Coplanar-electrode insulated gate thin-film transistors

Coplanar-electrode insulated gate thin-film transistors

Classified Abstracts Materials 40. Installation No. 645. and Techniques used in Vacuum 45 : 33 40 : 36 See Abstr. Electron beam welding. 47. 41. ...

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Classified Abstracts Materials 40. Installation No. 645.

and Techniques

used in Vacuum

45 : 33 40 : 36 See Abstr.

Electron beam welding.

47. 41.

Vacuum siliconizing of metals.

Outgassing Data, Vapour Pressure Data, Gettering

Data

See Abstr. No. 622. 41 : 30

Variable evaporation rate of tantalum.

See Abstr. No. 627.

Glass and Ceramics

42 : 49 651. Vacuum press for ceramic materials. (U.S.S.R.) A vacuum press for shaping ceramic blocks and panels for the building trade is described. Basic and facing materail (clay of various types) are fed into the press by worm conveyors and extruded by application of a vacuum. (U.S.S.R.) A. Pozdnykov and S. Silenok, Ekonomicheskaya Gazeta, (26), 26 June 1963,37.

Plastics

43

Physical testing of plastic films. M. E. Baird and D. A. Lannon, Br. Plast., 97.

Soldering,

Welding,

37 (2), Feb. 1964, 92-

techniques

G. V. Mikhailov (6), 134-137.

48.

and Y. A. Kulakov,

Heating, Refrigeration,

Pribory

Ultrasonics,

i Teckh.

Eksper.,

Centrifuging

48 : 13 : 57 Ultra centrifuge with magnetic suspension in vacua. See Abstr. No.

Brazing 45

Vacuum and non-vacuum See Abstr. No. 640.

47 653. The composition of residual gases in contact with sputtered films of titanium. (U.S.S.R.) The gas composition was studied by means of an omegatron, the pressure in the enclosure being of the order of 10-8-10-10 torr. The most common gaseous constituents were : H,, He, CO, CHI, H,O and Ar. The partial pressure of all these gases diminished in time with the exception of CO and H20, which continued to be Adsorption by regenerated on the hot surface of the tungsten. the titanium film is increased in the presence of ionization for all the gases. (U.S.S.R.) W. J. S.

48 : 28 Ceramic insulated vacuum tubes for very high frequency industrial heating. See Abstr. No. 607.

and Plastomers

652.

45.

See Abstr. No. 638.

Metals and Alloys 41 : 30

43.

Technology

Gases and Vapours

for the degassing of liquids and solutions.

42.

251

651-657

for electron

49.

: 33

Miscellaneous

Materials and Techniques 49 : 42

heam welding. Vacuum press for ceramic materials.

See Abstr. No. 652.

Basic Science and Englneering

52.

Physical

Chemistry 52

: 33

Electron microscopic investigation of pyramidal structure formed on the surface of electro-deposited nickel. See Abstr. No. 635.

56.

Electrical

Engineering,

Electronic

Circuits 56

High vacuum thermocouples Abstr. No. 596.

(Molybdenum

Thin film circuits, some production aspects.

and Kovar).

56 655. A survey of British 6xed resistors part 2 : non-wire wound types. Anon., Br. Comms. and Electronics, 11, (2), Feb. 1964, 94.

656.

Coplanar-electrode

insulated

gate

thin-film

56 : 30 transistors.

: 23

(U.S.A.)

See

P. K. Weimer et al., RCA Rev., 24 (4), Dec. 1963, 661.

56 : 50 See Abstr. No. 610.

56 657. Theory of thin film transistor operation. (Great Britain) R. R. Haering, Solid State Electronics, 7 (l), Jan. 1964, 31.

: 30

56 : 37 Conditions for growing mono-crystal semiconductor layers on a polycrystalline substrate. See Abstr. No. 650. 56 654. Logic Systems. W. F. Chow and J. B. Schwartz, 1964, 34.

57.

Mechanical

Engineering 57

Electronic

Des.,

12 (l),

Jan.

Ultra centrifuge with magnetic suspension in vacua. No. 557.

: 48 : 13

See Abstr.