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Integrated-circuit system keeps costs down to earth
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ABSTRACTS ON M I C R O E L E C T R O N I C S AND RELIABILITY
to achieve a high degree of miniaturization in practical equipments. It is suggested that in the compact structure of a miniature equipment the parts used must be mutually compatible in size and shape if they are to be assembled together without undue waste of space. Parts having a simple rectangular shape are proposed and the structural possibilities arising from this choice are then examined. Individual components, thin-film circuits and semiconductor networks can all be used in rectangular modules conforming to these standards of size and shape. By using such parts a flexible system of construction has been evolved currently covering the component density range 150,000 units/ft3 to about 1,000,000 units/fta. Miniaturizing mobile radio equipment. W. KLOEPFER,Frequenz 18, 155 (1964). (In German.) The author discusses the reduction in size of mobile radio equipment, which was made possible by the use of transistors and printed circuits. The miniaturization of coils, variometers, filters, capacitors and other components led to the modern plug-in unit construction mode featuringeasy interchangeability and reduced space requirements. The paper is supported by illustrations showing the progress achieved in recent years.
Integrated-circuit system keeps costs down to earth. F. A. PENDLETON,Electronics 37, 36 (1964). A packaging design that is a practical approach to using integrated circuits in conventional and commercial equipment has been developed by the Collins Radio Co. The design bridges the gap between the high-density integrated-circuit modules with welded or soldered connections, that are used in missile and space systems, and the established approach of using modules made with replaceable printedcircuit-card assemblies. The final size, using integrated circuits and some standard components mounted on printed-circuits is 232 × 133 × 19J~in. This includes space for a power supply and storage area. System considerations in the application ofmicrocircuitry. K. GILLETT,Electrical Design News 9, 18 (1964). The most obvious perturbation resulting from the advent of microelectronics is in the area of packaging. A detailed discussion of device packaging, device interconnections and some overall system packaging considerations is given. Five properties with Which a package may be judged in order to determine its capability of performing its requirements are: (1) To provide protection against adverse mechanical environments. (2) To provide protection from harmful chemical and ionic elements. (3) To provide a form factor and lead configuration that is easy to handle during testing and system fabrication. (4) To provide a path to an external heat exchanger for thermal energy generated within the package. (5) To provide the necessary electrical signal and power linkage between the internal circuit and the external interconnecting system. Each of these is discussed in detail. A.C. behaviour of damaged surface layers on CdS crystals. E. LOH, Solid-State Electronics 7, 887 (1964). Damaged surface layers on the (9001) and (0001) faces of CdS crystals display the high resistance and capacitance characteristic of large trap com:e-ntrations when measured ovei;:the frequency range from 10~-to 10° c/s. Changes observed in the characteristic relaxation spectra as d.c. bias is increased are interpreted in terms of an exponential dependence of the escape frequency of trapped carriers on the electric field. Ambient effect data and their interpretation are also included.
Electronic solid-substance component parts (Part 1). A M6SCHWZ'rZERand E. K6HLER, Nachrichtentechnik 15, 6 (1965). (In German). The authors review all active electronic component parts that have been formed by utilizing the properties (and holes) in solid substances, particularly in semiconductors. The integration of component parts into microsystems also takes places in the solid substance. Common characteristics are demonstrated which may inspire the development engineer and user. Logical circuit for microelectronics. D. ARMGARTH,Nachrichtentechnik 15, 10 (1965). (In German). A logical basic circuit is described, which can be advantageously integrated. By connecting together several similar basic circuits logical systems and pulse circuits can be realized. The dissipation power of an individual stage can be kept in the order of some mW, because the load reflected by the following stages is low. The operating voltage does not require a great constancy.
ABSTRACTS ON M I C R O E L E C T R O N I C S AND RELIABILITY
to achieve a high degree of miniaturization in practical equipments. It is suggested that in the compact structure of a miniature equipment the parts used must be mutually compatible in size and shape if they are to be assembled together without undue waste of space. Parts having a simple rectangular shape are proposed and the structural possibilities arising from this choice are then examined. Individual components, thin-film circuits and semiconductor networks can all be used in rectangular modules conforming to these standards of size and shape. By using such parts a flexible system of construction has been evolved currently covering the component density range 150,000 units/ft3 to about 1,000,000 units/fta. Miniaturizing mobile radio equipment. W. KLOEPFER,Frequenz 18, 155 (1964). (In German.) The author discusses the reduction in size of mobile radio equipment, which was made possible by the use of transistors and printed circuits. The miniaturization of coils, variometers, filters, capacitors and other components led to the modern plug-in unit construction mode featuringeasy interchangeability and reduced space requirements. The paper is supported by illustrations showing the progress achieved in recent years.
Integrated-circuit system keeps costs down to earth. F. A. PENDLETON,Electronics 37, 36 (1964). A packaging design that is a practical approach to using integrated circuits in conventional and commercial equipment has been developed by the Collins Radio Co. The design bridges the gap between the high-density integrated-circuit modules with welded or soldered connections, that are used in missile and space systems, and the established approach of using modules made with replaceable printedcircuit-card assemblies. The final size, using integrated circuits and some standard components mounted on printed-circuits is 232 × 133 × 19J~in. This includes space for a power supply and storage area. System considerations in the application ofmicrocircuitry. K. GILLETT,Electrical Design News 9, 18 (1964). The most obvious perturbation resulting from the advent of microelectronics is in the area of packaging. A detailed discussion of device packaging, device interconnections and some overall system packaging considerations is given. Five properties with Which a package may be judged in order to determine its capability of performing its requirements are: (1) To provide protection against adverse mechanical environments. (2) To provide protection from harmful chemical and ionic elements. (3) To provide a form factor and lead configuration that is easy to handle during testing and system fabrication. (4) To provide a path to an external heat exchanger for thermal energy generated within the package. (5) To provide the necessary electrical signal and power linkage between the internal circuit and the external interconnecting system. Each of these is discussed in detail. A.C. behaviour of damaged surface layers on CdS crystals. E. LOH, Solid-State Electronics 7, 887 (1964). Damaged surface layers on the (9001) and (0001) faces of CdS crystals display the high resistance and capacitance characteristic of large trap com:e-ntrations when measured ovei;:the frequency range from 10~-to 10° c/s. Changes observed in the characteristic relaxation spectra as d.c. bias is increased are interpreted in terms of an exponential dependence of the escape frequency of trapped carriers on the electric field. Ambient effect data and their interpretation are also included.
Electronic solid-substance component parts (Part 1). A M6SCHWZ'rZERand E. K6HLER, Nachrichtentechnik 15, 6 (1965). (In German). The authors review all active electronic component parts that have been formed by utilizing the properties (and holes) in solid substances, particularly in semiconductors. The integration of component parts into microsystems also takes places in the solid substance. Common characteristics are demonstrated which may inspire the development engineer and user. Logical circuit for microelectronics. D. ARMGARTH,Nachrichtentechnik 15, 10 (1965). (In German). A logical basic circuit is described, which can be advantageously integrated. By connecting together several similar basic circuits logical systems and pulse circuits can be realized. The dissipation power of an individual stage can be kept in the order of some mW, because the load reflected by the following stages is low. The operating voltage does not require a great constancy.