNSON. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(1), 28 (February 1995). Cost concerns related to the development and manufacturability of multichip modules have limited the widespread use of MCM's for high-volume,
low-cost applications. This paper discusses the many elements necessary to evaluate fully the financial effects of MCM programs. In particular, this paper evaluates a development program for a multichip module design targeted for a high volume automotive electronics control module. Often the added material costs associated with multichip modules prohibit MCM usage for low cost applications. This paper deals with the overall costs and savings associated with MCM development. While each decision to incorporate MCM's within a product design must be made individually, the analysis detailed below provides considerable insight into the overall systems cost involved with MCM's.
Thermal characterization of a tape carrier package. D. ELAINE POPE. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part ,4, 18(1), 75 (March 1995). The unenhanced thermal performance of 20 mm Tape Carrier Packages (TCP) packages on 8 layer boards with internal planes is 19°C/W. Package thermal resistance ®jr has been measured at 2 ° C/W. Simple PCB enhancements such as the addition of thermal vias, alone or with the use of low profile heat sinks, brings the thermal performance in line with requirements for mobile computing platforms which do not have forced convection cooling options available. With forced convection cooling, devices with power dissipation requirement of 5~ C/W and higher can be packaged in TCP format.
Substrate thickness optimization for liquid immersion cooled silicon multiehip modules. M EHDI AZIMI and RICHARD C. JAEGER. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(1), 144 (February 1995). Liquid immersion cooling represents a potential method for meeting the requirements for removal of increasingly high heat fluxes from microelectronic packages. This work explores immersion cooling of densely packed silicon multichip modules and demonstrates that an optimum substrate thickness exists which minimizes the temperature rise at the integrated circuit die sites. A number of examples are given for a range of die sizes, spacings and heat flux conditions based upon the heat transfer characteristics of R-22. At high flux, the required substrate thickness is considerably larger than that of a standard silicon wafer. The techniques developed are applicable to analysis of other coolants and substrate materials.
Development of a plastic encapsulated multichip technology for high volume, low cost commercial electronics. RAYMOND A. F I L L I O N et al. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(1), 59 (February 1995). Non-military/noncomputer electronics industry segments such as PC's, workstations, portable electronics, the automotive and medical industries, automated test equipment, and high-end consumer
World abstracts on microelectronics and reliability
(typical thin film design rules). With the exposure being a mask projection, mask damage and subsequent yield problems are generally avoided.
Electrical design of an MCM package for a multi-processor digital system. ALl SAFARAZ et al. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(1), 127 (February 1995). The electrical design of a Ceramic Multichip Module (MCM-C) CPU node for a multiprocessor parallel system have been presented. The electrical performance of the package has been evaluated through modeling and simulation using models that provide both qualitative as well as quantitative measures on signal integrity, coupled noise and switching noise that are required to guarantee proper system operation. Details on the techniques used to optimize the MCM package have also been explained in this paper.
Liquid cooling performance for a 3D multichip module and miniature heat sink. MARLIN R~ VOGEL. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, 18(1), 68 (March 1995). Measured thermal performance is presented for a single phase liquid-cooled module. Tape automated bonded (TAB) thermal test chips and their associated substrates are stacked in a compact, 3D liquid-tight module. A dielectric liquid, polyalphaolefin (PAO), is forced to flow past the active and inactive sides of TAB chips. At a volumetric flowrate of 0.05 gallons per minute (gpm) and an estimated pressure loss less than 0.5 psi, the measured junction-to-liquid thermal resistance is 2.0 C/W for a 0.50 in × 0.50 in x 0.015 in thermal test chip. The thermal resistance was also measured for an indirect liquid-cooling approach. PAO was used to cool a miniature sink mounted directly to a 0.50 in x 0.50 in heat source. The heat source was used to simulate the thermal characteristics of a chip carrier package [1]. The overall dimension of the liquid heat sink is 1.0 in x 1.0 in x 0.28 in. The measured junction-to-liquid thermal resistance is 0.52 C/W for a flowrate of 0.05 gpm, and for an estimated pressure loss less than 1.0 psi. Numerical computational techniques yielded results which were comparable to the measured thermal resistances for both the 3D module and the miniature heat sink. Enhanced thermal performance gained by introducing microencapsulated phase change material (microPCM) to the PAO is estimated for both the 3D module and the miniature heat sink I-2]. MCM-L Technology: a systems cost analysis for a high volume automotive electronic application. JOHN L. EVANS, LARRY E. BOSLEY, CHRIS S. R O M A N C Z U K and R. WAYNE JOHNSON. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(1), 28 (February 1995). Cost concerns related to the development and manufacturability of multichip modules have limited the widespread use of MCM's for high-volume,
low-cost applications. This paper discusses the many elements necessary to evaluate fully the financial effects of MCM programs. In particular, this paper evaluates a development program for a multichip module design targeted for a high volume automotive electronics control module. Often the added material costs associated with multichip modules prohibit MCM usage for low cost applications. This paper deals with the overall costs and savings associated with MCM development. While each decision to incorporate MCM's within a product design must be made individually, the analysis detailed below provides considerable insight into the overall systems cost involved with MCM's.
Thermal characterization of a tape carrier package. D. ELAINE POPE. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part ,4, 18(1), 75 (March 1995). The unenhanced thermal performance of 20 mm Tape Carrier Packages (TCP) packages on 8 layer boards with internal planes is 19°C/W. Package thermal resistance ®jr has been measured at 2 ° C/W. Simple PCB enhancements such as the addition of thermal vias, alone or with the use of low profile heat sinks, brings the thermal performance in line with requirements for mobile computing platforms which do not have forced convection cooling options available. With forced convection cooling, devices with power dissipation requirement of 5~ C/W and higher can be packaged in TCP format.
Substrate thickness optimization for liquid immersion cooled silicon multiehip modules. M EHDI AZIMI and RICHARD C. JAEGER. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(1), 144 (February 1995). Liquid immersion cooling represents a potential method for meeting the requirements for removal of increasingly high heat fluxes from microelectronic packages. This work explores immersion cooling of densely packed silicon multichip modules and demonstrates that an optimum substrate thickness exists which minimizes the temperature rise at the integrated circuit die sites. A number of examples are given for a range of die sizes, spacings and heat flux conditions based upon the heat transfer characteristics of R-22. At high flux, the required substrate thickness is considerably larger than that of a standard silicon wafer. The techniques developed are applicable to analysis of other coolants and substrate materials.
Development of a plastic encapsulated multichip technology for high volume, low cost commercial electronics. RAYMOND A. F I L L I O N et al. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(1), 59 (February 1995). Non-military/noncomputer electronics industry segments such as PC's, workstations, portable electronics, the automotive and medical industries, automated test equipment, and high-end consumer