- Email: [email protected]
Comparison of bipolar and MOS integrated circuits
WORLD ABSTRACTS ON M I C R O E L E C T R O N I C S AND R E L I A B I L I T Y
255
devices, capacitors, thin film resistors and gold interconnections for studying future communication systems and needs. The facility is arranged to provide great flexibility, and has been used to fabricate such varied things as gigacycle tunnel diode counters, optical modulator amplifiers, luminescent diode arrays, interconnected monolithic logic gates and linear telephone booster circuits. Masks for the photolithographic processes are generated on a computer, with punched card, teletype, or graphically interactive consoles. A packaging techniques has been used which yields a very useful gate density in these prototypes.
Comparison of bipolar and MOS integrated circuits. J. HODGSON,Electron. Equip. News, March (1969), p. 6. This article compares IC's produced by both bipolar and metal-oxide silicon processes. The discussion concerns the manufacture of both, and a comparison of the two basic products, leading to an evaluation of the performance of each. A section on applications and uses follows leading to the conclusion that much is to be gained by employing both technologies in the same designs.
5. MICROELECTRONICSDESIGN AND CONSTRUCTION High-precision alignment device. ANON, CSIR Tech. Inf. Ind. 6, No. 9, September (1968), p. 1. A precision alignment device for photo-processing in microcircuit manufacture is described. Principles and design considerations are briefly discussed, the device and its control box described and microscope mounting illustrated. Total table travel in x/y directions is 400 ~m with 0.5 deg. angular motion. A substrate may be aligned to 1 ~m accuracy and reduction in total travel increases this. Thermal considerations for hybrid microcircuit packages and assemblies with high power dissipations. R. C. CHU, Proc. Tech. Programme, Int. Elect. Packaging Prod. Conf., Brighton, October 8-10 (1968), p. 411. One of the vital prerequisites in the development of advanced hybrid microcircuit packages is thermal design considerations. In order to achieve optimum performance and reliable operation of these circuit packages, it is imperative to have a thermal design that guarantees a range of operating temperatures. With the advent of hybrid monolithic circuit packages, it has become increasingly difficult to provide a proper thermal environment for these packages. In fact, as the trend towards further microminiaturization of electronic packages continues, the thermal design problem is becoming so critical that it is recognized as one of the factors limiting the achievement of higher packaging densities. Generally speaking, there are three basic thermal problems associated with a hybrid package: (1) the transfer of thermal energy, primarily by conduction, from the internal heat sources of a package to its external surface; (2) the removal of heat from the external surface by a cooling medium that may be free air, forced air, or liquids of various forms; and (3) maintaining coolant temperature for a given assembly or system, in a chosen application environment. This paper considers these problems at all phases of package design, from device mounting to system applications. The first part of the paper identifies the overall thermal considerations by defining the unique problems at each level of circuit packaging. The second part of this paper discusses techniques for the thermal design of hybrid circuit packages and assemblies. Various cooling and environmental control methods for handling high-power hybrid packages will be reviewed. Specific examples will be used to illustrate techniques for thermal design optimization, and representative applications of these techniques to data processing equipment will be presented, including IBM System/360. The concluding portion of this paper assesses the requirements of the thermal design of tomorrow's hybrid circuit packages. Attempts will be made to compare various thermal control systems, such as air systems, air-liquid composite systems, and liquid systems, using device junction temperature (T~) and junction temperatures differences (ATj) as parameters. tComputer aided layout of microcircuits. W. J. CULLYERand S. TUBBS,Signals Res. Dev. Est., Min. of Tech. U.K., SRDE REP-68014, September (1968), 35 pp. To eliminate some of the skilled human effort in arranging the layout of the components of a microcircuit on a substrate, it is proposed that the process should be aided by a digital computer. A fully automated system does not seem possible at present. The method which has been suggested, and partially developed, relies on the automatic production of a rough layout which is unconstrained in size.
255
devices, capacitors, thin film resistors and gold interconnections for studying future communication systems and needs. The facility is arranged to provide great flexibility, and has been used to fabricate such varied things as gigacycle tunnel diode counters, optical modulator amplifiers, luminescent diode arrays, interconnected monolithic logic gates and linear telephone booster circuits. Masks for the photolithographic processes are generated on a computer, with punched card, teletype, or graphically interactive consoles. A packaging techniques has been used which yields a very useful gate density in these prototypes.
Comparison of bipolar and MOS integrated circuits. J. HODGSON,Electron. Equip. News, March (1969), p. 6. This article compares IC's produced by both bipolar and metal-oxide silicon processes. The discussion concerns the manufacture of both, and a comparison of the two basic products, leading to an evaluation of the performance of each. A section on applications and uses follows leading to the conclusion that much is to be gained by employing both technologies in the same designs.
5. MICROELECTRONICSDESIGN AND CONSTRUCTION High-precision alignment device. ANON, CSIR Tech. Inf. Ind. 6, No. 9, September (1968), p. 1. A precision alignment device for photo-processing in microcircuit manufacture is described. Principles and design considerations are briefly discussed, the device and its control box described and microscope mounting illustrated. Total table travel in x/y directions is 400 ~m with 0.5 deg. angular motion. A substrate may be aligned to 1 ~m accuracy and reduction in total travel increases this. Thermal considerations for hybrid microcircuit packages and assemblies with high power dissipations. R. C. CHU, Proc. Tech. Programme, Int. Elect. Packaging Prod. Conf., Brighton, October 8-10 (1968), p. 411. One of the vital prerequisites in the development of advanced hybrid microcircuit packages is thermal design considerations. In order to achieve optimum performance and reliable operation of these circuit packages, it is imperative to have a thermal design that guarantees a range of operating temperatures. With the advent of hybrid monolithic circuit packages, it has become increasingly difficult to provide a proper thermal environment for these packages. In fact, as the trend towards further microminiaturization of electronic packages continues, the thermal design problem is becoming so critical that it is recognized as one of the factors limiting the achievement of higher packaging densities. Generally speaking, there are three basic thermal problems associated with a hybrid package: (1) the transfer of thermal energy, primarily by conduction, from the internal heat sources of a package to its external surface; (2) the removal of heat from the external surface by a cooling medium that may be free air, forced air, or liquids of various forms; and (3) maintaining coolant temperature for a given assembly or system, in a chosen application environment. This paper considers these problems at all phases of package design, from device mounting to system applications. The first part of the paper identifies the overall thermal considerations by defining the unique problems at each level of circuit packaging. The second part of this paper discusses techniques for the thermal design of hybrid circuit packages and assemblies. Various cooling and environmental control methods for handling high-power hybrid packages will be reviewed. Specific examples will be used to illustrate techniques for thermal design optimization, and representative applications of these techniques to data processing equipment will be presented, including IBM System/360. The concluding portion of this paper assesses the requirements of the thermal design of tomorrow's hybrid circuit packages. Attempts will be made to compare various thermal control systems, such as air systems, air-liquid composite systems, and liquid systems, using device junction temperature (T~) and junction temperatures differences (ATj) as parameters. tComputer aided layout of microcircuits. W. J. CULLYERand S. TUBBS,Signals Res. Dev. Est., Min. of Tech. U.K., SRDE REP-68014, September (1968), 35 pp. To eliminate some of the skilled human effort in arranging the layout of the components of a microcircuit on a substrate, it is proposed that the process should be aided by a digital computer. A fully automated system does not seem possible at present. The method which has been suggested, and partially developed, relies on the automatic production of a rough layout which is unconstrained in size.