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Apparatus for etching printed circuit board
ULTRASONIC APPARATUS
CLEANING
U.S. Patent 6,178,974. Jan. 30, 2001 K. Kobayashi et al., assignors to TDK Corp., Tokyo
A method for cleaning an object comprising immersing in cleaning fluid; vibrating the cleaning fluid; and minutely vibrating the object in two different directions during vibration of the cleaning fluid. PICKLE TANK COVER WlTH PLENUM CHAMBER
U.S. Patent 6,178,976. Jan. 30, 2001 R.K. Lordo, assignor to Danieli Technology Inc., Cranberry Township, Pa.
improved cover for containment and exhaust of fumes from an acid bath in a pickling line having a pickle tank having a bottom wall, end walls, and side walls for containing an acid bath for pickling metal strip; and means for introducing metal strip over one end wall of the tank, passing the metal strip through the acid bath and over an opposite end wall of the tank; said improved cover having a plurality of adjoining sections, substantially completely covering the pickle tank and acid bath.
An
ROTARY ATOMIZING DEVICE
COATING
U.S. Patent 6,179,217. Jan. 30, 2001 0. Yoshida and H. Matsuda, assignors to ABB KK, Tokyo
A coating method by the use of a rotary atomizing head type coating system. ABRASIVE
ARTICLE
U.S. Patent 6,179,887. Jan. 30, 2001 L.L. Barber, Jr., assignor to 3M Innovative Properties Co., St. Paul, Minn.
A method for making an abrasive article comprising supplying an effective amount of abrasive particles to at least a portion of an abrasive article mold, wherein the
October 2001
abrasive article mold comprises a plurality of bristle segment portions; supplying a binder precursor matrix to the abrasive article mold, wherein the binder precursor matrix comprises at least two interactive components selected from the group consisting of a polyurethane/urea binder and an epoxy binder; and allowing the binder precursor matrix to cure within the abrasive article mold such that the abrasive particles are secured within a binder formed from the binder precursor matrix. AQUEOUS PHOSPHATING COMPOSITION U.S. Patent 6,179,934. Jan. 30, 2001 M. Kawakami et al., assignors to Henkel Corp., Gulph Mills, Pa.
A liquid composition suitable for forming a zinc phosphate conversion coating on a metal surface by contact and reaction therewith comprising water and 5 to 50 g/L of phosphate ions; 0.2 to 10 g/L of zinc ions; a hydroxylamine source in a quantity that provides a concentration of 0.5 to 4.0 g/L stoichiometric equivalent as hydroxylamine; and either 0.01 to 5.0 g/L in total of at least one substance selected from the group consisting of polycarboxylic acids, salts thereof, and starch phosphate; or 2.0 g/L of zinc. APPARATUS FOR ETCHING PRINTED CIRCUIT BOARD
U.S. Patent 6,179,954. Jan. 30, 2001 E. Kawana and K. Zshida, assignors to Fujitsu Limited, Kawasaki, Japan
An apparatus for etching a printed circuit board comprising transporting means for horizontally transporting a printed circuit board so that the height is kept at a transport position; a plurality of upper spray nozzles for injecting an etchant to a top surface; a plurality of lower spray nozzles for injecting an etchant to
a bottom surface; a plurality of ejecting passages for ejecting the etchant, injected to the top surface of the printed circuit board by the upper spray nozzles, away from the printed circuit board in transverse directions perpendicular to the transporting direction of the printed circuit board, wherein the ejecting passages are arranged at portions of the transport means in which no pressure rollers are provided at locations corresponding to the ejecting passages. SPUlTERlNG
APPARATUS
U.S. Patent 6,179,974. Jan. 30, 2001 K.E. Buchanan, assignor to Trikon Holdings Ltd., Newport Gwent, U.K.
A method of sputtering from at least one target to a negatively biased workpiece on a support, the at least one target and support being disposed in a vacuum chamber containing a plasma and having a RF coil for enhancing the ionization of sputtered material. SPUTTERING
MONITOR
U.S. Patent 6,179,975. Jan. 30, 2001 C.A. Dark, assignor to National Semiconductor Corp., Santa Clara, Calif:
A method of monitoring targeV component consumption for dual use titanium/titanium nitride sputtering. PLATING APPARATUS
U.S. Patent 6,179,983. Jan. 30, 2001 J.D. Reid and S. Taatjes, assignors to Novellus Systems Inc., San Jose, Calif: An apparatus
for treating the surface of a substrate comprising a clamshell for holding said substrate; a plating bath having a wall section; a virtual anode having a periphery secured to the wall section, and an anode located between the clamshell and anode.
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CLEANING
U.S. Patent 6,178,974. Jan. 30, 2001 K. Kobayashi et al., assignors to TDK Corp., Tokyo
A method for cleaning an object comprising immersing in cleaning fluid; vibrating the cleaning fluid; and minutely vibrating the object in two different directions during vibration of the cleaning fluid. PICKLE TANK COVER WlTH PLENUM CHAMBER
U.S. Patent 6,178,976. Jan. 30, 2001 R.K. Lordo, assignor to Danieli Technology Inc., Cranberry Township, Pa.
improved cover for containment and exhaust of fumes from an acid bath in a pickling line having a pickle tank having a bottom wall, end walls, and side walls for containing an acid bath for pickling metal strip; and means for introducing metal strip over one end wall of the tank, passing the metal strip through the acid bath and over an opposite end wall of the tank; said improved cover having a plurality of adjoining sections, substantially completely covering the pickle tank and acid bath.
An
ROTARY ATOMIZING DEVICE
COATING
U.S. Patent 6,179,217. Jan. 30, 2001 0. Yoshida and H. Matsuda, assignors to ABB KK, Tokyo
A coating method by the use of a rotary atomizing head type coating system. ABRASIVE
ARTICLE
U.S. Patent 6,179,887. Jan. 30, 2001 L.L. Barber, Jr., assignor to 3M Innovative Properties Co., St. Paul, Minn.
A method for making an abrasive article comprising supplying an effective amount of abrasive particles to at least a portion of an abrasive article mold, wherein the
October 2001
abrasive article mold comprises a plurality of bristle segment portions; supplying a binder precursor matrix to the abrasive article mold, wherein the binder precursor matrix comprises at least two interactive components selected from the group consisting of a polyurethane/urea binder and an epoxy binder; and allowing the binder precursor matrix to cure within the abrasive article mold such that the abrasive particles are secured within a binder formed from the binder precursor matrix. AQUEOUS PHOSPHATING COMPOSITION U.S. Patent 6,179,934. Jan. 30, 2001 M. Kawakami et al., assignors to Henkel Corp., Gulph Mills, Pa.
A liquid composition suitable for forming a zinc phosphate conversion coating on a metal surface by contact and reaction therewith comprising water and 5 to 50 g/L of phosphate ions; 0.2 to 10 g/L of zinc ions; a hydroxylamine source in a quantity that provides a concentration of 0.5 to 4.0 g/L stoichiometric equivalent as hydroxylamine; and either 0.01 to 5.0 g/L in total of at least one substance selected from the group consisting of polycarboxylic acids, salts thereof, and starch phosphate; or 2.0 g/L of zinc. APPARATUS FOR ETCHING PRINTED CIRCUIT BOARD
U.S. Patent 6,179,954. Jan. 30, 2001 E. Kawana and K. Zshida, assignors to Fujitsu Limited, Kawasaki, Japan
An apparatus for etching a printed circuit board comprising transporting means for horizontally transporting a printed circuit board so that the height is kept at a transport position; a plurality of upper spray nozzles for injecting an etchant to a top surface; a plurality of lower spray nozzles for injecting an etchant to
a bottom surface; a plurality of ejecting passages for ejecting the etchant, injected to the top surface of the printed circuit board by the upper spray nozzles, away from the printed circuit board in transverse directions perpendicular to the transporting direction of the printed circuit board, wherein the ejecting passages are arranged at portions of the transport means in which no pressure rollers are provided at locations corresponding to the ejecting passages. SPUlTERlNG
APPARATUS
U.S. Patent 6,179,974. Jan. 30, 2001 K.E. Buchanan, assignor to Trikon Holdings Ltd., Newport Gwent, U.K.
A method of sputtering from at least one target to a negatively biased workpiece on a support, the at least one target and support being disposed in a vacuum chamber containing a plasma and having a RF coil for enhancing the ionization of sputtered material. SPUTTERING
MONITOR
U.S. Patent 6,179,975. Jan. 30, 2001 C.A. Dark, assignor to National Semiconductor Corp., Santa Clara, Calif:
A method of monitoring targeV component consumption for dual use titanium/titanium nitride sputtering. PLATING APPARATUS
U.S. Patent 6,179,983. Jan. 30, 2001 J.D. Reid and S. Taatjes, assignors to Novellus Systems Inc., San Jose, Calif: An apparatus
for treating the surface of a substrate comprising a clamshell for holding said substrate; a plating bath having a wall section; a virtual anode having a periphery secured to the wall section, and an anode located between the clamshell and anode.
103