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Electroplating method and apparatus
Cleaning System
orrsine aluha alumina and at least 0.5% bv &gltt ok at least one modifying me&l oxide, the metal of the metal oxide being selccted from the group consisting of zirconium, hafnium. cobalt, nickel. zinc. magyttrmm, praseodymium, saneaturn, neodymium. marium, ytterbium, lanthanum. gadolinium. cerium, dysprosium. erbium. and combinations of two or more of such metals, wherein the concentratron of the modifying metal oxide is greater at or near the surface of the grrt than at the interior of the grit, and wherein the ceramrc abrasive grits have a shape selected from the group consisting of rods. pyramids, diamonds. and cones.
U.S. Patent Z431.740. Jo/y II, 1995 EA. Swain,assignor to Xerox Corp., Stamford, Corm. A method for cleaning a cylindrical substrate comprising placing the substrate in a cleaning station comprising at least one expansion chamber havmg an outlet; cxpanding liquid carbon dioxide within the expansion chamber to generate particles of solid carbon dioxide; directing a stream of the solid carbon dioxide particle? to the outlet such that the stream leaves the outlet at a first angle relative to the expansion chamber: and redirecting the stream toward the substrate at a second angle greater than the first angle so that the stream contacts and cleans the surface of the substrate.
Process for Cleaning and Defluxing Electronic Assemblies US. Parent 5,431.739.July II, 1995 J Bengslon. assignor lo MacDermid Inc., Waterbuiy Corm.
Copper Etchant Solution Additives U.S. Patent 5,431,776. July 11, 1995 H.W.Richardson and C F: Jordan, assignors to PhIbra-Tech inc., Ff. Lee, NJ.
.\ single chemical step method for removing contaminants from a substrate. con&ing essentially of cormacting with an aqueous solution comprising an aryl alcohol and at least ten percent by wetght water.
An aqueous alkaline ammoniacal cupric chloride etching bath containing an etch
accelerating additive selected from the group consisting of copper(I) stabilirers, said additive being present in an amount sufficient to increase the etch rate of the bath by at least 40% over an identical etchmg bath free of the additive.
Electroplating Method and Apparatus U.S.Patent 5,431&V July 77. 1995 S. Nish~mum et al, assignors lo Yamaha Corp.. Japan A method of electroplating comprising preparing an electroplating apparatus having an electrolysrs vessel adapted to hold an electrolyte containing an ionized metal, sard vessel having an opening, an anode adapted to be dipped in the electrolyte. a conductive retainer for holding the work, an electric power source connected wtth the anode and the conductive retainer, a cap membsr for closmg the opening and forming an inner space together with the elec trolyte in the electrolysis vesvel. means for creating an inert ambience in the inner space, a reservoir tank adapted to hold the electrolyte, and a circulating unit disposed
Tin and Tin Lead Alloys Plating Processes TINOLS - Brilliant, Bright Finishes TINOMATS - Satin, Matte Finishes Fluoboric Acid Baths - Fluoborates Sulfonic Acid Baths - Non Fluoborates ?? Sulfuric Acid Baths - Sulfates
BATHS:
?? ??
APPLICATIONS:
??
??
DEPOSITS:
?? ??
D=
-
Excellent for All Types of Reel-to-Reel Applications Including Plating of Preformed or Bandoliered Contacts, High Speed Wire and Strip Material Excellent
for All Types of Rack and Barrel Plating
Bright and Matte Finishes - Best Quality Meet All Applicable Specifications for Electronics and Semi-conductors
MACLEE
CHEMICAL
CO. INC.
2065 N. SOUTHPORT, CHICAGO, IL 60614 (312) 929-9792 Circle 048 on reader information
METAL
FINISHING
??
MARCH
1996
FAX (312) 929-0698
card
97
between the electrolysis vessel and the reservoir tank for circulating the electrolyte thcrcbetwcen; putting the work into the inner space through the opening; causing the retamer to keep the work in the electrolyte in spaced relation to the anode; closing the opening with the cap; creating an inert ambience in the inner space between the cap and the electrolyte; and positively blaqing the anode with respect to the work for depositing the metal.
ode and the conductive substrate; and removing the substrate from the coating composition.
tv,in boundary free and has an average grain size of up to IO microns; and adding animal glut to the electrolyte solution, the rate being 0.1 to 30 mg/min/kA.
Electrodeposited Copper Foil US.Patent 5,431,803. July 11. 1995 D F DfFranco et al., awgnors Inc., Eastlake. Oho
toGould Ekclron~cs
Sputtering Process U.S. Pafenf 5.431.794. Ju/y if, 199.5 S. Malsumaru et ai, assgnors to Niwn Eiecfric Co., Kyoto and Kuraray Co. Ltd., Okayama, both of Japan
A process for making a copper foil cornprising flowing an electrolyte solution between an anode and a rotating cathode, applymg an effective amount of voltage to provldc an electric current density in the range of I .2 to I .8 Aicm2. and depositing copper on the cathode; qaid electrolyte solutlon comprising copper ions, sulfilte ions. chloride ions at a concentration of 0.01 to 0.5 ppm, and animal glut or a derivative thereof: removing deposited copper from the cathode as a continuous thin weh of copper foil; wherein the copper foil has an ultimate tensile strength in the range of X7.000 to 120,000 psi, and a substantially uniform randomly oriented grain structure that is essentially columnar grain free and
Cathodic Electrocoat Patenf 5,431,791. July II, 1995 TS. December and PJ. Harris, assignors to BASF Corp., South/kid, Mxh.
US.
A cathodic electrodeposition method, utihzing a cyclic carbonate-curable coatmg composition. comprising immersing a cow ductive substrate in a coating composition m an aqueous medium, a resin having a plurality of acid-salted primary amine groups, and a curing agent having a pluralIty of cyclic carbonate groups; applying a potential of electric curent between an an-
ULTRASONIC CLEANING: POLlSHlN6 COMPOUND REMOVAL
A process for forming a metal film on a surface of synthetic resin substrate, comprising evacuating a vacuum vessel containing the synthetic resin substrate and metal target: providing a means including an electrostatic shield, which covers the synthetic resin substrate for preventmg diffusion of an insert gas plasma to a surface of the synthetic resin substrate and for preventing inflow of acceleration electrons from the plasma to the surface of the synthetic resin substrate; and sputtering the metal target by ions in the plasma in a vacuum atmosphere so that a metal film
SDecialty
Blackstone serves the finishing industry with Q
lmmersible Ultrasonic Transducers
Ideal for a broad range of applications, highly efficient immersible transducers deliver consistent cleaning results using new or retrofived tanks G
Aquarius’” Ultrasonic Consoles
Integrated ultrasonic wash, rinse and hot air drying in a variety of tank sizes, with mater/a/ handling and other options available to suit your parts cleaning needs 0
HT- and CH-Series Ultrasonic Tanks HT Bench Tops and CH Floor Models from 2 to 500 gallons. #eat, ultrasonics, custom sizes and accessories for single-tank cleaning applications
800 766-6606 9 N MAIN STREET JAMESTOWN, NY 14701 FAX 716 665-2480
http://wwv.jtm.comlBlackStone/BIackStone.html Circle 017 on reader information
96
card
Solutions formulated for ultrasonic spray washers, immersion washers.
cleaners,
automated
A complete line of Zinc and Iron phosphates for metal pretreat applications. A complete line of organic and synthetic rust inhibitors.
Floor cleaners developed manual application.
Coolants
for a wide
for scrubbing
range
of metal
Custom Formulating Technical Support Deliveries: Prosco is committed
P
machines
forming
to on time
or
applications
delivery
prosco incorporated
chemicals for industty ?R I8 c Pmpert - Indlm,~polii. /iI
iJ 353.79x
Circle 087
. Fax
Indlara (?I 7) 153.07?3
4620
on reader information card
METAL FINISHING
??
MARCH
1996
orrsine aluha alumina and at least 0.5% bv &gltt ok at least one modifying me&l oxide, the metal of the metal oxide being selccted from the group consisting of zirconium, hafnium. cobalt, nickel. zinc. magyttrmm, praseodymium, saneaturn, neodymium. marium, ytterbium, lanthanum. gadolinium. cerium, dysprosium. erbium. and combinations of two or more of such metals, wherein the concentratron of the modifying metal oxide is greater at or near the surface of the grrt than at the interior of the grit, and wherein the ceramrc abrasive grits have a shape selected from the group consisting of rods. pyramids, diamonds. and cones.
U.S. Patent Z431.740. Jo/y II, 1995 EA. Swain,assignor to Xerox Corp., Stamford, Corm. A method for cleaning a cylindrical substrate comprising placing the substrate in a cleaning station comprising at least one expansion chamber havmg an outlet; cxpanding liquid carbon dioxide within the expansion chamber to generate particles of solid carbon dioxide; directing a stream of the solid carbon dioxide particle? to the outlet such that the stream leaves the outlet at a first angle relative to the expansion chamber: and redirecting the stream toward the substrate at a second angle greater than the first angle so that the stream contacts and cleans the surface of the substrate.
Process for Cleaning and Defluxing Electronic Assemblies US. Parent 5,431.739.July II, 1995 J Bengslon. assignor lo MacDermid Inc., Waterbuiy Corm.
Copper Etchant Solution Additives U.S. Patent 5,431,776. July 11, 1995 H.W.Richardson and C F: Jordan, assignors to PhIbra-Tech inc., Ff. Lee, NJ.
.\ single chemical step method for removing contaminants from a substrate. con&ing essentially of cormacting with an aqueous solution comprising an aryl alcohol and at least ten percent by wetght water.
An aqueous alkaline ammoniacal cupric chloride etching bath containing an etch
accelerating additive selected from the group consisting of copper(I) stabilirers, said additive being present in an amount sufficient to increase the etch rate of the bath by at least 40% over an identical etchmg bath free of the additive.
Electroplating Method and Apparatus U.S.Patent 5,431&V July 77. 1995 S. Nish~mum et al, assignors lo Yamaha Corp.. Japan A method of electroplating comprising preparing an electroplating apparatus having an electrolysrs vessel adapted to hold an electrolyte containing an ionized metal, sard vessel having an opening, an anode adapted to be dipped in the electrolyte. a conductive retainer for holding the work, an electric power source connected wtth the anode and the conductive retainer, a cap membsr for closmg the opening and forming an inner space together with the elec trolyte in the electrolysis vesvel. means for creating an inert ambience in the inner space, a reservoir tank adapted to hold the electrolyte, and a circulating unit disposed
Tin and Tin Lead Alloys Plating Processes TINOLS - Brilliant, Bright Finishes TINOMATS - Satin, Matte Finishes Fluoboric Acid Baths - Fluoborates Sulfonic Acid Baths - Non Fluoborates ?? Sulfuric Acid Baths - Sulfates
BATHS:
?? ??
APPLICATIONS:
??
??
DEPOSITS:
?? ??
D=
-
Excellent for All Types of Reel-to-Reel Applications Including Plating of Preformed or Bandoliered Contacts, High Speed Wire and Strip Material Excellent
for All Types of Rack and Barrel Plating
Bright and Matte Finishes - Best Quality Meet All Applicable Specifications for Electronics and Semi-conductors
MACLEE
CHEMICAL
CO. INC.
2065 N. SOUTHPORT, CHICAGO, IL 60614 (312) 929-9792 Circle 048 on reader information
METAL
FINISHING
??
MARCH
1996
FAX (312) 929-0698
card
97
between the electrolysis vessel and the reservoir tank for circulating the electrolyte thcrcbetwcen; putting the work into the inner space through the opening; causing the retamer to keep the work in the electrolyte in spaced relation to the anode; closing the opening with the cap; creating an inert ambience in the inner space between the cap and the electrolyte; and positively blaqing the anode with respect to the work for depositing the metal.
ode and the conductive substrate; and removing the substrate from the coating composition.
tv,in boundary free and has an average grain size of up to IO microns; and adding animal glut to the electrolyte solution, the rate being 0.1 to 30 mg/min/kA.
Electrodeposited Copper Foil US.Patent 5,431,803. July 11. 1995 D F DfFranco et al., awgnors Inc., Eastlake. Oho
toGould Ekclron~cs
Sputtering Process U.S. Pafenf 5.431.794. Ju/y if, 199.5 S. Malsumaru et ai, assgnors to Niwn Eiecfric Co., Kyoto and Kuraray Co. Ltd., Okayama, both of Japan
A process for making a copper foil cornprising flowing an electrolyte solution between an anode and a rotating cathode, applymg an effective amount of voltage to provldc an electric current density in the range of I .2 to I .8 Aicm2. and depositing copper on the cathode; qaid electrolyte solutlon comprising copper ions, sulfilte ions. chloride ions at a concentration of 0.01 to 0.5 ppm, and animal glut or a derivative thereof: removing deposited copper from the cathode as a continuous thin weh of copper foil; wherein the copper foil has an ultimate tensile strength in the range of X7.000 to 120,000 psi, and a substantially uniform randomly oriented grain structure that is essentially columnar grain free and
Cathodic Electrocoat Patenf 5,431,791. July II, 1995 TS. December and PJ. Harris, assignors to BASF Corp., South/kid, Mxh.
US.
A cathodic electrodeposition method, utihzing a cyclic carbonate-curable coatmg composition. comprising immersing a cow ductive substrate in a coating composition m an aqueous medium, a resin having a plurality of acid-salted primary amine groups, and a curing agent having a pluralIty of cyclic carbonate groups; applying a potential of electric curent between an an-
ULTRASONIC CLEANING: POLlSHlN6 COMPOUND REMOVAL
A process for forming a metal film on a surface of synthetic resin substrate, comprising evacuating a vacuum vessel containing the synthetic resin substrate and metal target: providing a means including an electrostatic shield, which covers the synthetic resin substrate for preventmg diffusion of an insert gas plasma to a surface of the synthetic resin substrate and for preventing inflow of acceleration electrons from the plasma to the surface of the synthetic resin substrate; and sputtering the metal target by ions in the plasma in a vacuum atmosphere so that a metal film
SDecialty
Blackstone serves the finishing industry with Q
lmmersible Ultrasonic Transducers
Ideal for a broad range of applications, highly efficient immersible transducers deliver consistent cleaning results using new or retrofived tanks G
Aquarius’” Ultrasonic Consoles
Integrated ultrasonic wash, rinse and hot air drying in a variety of tank sizes, with mater/a/ handling and other options available to suit your parts cleaning needs 0
HT- and CH-Series Ultrasonic Tanks HT Bench Tops and CH Floor Models from 2 to 500 gallons. #eat, ultrasonics, custom sizes and accessories for single-tank cleaning applications
800 766-6606 9 N MAIN STREET JAMESTOWN, NY 14701 FAX 716 665-2480
http://wwv.jtm.comlBlackStone/BIackStone.html Circle 017 on reader information
96
card
Solutions formulated for ultrasonic spray washers, immersion washers.
cleaners,
automated
A complete line of Zinc and Iron phosphates for metal pretreat applications. A complete line of organic and synthetic rust inhibitors.
Floor cleaners developed manual application.
Coolants
for a wide
for scrubbing
range
of metal
Custom Formulating Technical Support Deliveries: Prosco is committed
P
machines
forming
to on time
or
applications
delivery
prosco incorporated
chemicals for industty ?R I8 c Pmpert - Indlm,~polii. /iI
iJ 353.79x
Circle 087
. Fax
Indlara (?I 7) 153.07?3
4620
on reader information card
METAL FINISHING
??
MARCH
1996