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Proceedings of the third ASME-JSME thermal engineering joint conference, Reno, Nevada, USA. Vol 1
Applied Energy 46 (1993) 93-97
Book Review
Proceedings of the Third ASME-JSME Thermal Engineering Joint Conference, Reno, Nevada, USA. B y J. R, Lloyd & Y. Kurosaki. The American Society of Mechanical Engineers, United Engineering Center, New York, 1991. The vital importance of thermal engineering has been emphasised in this series of volumes concerned with materials processing, environmental problems, bioengineering, space technologies, supercomputer cooling and superconductivity. The contents of these proceedings should serve well thermal-systems researchers in industry, research establishments and universities. The references listed at the end of each paper are particularly useful in trying to keep one up-to-date. Each volume can be purchased individually from the Institution of Mechanical Engineers, London; and are also available, as a set, for £321.00. Vol. 1, 1991. 548pp. ISBN 0-7918-0612-X. Price: £71.00. This covers topics ranging from heat conduction to natural convection in enclosures. One paper presented a general expression for determining the characteristic length for convex bodies experiencing transient conduction. In another paper, it was revealed that the electric and Marangoni convections occur more easily in AC than in DC electric fields, and become increasingly suppressed in the latter as the electric field is increased. A numerical study helped clarify the role and relative importance of timedependent boundary conditions in thermally driven enclosure problems. 93
Applied Energy 46 (1993)---O 1993 Elsevier Science Publishers Ltd, England. Printed in Great Britain
94
Book review
Heat and mass transfers in psychological systems were reported. The results obtained from a thermal behaviour model demonstrated that it is possible to monitor accurately the structural changes in tissue during freezing and that the permeability of the vasculum controls the extent of freezing as well as the extent of permanent structural damage of tissue ensuing. Recent results on welding, casting, manufacturing and materials processing were presented. Using a finite-element formulation, several approaches for dealing with the latent heat evolution associated with solidification have been investigated. In another paper, a general solution for the steady-state temperature field around a sphere moving with a constant velocity in an infinite medium has been applied to the evaluation of the effective rate of heat transfer from a plasma arc, as used in the surface hardening of steel. Several papers reviewed the works of previous heat-transfer investigators. In addition, a list of over 145 thermal-engineering researchers at Japanese universities and research institutes, and in industry is provided. Voi. 2, 1991, 552pp. ISBN 0-7918-0613-8. Price: £71.00. This volume is devoted to boiling heat transfer as well as multiphase flow projects. Recent experimental observations and analytical predictions regarding forced-convection boiling have been reviewed. It was concluded that existing mathematical models are inadequate to represent the critical heat flux (CHF) in flow boiling. Another investigation determined the thermal behaviour in transition boiling, and described the design features which can lead to improved post-CHF performance. Derivation of the equations for interfacial m o m e n t u m transfer between two phases in three-phase flow has been undertaken. It has been shown that for impacting sprays, the droplet size has a strong effect on the droplet dispersion and impaction dynamics. In another paper, the effects of tube diameter and flow direction on the hold-up and the shear stress of air-water annular two-phase flow were examined. Recent developments in high-density packaging and the cooling of electronic components have been described. A non-dimensional behaviour model has been developed to investigate the effects of the heat source on a hybrid substrate. In another investigation, experiments were performed to assess the feasibility of cooling simulated microelectronic chips or cold 'plates' (mounted on the inner wall of a cylindrical vessel) by a dielectric liquid, flowing at a high velocity parallel to the vessel wall. In addition, it was suggested that thermal transport models, which are based on isolated bubble behaviour, are applicable to nucleate boiling of electronic cooling fluids.
Book Review
Proceedings of the Third ASME-JSME Thermal Engineering Joint Conference, Reno, Nevada, USA. B y J. R, Lloyd & Y. Kurosaki. The American Society of Mechanical Engineers, United Engineering Center, New York, 1991. The vital importance of thermal engineering has been emphasised in this series of volumes concerned with materials processing, environmental problems, bioengineering, space technologies, supercomputer cooling and superconductivity. The contents of these proceedings should serve well thermal-systems researchers in industry, research establishments and universities. The references listed at the end of each paper are particularly useful in trying to keep one up-to-date. Each volume can be purchased individually from the Institution of Mechanical Engineers, London; and are also available, as a set, for £321.00. Vol. 1, 1991. 548pp. ISBN 0-7918-0612-X. Price: £71.00. This covers topics ranging from heat conduction to natural convection in enclosures. One paper presented a general expression for determining the characteristic length for convex bodies experiencing transient conduction. In another paper, it was revealed that the electric and Marangoni convections occur more easily in AC than in DC electric fields, and become increasingly suppressed in the latter as the electric field is increased. A numerical study helped clarify the role and relative importance of timedependent boundary conditions in thermally driven enclosure problems. 93
Applied Energy 46 (1993)---O 1993 Elsevier Science Publishers Ltd, England. Printed in Great Britain
94
Book review
Heat and mass transfers in psychological systems were reported. The results obtained from a thermal behaviour model demonstrated that it is possible to monitor accurately the structural changes in tissue during freezing and that the permeability of the vasculum controls the extent of freezing as well as the extent of permanent structural damage of tissue ensuing. Recent results on welding, casting, manufacturing and materials processing were presented. Using a finite-element formulation, several approaches for dealing with the latent heat evolution associated with solidification have been investigated. In another paper, a general solution for the steady-state temperature field around a sphere moving with a constant velocity in an infinite medium has been applied to the evaluation of the effective rate of heat transfer from a plasma arc, as used in the surface hardening of steel. Several papers reviewed the works of previous heat-transfer investigators. In addition, a list of over 145 thermal-engineering researchers at Japanese universities and research institutes, and in industry is provided. Voi. 2, 1991, 552pp. ISBN 0-7918-0613-8. Price: £71.00. This volume is devoted to boiling heat transfer as well as multiphase flow projects. Recent experimental observations and analytical predictions regarding forced-convection boiling have been reviewed. It was concluded that existing mathematical models are inadequate to represent the critical heat flux (CHF) in flow boiling. Another investigation determined the thermal behaviour in transition boiling, and described the design features which can lead to improved post-CHF performance. Derivation of the equations for interfacial m o m e n t u m transfer between two phases in three-phase flow has been undertaken. It has been shown that for impacting sprays, the droplet size has a strong effect on the droplet dispersion and impaction dynamics. In another paper, the effects of tube diameter and flow direction on the hold-up and the shear stress of air-water annular two-phase flow were examined. Recent developments in high-density packaging and the cooling of electronic components have been described. A non-dimensional behaviour model has been developed to investigate the effects of the heat source on a hybrid substrate. In another investigation, experiments were performed to assess the feasibility of cooling simulated microelectronic chips or cold 'plates' (mounted on the inner wall of a cylindrical vessel) by a dielectric liquid, flowing at a high velocity parallel to the vessel wall. In addition, it was suggested that thermal transport models, which are based on isolated bubble behaviour, are applicable to nucleate boiling of electronic cooling fluids.