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Portable curing system for rapid curing of small areas High-speed uv curing of small areas of adhesives or coatings may be achieved with the RC-250A from Xenon Corporation, Wilmington, MA, USA. This product is said to be able to reduce uv cure time from minutes to fractions of a second (30 cures per minute are possible) depending upon the chemical system and the thickness of the application. As seen in Fig. 3, the RC-250A features a hand-held probe with flexible cord. Requiring a 120 V, 60 Hz outlet for operation, feat delivery is achieved by means of high speed electronic pulses which are converted to uv light at the rate of 120 pulses per second. Very little heat is said to be transferred to the work piece; thus temperaturesensitive parts will not be harmed. The instrument should be useful for such applications as the deep penetration of uv-curable adhesives used for fibre optic cable connections. The probe is equipped with an instant on/off switch. A series of options are available for specialized operations of the RC-250, which may also be adapted for robotic application.
Xenon Corporation, 66 Industrial Way, Wilmington, MA 01887, USA.
Range of Ruberoid products, which includes adhesives specially developed for attaching roof coverings, displayed in redesigned packaging. Ruberoid Building Products, Stockingswater Lane, 8rimsdown, Enfield, EN3 7PP, England.
Screenable conductor paste available for use on printed circuit boards Described as a low fire, single component, fritless silver paste to screen conductors on PC boards, Aremco-Coat 560 is available from the Meclec Company in the UK. Slow to dry, Aremco-Coat 560 is suitable for screen printing. It is said to cure at 95°C for one hour, will
adhere to plastics and metals, and can be screened in line widths down to 0.05 mm. The cured product can be copper-plated.
The Meclec Company, Towerfleld Industrial Estate, 5/6 Towerfield Close, Shoeburynsss, Essex, SS3 9QP, England.
Preview
Fig, 3 The RC-250A will provide rapid uV-curing of small areas of adhesive
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The programme for the conferences accompanying the exhibition on Advanced Materials, which will be held at the Wembley Conference Centre, London, UK, on 2-4 July 1985, is now available. On Wednesday morning, 3 July, there will be a session entitled Adhesive Bonding. The papers presented at this session will include: High performance adhesives and their
INT.J.ADHESION AND ADHESIVES APRIL 1985
influence on design and manufacture in the engineering industries; Failure in bonded joints; The performance of bonded sheet metal structures; and Bonding cemented carbide milling cutter inserts. Programmes and registration forms may be obtained from: Online, Plnner Green House, Ash Hill Drive,
Ptnner, Middlesex, HA5 2AE, UK.