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Filter building blocks using tantalum and silicon integrated circuits
WORLD ABSTRACTS ON M I C R O E L E C T R O N I C S AND R E L I A B I L I T Y
19
vt-STRATETM, interconnect system is a three-dimensional interconnect method in contrast to singleplane interconnect methods. Furthermore, the assembly process enhances module repairability during the manufacturing cycle.
Compatibility of glassy materials for monolithic packaging. J. B. FINN, Proc. 1969 Electron. Comport. Conf., Washington D.C., 30 April-2 May (1969), p. 322. This paper discusses the properties of hard glasses and solder glasses and interprets these values as measures of glass seal quality. Emphasis is placed on the glass-to-metal seal with development of a useful model. The glass-to-glass and glassto-ceramic seals are also discussed. A complete typical package assembly involving ceramic-glass-metal seals is finally analyzed in light of the preceding models. The typical package is then modified from basic materials compatibility considerations. A suggested modified package is then shown to be stronger, produce higher yields and process more easily. Integrated aluminium connections. T. NEUHUYS, Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 46. Beam leads are probably the most suitable integrated connections for building up complex hybrid integrated circuits. The manufacture of silicon chips provided with aluminium beam leads is a simple process that allows rapid extension of the range of available beamleaded planar devices. All electrical characteristics of each chip are measured before ultrasonic welding upon an aluminized thin film. Reliability test results are given. It is often advisable to mount the silicon chips upon auxiliary substrates. These are also provided with beam leads by means of which they are welded in turn upon thin or thick films. As an example of application of these techniques, modules for a frequency synthesizer are described. Crossovers for interconnections on substrates. H. BASSECHESand A. PFAHNL, Vroe. 1969 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 78. Crossovers are an important part of the interconnection pattern of hybrid thin-film circuits. Densities of several hundred crossovers per in 2 are not uncommon in present designs. The present paper discusses the preparation and properties of beam type crossovers. The beam crossover that has been developed has the mechanical and electrical characteristics which meet a wide variety of integrated circuit needs. The preparation process utilizes photolithographic techniques so that batch processing can be used to produce the crossovers economically. It is also fully compatible with the preparation and assembly techniques for tantalum and beam lead silicon integrated circuits. 6. MICROELECTRONICS---COMPONENTS AND EQUIPMENTS Testing linear integrated circuits. M. A. MAcDONELL, Solid-St. Technol., March (1969), p. 45. The largest testing volume of linear integrated circuits involves operational amplifiers. The applications of operational amplifiers demand that individual parameters be screened to assure predictable circuit performance. The important difference between testing digital and analog circuits is in the operating conditions for each type. Digital circuits have no practical linear range between on and off. Unless deliberately saturated, linear circuits are always active. Any change in input, bias or operating point will affect the test result throughout the linear range. These errors can occur even if only d.c. or static tests are being made. Much more care is required to maintain the operating conditions of linear circuits than has been needed for digital circuits. The signal levels associated with digital circuits are relatively large. Operational amplifier parameters are mostly determined from small error signals which demand sensitive instrumentation and special circuit techniques. This article points out the testing requirements of linear circuits and the test equipment features necessary to meet them. Filter building blocks using tantalum and silicon integrated circuits. G. S. MOSCHYTZ,D. G. MEDILLand C. J. STEFFEN,Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 100. In order for linear integrated circuits to become economically feasible, a method of network synthesis that provides a high degree of circuit standardization must be used. This has already been proven in the field of digital integrated circuits, where complex systems are broken down into a small family of functional logic building blocks. The resulting high production quantities have resulted in the anticipated reductions in cost. A method of designing linear filter building blocks in which operational
20
WORLD ABSTRACTS ON MICROELECTRONICS AND R E L I A B I L I T Y
amplifiers are used in a single standardized circuit configuration, namely, to provide a frequency emphasizing network (FEN), has been suggested recently. 1, 2 The FEN is combined with a passive RC network to obtain all possible second-order filter networks which, in turn, can be cascaded to provide a filter of any desired higher degree. This method was developed specifically to overcome the limitations and to utilize the advantages of hybrid integrated circuit technology. For example, it does not require a larger spread of passive component values than can be conveniently supplied by thin-film resistors and capacitors. It does, on the other hand, rely on their stability, tracking properties and adjustability. It also requires the high open-loop gain and isolating properties obtainable at low cost with presently available silicon integrated operational amplifiers. This paper describes the hybrid integrated realization of two filter building blocks using essentially the above-mentioned synthesis techniques. Tantalum thin-film resistors and capacitors have been combined with commercially available low-cost operational amplifiers to provide highly stable second-order filter functions of any kind over a frequency decade. A brief outline of the filter synthesis method is presented first. This is followed by a description of the physical realization of the building blocks and by the steps necessary to guarantee stability in linear networks incorporating more than one operational amplifier. Finally, some experimental results are given which compare very favorably with theoretical predictions.
Macro assembly-complex multi-chip LSI. R. F. BADER, Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 178. This paper is intended to supply the systems manufacturer with some basic understanding of the macrofunction assembly techniques. The paper steps the reader through the engineering development of a complex hybrid from inspection until final assembly and test. Some of the main problems are discussed, as well as many of the solutions to these problems Microminiature microwave integrated receivers. L. I. KENT, J. F. JoY and J. E. TEMPLETON, Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 33. Major efforts are being expended by the electronics industry to apply integrated-circuit techniques, which have been so successful with digital and low-frequency analog circuits, to microwave systems. During the past several years, a wide variety of microwave circuit functions and combinations of functions have been demonstrated in integrated m~crowave configurations. Recently, the combination of functional substrates into transmit-receive modules for phased-array radar applications has been demonstrated. In the work reported here, these rapidly developing microwave integrated-circuit techniques have been applied to the design and development of functionally integrated S- and X-band superheterodyne receivers. Functional integration represents a natural extension of the technology in combining all the receiver functions from antenna input to amplified IF output on a single substrate. Muitilayer a l u m i n a circuit boards. W. R. KELLER, F. E. PIRIGYI, G. R. COLE and J. P. BUDD, Proc. 1959 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 52. A new multilayer aluminum oxide ceramic substrate and component package is described. This substrate contains two or more ceramic layers with hermetic wiring patterns buried between the layers and risers (vias) to interconnect the buried patterns with top and bottom surfaces. Both buried and riser metallizing are highly conductive. The monolithic structure differs from previously described multilayer units in that it is compatible with a number of currently used packaging technologies. These range from air-fired thick film to active and evaporated metal technologies. A number of compatible packaging schemes are listed and designs of several multilayer ceramic structures are shown. Four-phase logic circuits using integrated MOS transistors. R. J. HATT,A. E. JACKETSand D. B. JARVIS. Mullard Tech. Commun. No. 99, May (1969), p. 266. The operating principles and design of four-phase MOS transistor logic are described by considering the shift register, combinational logic, negators and staticisors. The clock generator requirements are also described and a design for a fourphase generator is given. High noise immunity interface circuits are considered together with some basic layout designs. Approximate solutions for a coupled pair of microstrip lines in microwave integrated circuits. A. SCHWARZMANN,Microwave ft., May (1969), p. 79. Approximate equations are given for the even and
19
vt-STRATETM, interconnect system is a three-dimensional interconnect method in contrast to singleplane interconnect methods. Furthermore, the assembly process enhances module repairability during the manufacturing cycle.
Compatibility of glassy materials for monolithic packaging. J. B. FINN, Proc. 1969 Electron. Comport. Conf., Washington D.C., 30 April-2 May (1969), p. 322. This paper discusses the properties of hard glasses and solder glasses and interprets these values as measures of glass seal quality. Emphasis is placed on the glass-to-metal seal with development of a useful model. The glass-to-glass and glassto-ceramic seals are also discussed. A complete typical package assembly involving ceramic-glass-metal seals is finally analyzed in light of the preceding models. The typical package is then modified from basic materials compatibility considerations. A suggested modified package is then shown to be stronger, produce higher yields and process more easily. Integrated aluminium connections. T. NEUHUYS, Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 46. Beam leads are probably the most suitable integrated connections for building up complex hybrid integrated circuits. The manufacture of silicon chips provided with aluminium beam leads is a simple process that allows rapid extension of the range of available beamleaded planar devices. All electrical characteristics of each chip are measured before ultrasonic welding upon an aluminized thin film. Reliability test results are given. It is often advisable to mount the silicon chips upon auxiliary substrates. These are also provided with beam leads by means of which they are welded in turn upon thin or thick films. As an example of application of these techniques, modules for a frequency synthesizer are described. Crossovers for interconnections on substrates. H. BASSECHESand A. PFAHNL, Vroe. 1969 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 78. Crossovers are an important part of the interconnection pattern of hybrid thin-film circuits. Densities of several hundred crossovers per in 2 are not uncommon in present designs. The present paper discusses the preparation and properties of beam type crossovers. The beam crossover that has been developed has the mechanical and electrical characteristics which meet a wide variety of integrated circuit needs. The preparation process utilizes photolithographic techniques so that batch processing can be used to produce the crossovers economically. It is also fully compatible with the preparation and assembly techniques for tantalum and beam lead silicon integrated circuits. 6. MICROELECTRONICS---COMPONENTS AND EQUIPMENTS Testing linear integrated circuits. M. A. MAcDONELL, Solid-St. Technol., March (1969), p. 45. The largest testing volume of linear integrated circuits involves operational amplifiers. The applications of operational amplifiers demand that individual parameters be screened to assure predictable circuit performance. The important difference between testing digital and analog circuits is in the operating conditions for each type. Digital circuits have no practical linear range between on and off. Unless deliberately saturated, linear circuits are always active. Any change in input, bias or operating point will affect the test result throughout the linear range. These errors can occur even if only d.c. or static tests are being made. Much more care is required to maintain the operating conditions of linear circuits than has been needed for digital circuits. The signal levels associated with digital circuits are relatively large. Operational amplifier parameters are mostly determined from small error signals which demand sensitive instrumentation and special circuit techniques. This article points out the testing requirements of linear circuits and the test equipment features necessary to meet them. Filter building blocks using tantalum and silicon integrated circuits. G. S. MOSCHYTZ,D. G. MEDILLand C. J. STEFFEN,Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 100. In order for linear integrated circuits to become economically feasible, a method of network synthesis that provides a high degree of circuit standardization must be used. This has already been proven in the field of digital integrated circuits, where complex systems are broken down into a small family of functional logic building blocks. The resulting high production quantities have resulted in the anticipated reductions in cost. A method of designing linear filter building blocks in which operational
20
WORLD ABSTRACTS ON MICROELECTRONICS AND R E L I A B I L I T Y
amplifiers are used in a single standardized circuit configuration, namely, to provide a frequency emphasizing network (FEN), has been suggested recently. 1, 2 The FEN is combined with a passive RC network to obtain all possible second-order filter networks which, in turn, can be cascaded to provide a filter of any desired higher degree. This method was developed specifically to overcome the limitations and to utilize the advantages of hybrid integrated circuit technology. For example, it does not require a larger spread of passive component values than can be conveniently supplied by thin-film resistors and capacitors. It does, on the other hand, rely on their stability, tracking properties and adjustability. It also requires the high open-loop gain and isolating properties obtainable at low cost with presently available silicon integrated operational amplifiers. This paper describes the hybrid integrated realization of two filter building blocks using essentially the above-mentioned synthesis techniques. Tantalum thin-film resistors and capacitors have been combined with commercially available low-cost operational amplifiers to provide highly stable second-order filter functions of any kind over a frequency decade. A brief outline of the filter synthesis method is presented first. This is followed by a description of the physical realization of the building blocks and by the steps necessary to guarantee stability in linear networks incorporating more than one operational amplifier. Finally, some experimental results are given which compare very favorably with theoretical predictions.
Macro assembly-complex multi-chip LSI. R. F. BADER, Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 178. This paper is intended to supply the systems manufacturer with some basic understanding of the macrofunction assembly techniques. The paper steps the reader through the engineering development of a complex hybrid from inspection until final assembly and test. Some of the main problems are discussed, as well as many of the solutions to these problems Microminiature microwave integrated receivers. L. I. KENT, J. F. JoY and J. E. TEMPLETON, Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 33. Major efforts are being expended by the electronics industry to apply integrated-circuit techniques, which have been so successful with digital and low-frequency analog circuits, to microwave systems. During the past several years, a wide variety of microwave circuit functions and combinations of functions have been demonstrated in integrated m~crowave configurations. Recently, the combination of functional substrates into transmit-receive modules for phased-array radar applications has been demonstrated. In the work reported here, these rapidly developing microwave integrated-circuit techniques have been applied to the design and development of functionally integrated S- and X-band superheterodyne receivers. Functional integration represents a natural extension of the technology in combining all the receiver functions from antenna input to amplified IF output on a single substrate. Muitilayer a l u m i n a circuit boards. W. R. KELLER, F. E. PIRIGYI, G. R. COLE and J. P. BUDD, Proc. 1959 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 52. A new multilayer aluminum oxide ceramic substrate and component package is described. This substrate contains two or more ceramic layers with hermetic wiring patterns buried between the layers and risers (vias) to interconnect the buried patterns with top and bottom surfaces. Both buried and riser metallizing are highly conductive. The monolithic structure differs from previously described multilayer units in that it is compatible with a number of currently used packaging technologies. These range from air-fired thick film to active and evaporated metal technologies. A number of compatible packaging schemes are listed and designs of several multilayer ceramic structures are shown. Four-phase logic circuits using integrated MOS transistors. R. J. HATT,A. E. JACKETSand D. B. JARVIS. Mullard Tech. Commun. No. 99, May (1969), p. 266. The operating principles and design of four-phase MOS transistor logic are described by considering the shift register, combinational logic, negators and staticisors. The clock generator requirements are also described and a design for a fourphase generator is given. High noise immunity interface circuits are considered together with some basic layout designs. Approximate solutions for a coupled pair of microstrip lines in microwave integrated circuits. A. SCHWARZMANN,Microwave ft., May (1969), p. 79. Approximate equations are given for the even and