- Email: [email protected]
Acoustic microscopy improves internal reliability of IC packaging
Microelectron. Reliab., Vol. 25, No. 6, pp. 1159 1174, 1985. Printed in Great Britain.
0026-2714/85/$3.00+ .00 Pergamon Press Ltd.
WORLD ABSTRACTS O N MICROELECTRONICS A N D RELIABILITY The abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the article. They are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections. Subjects 1. Reliability--General. 2. Reliability of Components, Tubes, Transistors and ICs. 3. Circuit and Systems Reliability, Maintenance and Redundancy. 4. Microelectronics--General. 5. Microelectronics Design and Construction. 6. Microelectronics--Components,Systems and Equipments. 7. Semiconductor Integrated Circuits, Devices and Materials. 8. Thick- and Thin-Film Components, Hybrid Circuits and Materials. 9. Electron, Ion and Laser Beams.
1. R E L I A B I L I T Y - - G E N E R A L
Computer contracts: negotiating user protection. WILLIAMH. VOLZ and LARRYG. MUMFORD.d. Products Liability 7, 247 (1984). The computer companies serving the American market clearly appreciate the finer points of drafting the standard form contract. These form contracts put virtually all of the risk of a failed computer procurement on the computer user. Managers purchasing a computer system should understand that by signing the vendor's form contract without modification, they may well be entrusting the heart
2. R E L I A B I L I T Y
OF COMPONENTS,
Reliability of liquid crystal display. KENJI
KITAGAWA,
KAZUHISA TORIYAMA and YOJI KANUMA. IEEE Trans. Reliab. R-33, 213 (1984). This paper reports the reliability of twisted nematic liquid-crystal display for basic applications such as watches and calculators. We have studied significant stress factors such as voltage, temperature and humidity, and their corresponding failure modes. The main failure mode is LCD misalignment; many different modes appear corresponding to different stress conditions as well as material and process for the LCD. We have analyzed the accelerated test results by Weibull distribution, elucidated accelerating factors, and estimated life time. The life is inversely proportional to 1.78-2.45 power of applied voltage, depending upon misalignment modes. The distribution of life is well expressed by Weibuli distribution with shape parameter between 2.5-3.0, and proportional to the square of coefficient of variation of life. We conclude that the acceleration factors could be determined and 99.9 ~o of tested displays will live more than 10yr. The knowledge on reliability of LCD can be now applied to new fields of LCD, such as industrial use, home appliance, and automotive instruments.
Maturity factors in predicting failure rate for linear integrated circuits. DRAGANM. PANTIC.IEEE Trans. Reliab. R-33, 208
of their business operation to an outsider that will admit to little or no liability if the new computer fails. Often, computer users pay the price for failed computer systems. By simply accepting the vendor's form contract, computer users have exposed themselves to dramatic losses. Even those users that have successfully procured computer systems in the past would do well to be cautious in their future purchases.
TUBES, TRANSISTORS
AND ICs
available failure rate models be modified by including two maturity factors: date code factor (technology maturity in general) manufacturer's factor (maturity of specific manufacturer) This paper is based on tests performed on more than 18000 linear ICs (integrated circuits) manufactured by National Semiconductor and on comparative tests performed on more than 2500 linear parts from other IC manufacturers. This paper offers date code factors which could be used in prediction of failure rates for linear IC's. It also offers manufacturer's factor for devices manufactured by National Semiconductor. However, offered date code factors and manufacturer's factor are only indicative, and given values should be confirmed or improved by further investigations. This paper deals mostly with prediction of failure rates for linear ICs. But the same approach for developing date code factors and manufacturer's factors could be used for developing similar factors for other ICs (besides linear), and for other manufacturers.
Acoustic microscopy improves internal reliability of IC packaging. THOMAS E. ADAMS. Semiconductor Int. 100 (February 1985). Scanning laser acoustic microscopy examines the packaged IC for a variety of physical defects nondestructively.
(1984). There are differences between failure rates obtained A CMOS LSSD test generation system. D. LEET,P. SHEARON from test results, and failure rates obtained from the failure and R. FRANCE.I B M J. Res. Dev. 28, 625 (1984). Automatic rate models. In some cases, failure rates obtained from failure test pattern generators based on the stuck-fault concept rate models are 10-50 times larger (worse) than failure rates are theoretically inadequate in their ability to generate test obtained through testing of the same devices. This indicates patterns for CMOS circuits. A new set of pin faults, called that the available failure rate models need some modification. CMOS faults, is discussed that can represent the necessary It is not the intent of this paper to disqualify the available test pattern sequences for these circuits. Processing of these failure rate models. This paper suggests only that the 1159 MR 25:6-J
0026-2714/85/$3.00+ .00 Pergamon Press Ltd.
WORLD ABSTRACTS O N MICROELECTRONICS A N D RELIABILITY The abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the article. They are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections. Subjects 1. Reliability--General. 2. Reliability of Components, Tubes, Transistors and ICs. 3. Circuit and Systems Reliability, Maintenance and Redundancy. 4. Microelectronics--General. 5. Microelectronics Design and Construction. 6. Microelectronics--Components,Systems and Equipments. 7. Semiconductor Integrated Circuits, Devices and Materials. 8. Thick- and Thin-Film Components, Hybrid Circuits and Materials. 9. Electron, Ion and Laser Beams.
1. R E L I A B I L I T Y - - G E N E R A L
Computer contracts: negotiating user protection. WILLIAMH. VOLZ and LARRYG. MUMFORD.d. Products Liability 7, 247 (1984). The computer companies serving the American market clearly appreciate the finer points of drafting the standard form contract. These form contracts put virtually all of the risk of a failed computer procurement on the computer user. Managers purchasing a computer system should understand that by signing the vendor's form contract without modification, they may well be entrusting the heart
2. R E L I A B I L I T Y
OF COMPONENTS,
Reliability of liquid crystal display. KENJI
KITAGAWA,
KAZUHISA TORIYAMA and YOJI KANUMA. IEEE Trans. Reliab. R-33, 213 (1984). This paper reports the reliability of twisted nematic liquid-crystal display for basic applications such as watches and calculators. We have studied significant stress factors such as voltage, temperature and humidity, and their corresponding failure modes. The main failure mode is LCD misalignment; many different modes appear corresponding to different stress conditions as well as material and process for the LCD. We have analyzed the accelerated test results by Weibull distribution, elucidated accelerating factors, and estimated life time. The life is inversely proportional to 1.78-2.45 power of applied voltage, depending upon misalignment modes. The distribution of life is well expressed by Weibuli distribution with shape parameter between 2.5-3.0, and proportional to the square of coefficient of variation of life. We conclude that the acceleration factors could be determined and 99.9 ~o of tested displays will live more than 10yr. The knowledge on reliability of LCD can be now applied to new fields of LCD, such as industrial use, home appliance, and automotive instruments.
Maturity factors in predicting failure rate for linear integrated circuits. DRAGANM. PANTIC.IEEE Trans. Reliab. R-33, 208
of their business operation to an outsider that will admit to little or no liability if the new computer fails. Often, computer users pay the price for failed computer systems. By simply accepting the vendor's form contract, computer users have exposed themselves to dramatic losses. Even those users that have successfully procured computer systems in the past would do well to be cautious in their future purchases.
TUBES, TRANSISTORS
AND ICs
available failure rate models be modified by including two maturity factors: date code factor (technology maturity in general) manufacturer's factor (maturity of specific manufacturer) This paper is based on tests performed on more than 18000 linear ICs (integrated circuits) manufactured by National Semiconductor and on comparative tests performed on more than 2500 linear parts from other IC manufacturers. This paper offers date code factors which could be used in prediction of failure rates for linear IC's. It also offers manufacturer's factor for devices manufactured by National Semiconductor. However, offered date code factors and manufacturer's factor are only indicative, and given values should be confirmed or improved by further investigations. This paper deals mostly with prediction of failure rates for linear ICs. But the same approach for developing date code factors and manufacturer's factors could be used for developing similar factors for other ICs (besides linear), and for other manufacturers.
Acoustic microscopy improves internal reliability of IC packaging. THOMAS E. ADAMS. Semiconductor Int. 100 (February 1985). Scanning laser acoustic microscopy examines the packaged IC for a variety of physical defects nondestructively.
(1984). There are differences between failure rates obtained A CMOS LSSD test generation system. D. LEET,P. SHEARON from test results, and failure rates obtained from the failure and R. FRANCE.I B M J. Res. Dev. 28, 625 (1984). Automatic rate models. In some cases, failure rates obtained from failure test pattern generators based on the stuck-fault concept rate models are 10-50 times larger (worse) than failure rates are theoretically inadequate in their ability to generate test obtained through testing of the same devices. This indicates patterns for CMOS circuits. A new set of pin faults, called that the available failure rate models need some modification. CMOS faults, is discussed that can represent the necessary It is not the intent of this paper to disqualify the available test pattern sequences for these circuits. Processing of these failure rate models. This paper suggests only that the 1159 MR 25:6-J