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Availability of priority standby redundant systems
116
WORLD
ABSTRACTS
ON MICROELECTRONICS
state diagram. W h e n the n u m b e r of standby spares and the repair rate are both small, the influence of the exchange rate is small. W h e n the n u m b e r of standby spares and the repair rate are both large, the influence of the exchange rate is large. T h e n u m b e r of standby spares and the repair rate influence the probability that system failure occurs after all spare units have failed. T h e exchange rate strongly influences the probability of system failure dering the exchange time. "Probability of error considerations for certain
M a r y block codes with bit-by-bit decisions. N. C. BALTrtaS~ and H. M. BECK. Naval Res. Lab.. Washington D.C., U.S.A., April (1971), pp. 34, P-176186, NRL-REP-7250. A communication system, which transmits letters from an M - a r y source alphabet through an additive white Gaussian noise channel, is considered. T h e source letters are encoded for transmission using an M-ary block code. Code words are transmitted bit by bit through the channel. T h e receiver makes hard hit decisions on the received signals, performs a correlation
AND
RELIABILITY
operation to determine the likeliest transmitted code words and then decodes this word to yield a received letter. T w o types of M-ary block codes are considered. For each type we attempt to derive the probability of a block error, given various values of 3~ (number of blocks), N (bit per block, or block length) and the probability of a bit error. A v a i l a b i l i t y of priority standby redundant s y s t e m s . J. A. BUZACOTr. IEEE Tram. Reliab. R-20, No. 2 (1971), p. 60. A priority standby system consisting of two repairable units is considered. One unit, the priority unit, is always in service except when it is failed. T h e standby unit is in service only for the duration of repair of the priority unit. Expressions are derived for the availability of such a system for both pre-emptive and non-pre-emptive repair. T h e results assume reasonably general faihire-time and repair-time distributions of the priority and standby units. T h e pre-emptive priorit3" results are relatively insensitive to the form of the distributions.
4. MICROELECTRONICS--GENERAL In-house mieroelectronlcs----fostering a delicate fledgling. D. BOSWELL. E/ectron. Engng, October (1971), p. 44. M a n y large equipment companies are faced with a "feed or starve" decision in the field of hybrid microelectronics. T h i s article discusses, briefly, some of their financial, technical and organizational p r o b l e m s - - f r o m acceptance of the strange new egg as an "in-house" project, through foster-parenthood to the point when the fledgling is either ejected from the next and dies, or is ready to fly and survives.
Will MOS stimulate a n e w computer generation? S. G. T. MAINE. Elecktron. E ~ g , November (1971), p. 27. T h e ability of M O S technology to provide large, complex arrays of switching elements on small areas of silicon at low cost would appear, at first sight, to be a natural for application in digital computers. However, close inspection of the current architecture employed by most third-generation computers shows that only a limited area of hardware can utilize M O S circuits easily.
H o w s_moll is s m a l l ? H. HOWARD. EDN/EEE, 1 November (1971), p. 24. Thick film or thin film? Laser or abrasive film? Flip-chip or beam lead? These are a few of the trade-offs interwoven within the minicomponent evolution.
D y n a m i c t e s t i n g o f i n t e g r a t e d c i r c u i t s . B. H. MCGAHb'~ and E. W. THOMAS, Bell Lab. Rec., December (1971), p. 339. T h e fast, critically timed digital systems now being designed for the telephone network will require close control of the dynamic characteristics of integrated circuits. A system built at Bell Laboratories shows that dynamic testing of beam-lead ICs is practical.
A system designer's lament: give us better digital ICs. B. FORCES. Electronics, 6 December (197t), p. 70. Reviewing the evolution of available digital IC functions, an experienced minicomputer designer concludes it is about time that chip manufacturers became more responsive to user needs.
5. MICROELECTRONICS DESIGN AND CONSTRUCTION Three.dimensional planar Coax packaging for n ~ i c r o e l e c t r o n l c computer sytten~ts. H. L. PARKS. Proc. 21st Electron. Compon. Conf., Washington D.C., U.S.A., 10-12 May (1971), p. 515. A three-dimensional microelectronic interconnection and packaging technique has been developed that is particularly suited to semiconductor chips of all complexities ranging from single junction devices to large-scale integrated circuit devices. T h i s packaging technology has been applied to several developmental systems, digital in nature, both high speed and medium speed. T h e interconnections are pseudocoaxial in all three dimensions and are formed by electrochemically sculpturing copper planes such that
the system is 80 per cent copper, affording high heat capability. It can be completely disassembled for repair and maintenance of the wafers containing the active devices. Circuit and semiconductor chip package densities can be achieved which offer one to three orders of magnitude increased density over conventional packaging systems. Utilization of this technology in the packaging of a computer with approximately 15,000 logic gates in less than 14 cu. in. will be discussed and the means by which the technology can be universally applied to semiconductor circuit interconnections will be shown in this paper.
WORLD
ABSTRACTS
ON MICROELECTRONICS
state diagram. W h e n the n u m b e r of standby spares and the repair rate are both small, the influence of the exchange rate is small. W h e n the n u m b e r of standby spares and the repair rate are both large, the influence of the exchange rate is large. T h e n u m b e r of standby spares and the repair rate influence the probability that system failure occurs after all spare units have failed. T h e exchange rate strongly influences the probability of system failure dering the exchange time. "Probability of error considerations for certain
M a r y block codes with bit-by-bit decisions. N. C. BALTrtaS~ and H. M. BECK. Naval Res. Lab.. Washington D.C., U.S.A., April (1971), pp. 34, P-176186, NRL-REP-7250. A communication system, which transmits letters from an M - a r y source alphabet through an additive white Gaussian noise channel, is considered. T h e source letters are encoded for transmission using an M-ary block code. Code words are transmitted bit by bit through the channel. T h e receiver makes hard hit decisions on the received signals, performs a correlation
AND
RELIABILITY
operation to determine the likeliest transmitted code words and then decodes this word to yield a received letter. T w o types of M-ary block codes are considered. For each type we attempt to derive the probability of a block error, given various values of 3~ (number of blocks), N (bit per block, or block length) and the probability of a bit error. A v a i l a b i l i t y of priority standby redundant s y s t e m s . J. A. BUZACOTr. IEEE Tram. Reliab. R-20, No. 2 (1971), p. 60. A priority standby system consisting of two repairable units is considered. One unit, the priority unit, is always in service except when it is failed. T h e standby unit is in service only for the duration of repair of the priority unit. Expressions are derived for the availability of such a system for both pre-emptive and non-pre-emptive repair. T h e results assume reasonably general faihire-time and repair-time distributions of the priority and standby units. T h e pre-emptive priorit3" results are relatively insensitive to the form of the distributions.
4. MICROELECTRONICS--GENERAL In-house mieroelectronlcs----fostering a delicate fledgling. D. BOSWELL. E/ectron. Engng, October (1971), p. 44. M a n y large equipment companies are faced with a "feed or starve" decision in the field of hybrid microelectronics. T h i s article discusses, briefly, some of their financial, technical and organizational p r o b l e m s - - f r o m acceptance of the strange new egg as an "in-house" project, through foster-parenthood to the point when the fledgling is either ejected from the next and dies, or is ready to fly and survives.
Will MOS stimulate a n e w computer generation? S. G. T. MAINE. Elecktron. E ~ g , November (1971), p. 27. T h e ability of M O S technology to provide large, complex arrays of switching elements on small areas of silicon at low cost would appear, at first sight, to be a natural for application in digital computers. However, close inspection of the current architecture employed by most third-generation computers shows that only a limited area of hardware can utilize M O S circuits easily.
H o w s_moll is s m a l l ? H. HOWARD. EDN/EEE, 1 November (1971), p. 24. Thick film or thin film? Laser or abrasive film? Flip-chip or beam lead? These are a few of the trade-offs interwoven within the minicomponent evolution.
D y n a m i c t e s t i n g o f i n t e g r a t e d c i r c u i t s . B. H. MCGAHb'~ and E. W. THOMAS, Bell Lab. Rec., December (1971), p. 339. T h e fast, critically timed digital systems now being designed for the telephone network will require close control of the dynamic characteristics of integrated circuits. A system built at Bell Laboratories shows that dynamic testing of beam-lead ICs is practical.
A system designer's lament: give us better digital ICs. B. FORCES. Electronics, 6 December (197t), p. 70. Reviewing the evolution of available digital IC functions, an experienced minicomputer designer concludes it is about time that chip manufacturers became more responsive to user needs.
5. MICROELECTRONICS DESIGN AND CONSTRUCTION Three.dimensional planar Coax packaging for n ~ i c r o e l e c t r o n l c computer sytten~ts. H. L. PARKS. Proc. 21st Electron. Compon. Conf., Washington D.C., U.S.A., 10-12 May (1971), p. 515. A three-dimensional microelectronic interconnection and packaging technique has been developed that is particularly suited to semiconductor chips of all complexities ranging from single junction devices to large-scale integrated circuit devices. T h i s packaging technology has been applied to several developmental systems, digital in nature, both high speed and medium speed. T h e interconnections are pseudocoaxial in all three dimensions and are formed by electrochemically sculpturing copper planes such that
the system is 80 per cent copper, affording high heat capability. It can be completely disassembled for repair and maintenance of the wafers containing the active devices. Circuit and semiconductor chip package densities can be achieved which offer one to three orders of magnitude increased density over conventional packaging systems. Utilization of this technology in the packaging of a computer with approximately 15,000 logic gates in less than 14 cu. in. will be discussed and the means by which the technology can be universally applied to semiconductor circuit interconnections will be shown in this paper.