- Email: [email protected]
Inside Front Cover - Editorial Board
MICROELECTRONIC ENGINEERING Editor-in-Chief (Europe) MARC VAN ROSSUM IMEC Kapeldreef 75 B-3001 Leuven Belgium
Editor (USA) MARTIN PECKERAR Department of Electrical and Computer Engineering University of Maryland 1359 AV Williams Building College Park, MD 20742-3275 U.S.A.
Advisory Editors (Japan) T. Asano, Kyushu Institute of Technology, Fukuoka M. Komuro, National Institute of Advanced Industrial Science and Technology, Ibaraki S. Maegawa, Renesas Technology Corp., Itami S. Matsui, Himeji Institute of Technology, Hyogo H. Mimura, Shizuoka University, Hamamatsu S. Okazaki, ASET, Tokyo
Editor (Japan) MIKIO TAKAI Research Center for Materials Science at Extreme Conditions Osaka University Machikaneyama 1-3, Toyonaka Osaka 560-8531 Japan
Advisory Editors (Europe) G. Declerck, Interuniversitair Micro-Elektronica Centrum, Louvain, Belgium M. Gentili, CNR – Istituto di Elettronica dello Stato Solido, Rome, Italy J. Greer, Tyndall National Institute, Cork, Ireland M.E. Jones, Imperial College, London, U.K. D.P. Kern, Universita¨t Tu¨bingen, Germany H. Launois, L2M CNRS, Bagneux, France R.A. Lawes, Rutherford Appleton Laboratory, Chilton, U.K. P. Paniez, CNET/DTM/TMF, France J. Perrocheau, ELISA, Les Ulis, France P. Vettiger, IBM, Ru¨schlikon, Switzerland E. Wolfgang, Siemens AG, Munich, Germany
Advisory Editors (U.S.A.) H.R. Huff, SEMATECH, Austin, TX A.R. Neureuther, University of California, Berkeley, CA H. Pfeiffer, IBM, Hopewell Junction, NY L. Swanson, FEI Company, Hillsborough, OR K.D. van der Mast, FEI Company, Hillsboro, OR
Editor Emeritus S. Namba, Osaka University, Japan
Founding Editor W.C. Nixon, Cambridge University, U.K.
Aims and Scope MICROELECTRONIC ENGINEERING TOPICS The journal is dedicated to advanced engineering methods for micro- and nanofabrication of electronic devices, circuits and systems. This includes following topics: 1. Nanolithography and Nanopatterning • optical lithography • EUV lithography and masks • charged particle based lithography and patterning • nanoimprint lithography techniques and templates • maskless lithography • emerging nanopatterning methods • limits of nanolithography and nanopatterning 2. Pattern Transfer • ion technology • plasma processing: etching, nanotexturing, bonding 3. Materials • metallization and barrier materials • silicon on insulators • dielectrics (low K and high K) • interconnects • new resist materials • nanomaterials for device fabrication • polymers and flexible substrates 4. Inspection and Testing • electron beam testers
• • • 5. • • • • • • 6. • • • • • • 7. • • • •
laser probes signal and image processing nanometrology Advanced Processing and Nanofabrication process integration three dimensional integration rapid thermal processing process modelling and simulation equipment modelling laser assisted processing Advanced Devices nanometer structures for electronic and optoelectronic devices dimension-sensitive device properties advanced MOS devices vacuum nanoelectronics organic electronics mesoscopic devices Advanced fabrication and characterization for heterogeneous micro- and nanosystems, a.o.: mechanical systems optical systems fluidic systems biosystems
Author enquiries Publication Information: Microelectronic Engineering (ISSN 0167-9317). For 2009, volume 86 is scheduled for publication. Subscription prices are available upon request from the Publisher or from the Regional Sales Office nearest you or from this journal’s website (http://www.elsevier.com/locate/ mee). Further information is available on this journal and other Elsevier products through Elsevier’s website (http://www.elsevier.com). Subscriptions are accepted on a prepaid basis only and are entered on a calendar year basis. Issues are sent by standard mail (surface within Europe, air delivery outside Europe). Priority rates are available upon request. Claims for missing issues should be made within six months of the date of dispatch.
Editor (USA) MARTIN PECKERAR Department of Electrical and Computer Engineering University of Maryland 1359 AV Williams Building College Park, MD 20742-3275 U.S.A.
Advisory Editors (Japan) T. Asano, Kyushu Institute of Technology, Fukuoka M. Komuro, National Institute of Advanced Industrial Science and Technology, Ibaraki S. Maegawa, Renesas Technology Corp., Itami S. Matsui, Himeji Institute of Technology, Hyogo H. Mimura, Shizuoka University, Hamamatsu S. Okazaki, ASET, Tokyo
Editor (Japan) MIKIO TAKAI Research Center for Materials Science at Extreme Conditions Osaka University Machikaneyama 1-3, Toyonaka Osaka 560-8531 Japan
Advisory Editors (Europe) G. Declerck, Interuniversitair Micro-Elektronica Centrum, Louvain, Belgium M. Gentili, CNR – Istituto di Elettronica dello Stato Solido, Rome, Italy J. Greer, Tyndall National Institute, Cork, Ireland M.E. Jones, Imperial College, London, U.K. D.P. Kern, Universita¨t Tu¨bingen, Germany H. Launois, L2M CNRS, Bagneux, France R.A. Lawes, Rutherford Appleton Laboratory, Chilton, U.K. P. Paniez, CNET/DTM/TMF, France J. Perrocheau, ELISA, Les Ulis, France P. Vettiger, IBM, Ru¨schlikon, Switzerland E. Wolfgang, Siemens AG, Munich, Germany
Advisory Editors (U.S.A.) H.R. Huff, SEMATECH, Austin, TX A.R. Neureuther, University of California, Berkeley, CA H. Pfeiffer, IBM, Hopewell Junction, NY L. Swanson, FEI Company, Hillsborough, OR K.D. van der Mast, FEI Company, Hillsboro, OR
Editor Emeritus S. Namba, Osaka University, Japan
Founding Editor W.C. Nixon, Cambridge University, U.K.
Aims and Scope MICROELECTRONIC ENGINEERING TOPICS The journal is dedicated to advanced engineering methods for micro- and nanofabrication of electronic devices, circuits and systems. This includes following topics: 1. Nanolithography and Nanopatterning • optical lithography • EUV lithography and masks • charged particle based lithography and patterning • nanoimprint lithography techniques and templates • maskless lithography • emerging nanopatterning methods • limits of nanolithography and nanopatterning 2. Pattern Transfer • ion technology • plasma processing: etching, nanotexturing, bonding 3. Materials • metallization and barrier materials • silicon on insulators • dielectrics (low K and high K) • interconnects • new resist materials • nanomaterials for device fabrication • polymers and flexible substrates 4. Inspection and Testing • electron beam testers
• • • 5. • • • • • • 6. • • • • • • 7. • • • •
laser probes signal and image processing nanometrology Advanced Processing and Nanofabrication process integration three dimensional integration rapid thermal processing process modelling and simulation equipment modelling laser assisted processing Advanced Devices nanometer structures for electronic and optoelectronic devices dimension-sensitive device properties advanced MOS devices vacuum nanoelectronics organic electronics mesoscopic devices Advanced fabrication and characterization for heterogeneous micro- and nanosystems, a.o.: mechanical systems optical systems fluidic systems biosystems
Author enquiries Publication Information: Microelectronic Engineering (ISSN 0167-9317). For 2009, volume 86 is scheduled for publication. Subscription prices are available upon request from the Publisher or from the Regional Sales Office nearest you or from this journal’s website (http://www.elsevier.com/locate/ mee). Further information is available on this journal and other Elsevier products through Elsevier’s website (http://www.elsevier.com). Subscriptions are accepted on a prepaid basis only and are entered on a calendar year basis. Issues are sent by standard mail (surface within Europe, air delivery outside Europe). Priority rates are available upon request. Claims for missing issues should be made within six months of the date of dispatch.