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Anodically oxidized scandium-doped aluminum wiring
Granted in the Metal Finishing
Field
Printed copies of patents are furnished by the Patent and Trademark Office for $3.00 each. Address orders to: Commissioner of Patents and Trademarks, Washington, D.C. 20231.
SELECTWE PATTERNING ON A DIELECTRIC SUBSTRATE
U.S. Patent 5,830,533. Nov. 3, 1998 C. W.C. Lin and R.L. German, assignors to MicroeEectronics and Computer Technology Corp., Austin, Texas A method of selectively patterning metal on a dielectric substrate comprising depositing a seed layer on a dielectric substrate wherein the seed layer is autocatalytic to an electrically conductive metal whereas the dielectric substrate is nonautocatalytic to the metal; overlaying a resist mask on the seed layer wherein the resist mask has a pattern, which covers portions of the seed layer whereas a plurality of openings in the resist mask expose other portions of the seed layer; etching the exposed portions of the seed layer; removing the resist mask thereby exposing the unetched portions of the seed layer, which correspond to the pattern of the resist mask; and depositing the metal on the unetched portions of the seed layer without depositing the metal on the dielectric substrate and without using a mask, wherein the deposited metal corresponds to the pattern and the seed layer provides adhesion between the dielectric substrate and the deposited metal.
paratory substance, and then electrostatically painted, the improvement comprising preparing the polymer from a polymer formulation including materials that include or form urea groups, urethane groups, or mixtures thereof and a nonvolatile metal salt conductivity inducing material, wherein the nonvolatile metal salt excludes metal salts of thiocyanates. COATING CONTAINING
PAlNTlNG
U.S. Patent 5,830,541. Nov. 3, 1998 R. Carswell et al., assignorsto The DOWChemical Co., Midland, Mich. A process of electrostatically painting a cured urea and/or urethane group containing polymer wherein the polymer is formed into a shaped article, coated with a conductive pre82
MICA
IJ.S. Patent 5,830,567. NOV. 3, 1998 S. Panush, assignor to BASF Corp., Southfield, Mich. A nonmetallic coating composition comprising a polymeric binder and a pigment comprising a mica in an amount so that mica produces added color without producing an opalescent or metallic effect or color travel. PAINTED
SHEET
METAL
IJ.S. Patent 5,830,fiRO.Nov. 3, 1998 TJ.Flammer et al., assignorsto Mercedes Benz AC, Stuttgart, Germany A painted sheet metal part with an anticorrosion bonding layer based on polyacids and a method for applying such a bonding layer. MULTlLAVER
ELECTROSTATIC OF POLYMERS
COMPOSITION VERY FINE
COATING
U.S. Patent 5,83O,(iRl. Nov. 3, 1998 Y. Masuda et al., assignors to Kansai Paint Co. Ltd., ?Japan A method for forming a multilayer coating film, which comprises applying a colored clearcoating containing a color pigment and/or a glittering material on a film of an aluminum flake containing metallic coating.
ANODICALLV OXIDIZED SCANDIUM-DOPED ALUMINUM WlRlNG
U.S. Patent 5,830,786. Nov. 3, 1998 H. Zhang et al., assignorsto Semiconductor Energy Laboratory Co. Ltd., Kanagawa, ?Japan A process for fabricating an imulated gate field effect transistor comprising forming a metallic interconnection comprising aluminum on an insulating surface; oxidizing a surrounding of the metallic interconnection used in the electronic circuit by anodic oxidation; and then exposing the metallic interconnection to a laser treatment. ELECTROLESS DEPOSITION
APPARATUS
1J.S.Patent 5,830,806. Nov. 3, 1998 Y. Shacham-Diamand et al., assignorsto Cornell Research Foundation, Ithaca, N.Y.; Sematech Inc., Austin, Texas; and Intel Corp., Santa Clara, Calif A method and apparatus for processing a semiconductor wafer using electroless deposition that subjects the wafer to more than one processing fluid in a sealed process chamber while retaining the wafer in the sealed process chamber and allowing the processing of wafers to proceed in the absence of air. COMPOSITION FOR COATING REMOVAL
U.S. Patent 5&?0,836. Nov. 3, 1998 P.E. Smith et al., assignorsto Eldorado Chemical Co. Inc., San Antonio, Texas A composition capable of sotteningto-release at about ambient temperature a polymeric coating when applied to the coating comprising hydrogen peroxide or organic peroxMetal
Finishing
Field
Printed copies of patents are furnished by the Patent and Trademark Office for $3.00 each. Address orders to: Commissioner of Patents and Trademarks, Washington, D.C. 20231.
SELECTWE PATTERNING ON A DIELECTRIC SUBSTRATE
U.S. Patent 5,830,533. Nov. 3, 1998 C. W.C. Lin and R.L. German, assignors to MicroeEectronics and Computer Technology Corp., Austin, Texas A method of selectively patterning metal on a dielectric substrate comprising depositing a seed layer on a dielectric substrate wherein the seed layer is autocatalytic to an electrically conductive metal whereas the dielectric substrate is nonautocatalytic to the metal; overlaying a resist mask on the seed layer wherein the resist mask has a pattern, which covers portions of the seed layer whereas a plurality of openings in the resist mask expose other portions of the seed layer; etching the exposed portions of the seed layer; removing the resist mask thereby exposing the unetched portions of the seed layer, which correspond to the pattern of the resist mask; and depositing the metal on the unetched portions of the seed layer without depositing the metal on the dielectric substrate and without using a mask, wherein the deposited metal corresponds to the pattern and the seed layer provides adhesion between the dielectric substrate and the deposited metal.
paratory substance, and then electrostatically painted, the improvement comprising preparing the polymer from a polymer formulation including materials that include or form urea groups, urethane groups, or mixtures thereof and a nonvolatile metal salt conductivity inducing material, wherein the nonvolatile metal salt excludes metal salts of thiocyanates. COATING CONTAINING
PAlNTlNG
U.S. Patent 5,830,541. Nov. 3, 1998 R. Carswell et al., assignorsto The DOWChemical Co., Midland, Mich. A process of electrostatically painting a cured urea and/or urethane group containing polymer wherein the polymer is formed into a shaped article, coated with a conductive pre82
MICA
IJ.S. Patent 5,830,567. NOV. 3, 1998 S. Panush, assignor to BASF Corp., Southfield, Mich. A nonmetallic coating composition comprising a polymeric binder and a pigment comprising a mica in an amount so that mica produces added color without producing an opalescent or metallic effect or color travel. PAINTED
SHEET
METAL
IJ.S. Patent 5,830,fiRO.Nov. 3, 1998 TJ.Flammer et al., assignorsto Mercedes Benz AC, Stuttgart, Germany A painted sheet metal part with an anticorrosion bonding layer based on polyacids and a method for applying such a bonding layer. MULTlLAVER
ELECTROSTATIC OF POLYMERS
COMPOSITION VERY FINE
COATING
U.S. Patent 5,83O,(iRl. Nov. 3, 1998 Y. Masuda et al., assignors to Kansai Paint Co. Ltd., ?Japan A method for forming a multilayer coating film, which comprises applying a colored clearcoating containing a color pigment and/or a glittering material on a film of an aluminum flake containing metallic coating.
ANODICALLV OXIDIZED SCANDIUM-DOPED ALUMINUM WlRlNG
U.S. Patent 5,830,786. Nov. 3, 1998 H. Zhang et al., assignorsto Semiconductor Energy Laboratory Co. Ltd., Kanagawa, ?Japan A process for fabricating an imulated gate field effect transistor comprising forming a metallic interconnection comprising aluminum on an insulating surface; oxidizing a surrounding of the metallic interconnection used in the electronic circuit by anodic oxidation; and then exposing the metallic interconnection to a laser treatment. ELECTROLESS DEPOSITION
APPARATUS
1J.S.Patent 5,830,806. Nov. 3, 1998 Y. Shacham-Diamand et al., assignorsto Cornell Research Foundation, Ithaca, N.Y.; Sematech Inc., Austin, Texas; and Intel Corp., Santa Clara, Calif A method and apparatus for processing a semiconductor wafer using electroless deposition that subjects the wafer to more than one processing fluid in a sealed process chamber while retaining the wafer in the sealed process chamber and allowing the processing of wafers to proceed in the absence of air. COMPOSITION FOR COATING REMOVAL
U.S. Patent 5&?0,836. Nov. 3, 1998 P.E. Smith et al., assignorsto Eldorado Chemical Co. Inc., San Antonio, Texas A composition capable of sotteningto-release at about ambient temperature a polymeric coating when applied to the coating comprising hydrogen peroxide or organic peroxMetal
Finishing