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4734641 Method for the thermal characterization of semiconductor packaging systems
1000
New patents
4730316 DIGITAL INTEGRATED CIRCUITS Peter L L Desyllas, Finbar Naven, Wilmslow, United Kingdom assigned to International Computers Limited A digital integrated circuit is described in which the internal registers are organized into a number of serial shift paths to facilitate testing. Each path has a number of modes: USER, HOLD, SHIFT and SELF-TEST modes. These modes are controlled by shifting a control function into a control shift register. When the shifting of the control shift register stops, a command is automatically loaded from the control shift register (or another source) into a command register, which controls the serial shift paths. The provision of a separate command register allows a new control function to be shifted into the control shift register while a preceding command is still active in the command register.
4730317 DIGITAL INTEGRATED CIRCUITS Peter L L Desyllas, Finbar Naven, Wilmslow, United Kingdom assigned to International Computers Limited A digital integrated circuit is described in which the internal registers are organized into a number of serial shift paths to facilitate testing. Each path has a number of modes; USER, HOLD, SHIFT and SELF-TEST modes. Shifting of a path is achieved by putting the path into HOLD mode and then, at each of a series of transfer pulses (TR), putting the path into shift mode for one clock beat. This allows the shifting to be performed at a lower rate than the internal clock rate of the chip; in particular, it can be performed at a rate compatible with a relatively slow diagnostic processor.
4730749 SINGULATORY APPARATUS Jonathan Buesing, James P Buettner assigned to Micro Component Technology Inc The device of this invention is an integrated circuit singulator apparatus comprised of several arm assemblies (14, 18, 34) which act in concert to isolate or singulate an individual integrated
circuit for testing of the accuracy of the circuits therein. This integrated circuit handler can accommodate integrated circuits of varying dimensions. The various arm assemblies (14, 18, 34) act to control movement of the integrated circuit devices on a track (12) without damage occurring to the integrated circuit devices.
4731759 INTEGRATED CIRCUIT WITH BUILT-IN INDICATOR OF INTERNAL REPAIR Takayuk Watanabe, Tokyo, Japan assigned to NEC Corporation A circuit for providing an identification signal indicative of whether or not an semiconductor device has a repaired or replaced portion therein. The circuit is enabled by a control signal which is used for controlling the semiconductor device and causes a change in power supply current flowing into the semiconductor device according to presence or absence of the repaired or replaced portion.
4734641 METHOD FOR THE THERMAL CHARACTERIZATION OF SEMICONDUCTOR PACKAGING SYSTEMS Dee Byrd, Michael Williams assigned to Tektronix Inc A method for determining the thermal characteristics of a semiconductor packaging system is provided which uses a platinum resistor test unit. The platinum resistor is preferably sized to approximate the dimensions of the semiconductor device for which the package was designed, and is installed within the package. The packaged resistor is then thermally calibrated at a plurality of temperature levels to generate a linear temperature versus resistance graph or equation corresponding thereto. Next, voltage is applied to the packaged resistor causing such resistor to self heat. Its resistance is calculated, and the temperature corresponding thereto is obtained from the graph or equation. Such temperature is the surface temperature of the resistor. This temperature may then be used to calculate the temperature gradient from the inside of the package to any reference point on or near the outside of the package, the temperature of which has been previously determined.
New patents
4730316 DIGITAL INTEGRATED CIRCUITS Peter L L Desyllas, Finbar Naven, Wilmslow, United Kingdom assigned to International Computers Limited A digital integrated circuit is described in which the internal registers are organized into a number of serial shift paths to facilitate testing. Each path has a number of modes: USER, HOLD, SHIFT and SELF-TEST modes. These modes are controlled by shifting a control function into a control shift register. When the shifting of the control shift register stops, a command is automatically loaded from the control shift register (or another source) into a command register, which controls the serial shift paths. The provision of a separate command register allows a new control function to be shifted into the control shift register while a preceding command is still active in the command register.
4730317 DIGITAL INTEGRATED CIRCUITS Peter L L Desyllas, Finbar Naven, Wilmslow, United Kingdom assigned to International Computers Limited A digital integrated circuit is described in which the internal registers are organized into a number of serial shift paths to facilitate testing. Each path has a number of modes; USER, HOLD, SHIFT and SELF-TEST modes. Shifting of a path is achieved by putting the path into HOLD mode and then, at each of a series of transfer pulses (TR), putting the path into shift mode for one clock beat. This allows the shifting to be performed at a lower rate than the internal clock rate of the chip; in particular, it can be performed at a rate compatible with a relatively slow diagnostic processor.
4730749 SINGULATORY APPARATUS Jonathan Buesing, James P Buettner assigned to Micro Component Technology Inc The device of this invention is an integrated circuit singulator apparatus comprised of several arm assemblies (14, 18, 34) which act in concert to isolate or singulate an individual integrated
circuit for testing of the accuracy of the circuits therein. This integrated circuit handler can accommodate integrated circuits of varying dimensions. The various arm assemblies (14, 18, 34) act to control movement of the integrated circuit devices on a track (12) without damage occurring to the integrated circuit devices.
4731759 INTEGRATED CIRCUIT WITH BUILT-IN INDICATOR OF INTERNAL REPAIR Takayuk Watanabe, Tokyo, Japan assigned to NEC Corporation A circuit for providing an identification signal indicative of whether or not an semiconductor device has a repaired or replaced portion therein. The circuit is enabled by a control signal which is used for controlling the semiconductor device and causes a change in power supply current flowing into the semiconductor device according to presence or absence of the repaired or replaced portion.
4734641 METHOD FOR THE THERMAL CHARACTERIZATION OF SEMICONDUCTOR PACKAGING SYSTEMS Dee Byrd, Michael Williams assigned to Tektronix Inc A method for determining the thermal characteristics of a semiconductor packaging system is provided which uses a platinum resistor test unit. The platinum resistor is preferably sized to approximate the dimensions of the semiconductor device for which the package was designed, and is installed within the package. The packaged resistor is then thermally calibrated at a plurality of temperature levels to generate a linear temperature versus resistance graph or equation corresponding thereto. Next, voltage is applied to the packaged resistor causing such resistor to self heat. Its resistance is calculated, and the temperature corresponding thereto is obtained from the graph or equation. Such temperature is the surface temperature of the resistor. This temperature may then be used to calculate the temperature gradient from the inside of the package to any reference point on or near the outside of the package, the temperature of which has been previously determined.