Electroplating apparatus

ory hard disks, which comprises water and at least one abrasive selected from the group consisting of aluminum oxide, silicon dioxide, cerium oxide, zirconium oxide, titanium oxide, silicon nitride, and manganese dioxide, and further contains succinic acid or its salt dissolved in the composition and aluminum hydroxide.

PROCESS FOR TREATING ALUMINIFEROUS METALS

U.S. Patent 6,193,815. Feb. 27, 2001 H. Wada and K. Nakada, assignors to Henkel Corp., Gulph Mills, Pa.

An aqueous liquid composition that is suitable for treating the surface of aluminiferous metals to form a corrosion-protective and paint-adherent coating thereon, comprising 0.01 to 5 parts by weight of dissolved phosphate ions; 0.1 to 2 parts by weight of dissolved molecules, ions, or both that contain titanium atoms; 0.05 to 5 parts by weight of dissolved molecules, anions, or both that contain fluorine atoms; and 0.01 to 2 parts by weight of water-soluble accelerator that is a combination of sodium nitrite and potassium permanganate or nitric acid and ammonium heptamolybdate. TANTALUM

SPUlTERlNG

TARGET

U.S. Patent 6,193,821. Feb. 27, 2001 H. Zhang, assignor to Tosoh SMD Inc., Grove City, Ohio

A process for working substantially pure tantalum to form a sputter target having predominantly texture and uniform grain sizes of 20-25 pm. MAGNETRON APPARATUS

SPUTTERING

U.S. Patent 6,193,853. Feb. 27, 2001 G. Yumshtyk and M. Zoumchtyk, assignors to Cametoid Limited, Whitby

A sputtering process for applying a coating onto an elongate, holDecember

2001

low, cylindrical workpiece having an internal surface and an external surface. SPUTTERING

MEeHOD

U.S. Patent 6,193,854. Feb. 27, 2001 K.F. Kai et al., assignors to Novellus Systems Inc., San Jose, Calif:

cathode bar and laterally conveys the product in an electrolyte solution held in a tank meanwhile feeding an electric current from the cathode bar to the upper part of the product through the jig.

An apparatus and method for controlling erosion profile in a hollow cathode magnetron sputter source. WAFER PLATING APPARATUS

U.S. Patent 6,193,859. Feb. 27, 2001 R.J. Contolini et al., assignors to Nouellus Systems Inc., San Jose, Cal& and Znternational Business Machines Corp., Armonk, N.Y.

An electric potential shaping apparatus for holding a semiconductor wafer during electroplating. ANODE SYSTEMS

U.S. Patent 6,193,860. Feb. 27, 2001 M. Weling, assignor to VLSZ Technology Inc., San Jose, Calif.

A method and apparatus for improved copper plating uniformity on a semiconductor wafer using optimized electrical currents. ROLE FILLING MmllOD

U.S. Patent 6,193,861. Feb. 27, 2001 C. E. &oh, assignor to International Business Machines Corp., Armonk, N.Y. An apparatus

and method to enhance hold fill in sub-micron plating. ELECTROPLATING

MILITARY y SPECIFICATIONS y CHEMICA:COATINGS INDUSTRIA: FINISHES ADHEbES

/,

APPARATUS

U.S. Patent 6,193,863. Feb. 27, 2001 H. Kobayashi, Shizouka-ken, Japan

A product conveying mechanism for an electroplating device serving to electroplate a thin-wall ribbon-shaped product including a printed wiring board given to be plated, which mechanism suspends the product from an upper part thereof nipped with a jig supported laterally movably by a

CARLSTADT, NJ 07072 Phone: (201) 438-3700

l

Fax: (201) 4384231

Circle 033 on reader card or go to www.thru.to/webconnect 63