- Email: [email protected]
Target for cathode sputtering
Barrel Electroplating Device U.S.Pafent5,490,917. Feb. 13, 1996 A.E. Lazaro and W. Yates, assignors Line Manufacturing Co., Chicago
to Hardwood
.4 method of spraying a plurality of parts to be plated in a barrel that is operatively associated with a plating tank containing electrolyte, the barrel including a perforated means that sprays electrolyte on the parts below the spray where the barrel can be moved to removably associate it with a source of electrolyte under pressure and can be rotated while the hub thereof remains staionary by a coupling device wherein at least one of the coupling memberz is associated with the barrel and extending therefrom in a fixed location with respect to the barrel, the other of the coupling members is located at a fixed position to enable removable engagement with the other coupling member, comprising moving the electroplating barrel into a position where it is removably coupled with the source of electrolyte under pressure; agitating the parts to be plated in the plating barrel by rotating the plating barrel; and spraying the parts with the electrolyte through the perforated spray means from a fixed position above the parts within the
plating barrel while the barrel agitates the parts whereby more efficient electroplating is accomplished.
Target for Cathode
Sputtering Apparatus U.S.Patenf 5490,910. Feb. 13, 1996
A vacuum coating apparatus comprising a sputtering target including a ring-shaped body made of a metal selected from the group consisting of aluminum and aluminum alloy, the body having a target surface with an inner target rim, an outer target rim, and a ring-shaped curved and substantially concave sputtering surface between the linear and outer target rim.
C. W. Nelson and RD. Weir, assignors Memory Systems Inc., Fremont, Calif
A circularly symmetric ratus with hollow-cathode
Magnetron
to Tulip
sputtering appaplasma devices.
Sputtering
U.S. Pafenf 5,490,913. Feb. 13, 1996 R. Scberfler et al, assignors to Balzers AG, Balzers, Liecbtensfein
Abrasive
A magnetic field enchanced sputtering arrangement with vacuum treatment apparatus.
Sputtering
Target
U.S. Patent 5490,914. Feb. 13, 1996 S. Hurwitl and C. Weiss, assignors to Sony Corp., Tokyo and Materials Research Corp., Orangeburg, N.Y.
A high utilization sputtering target for a cathode assembly.
S
olidstrip’s excellent combination of hardness, density and particle angularity delivers a high stripping rate and consistent performance.
Sputtering
U.S. Pafent5,490,915. Feb. 13, 1996 6. Bracher, assignor to Balzers AG, Balzers, Liechtenstein
Filament
U.S. Patent .5,491,025. Feb. 13, 1996 R.M. Pihl et a/., assignors to 3M Co., St. Paul, Minn.
An abrasive filament comprising a core having a continuous surface throughout its length and consisting essentially of a first thermoplastic elastomer having abrasive particles dispersed and adhered therein; and a sheath coterminous with the core, the sheath consisting essentially of a blend of a second thermoplastic elastomer and a thermoplastic polymer.
QUALITY METALFINISHING FROMEIDSCHUN Eidschun builds dependable, continuous duty process systems for metal finishing that offer lower operating costs, higher productivity and improved product quality. Call todayfor details.
S
olidstrip strips delicate metal and composites safer. And, because it produces minimal dust, Solidstrip provides a safer, cleaner workplace.
C
your media usage up to 50% by using Solidstrip .
ut
EIDSCHUN
ElOOOSystem configured for reel-to-fee/plating
5131113th AvenueNorth*Clearwater FL34620*(313) 572-9367. Fax(813) 573-9193 INTERNET: http://eidschun.com ??e-mail:[email protected]
Circle 113 on reader information card
METAL
FINISHING
.
NOVEMBER
1996
Circle 036 on reader information card
117
to Hardwood
.4 method of spraying a plurality of parts to be plated in a barrel that is operatively associated with a plating tank containing electrolyte, the barrel including a perforated means that sprays electrolyte on the parts below the spray where the barrel can be moved to removably associate it with a source of electrolyte under pressure and can be rotated while the hub thereof remains staionary by a coupling device wherein at least one of the coupling memberz is associated with the barrel and extending therefrom in a fixed location with respect to the barrel, the other of the coupling members is located at a fixed position to enable removable engagement with the other coupling member, comprising moving the electroplating barrel into a position where it is removably coupled with the source of electrolyte under pressure; agitating the parts to be plated in the plating barrel by rotating the plating barrel; and spraying the parts with the electrolyte through the perforated spray means from a fixed position above the parts within the
plating barrel while the barrel agitates the parts whereby more efficient electroplating is accomplished.
Target for Cathode
Sputtering Apparatus U.S.Patenf 5490,910. Feb. 13, 1996
A vacuum coating apparatus comprising a sputtering target including a ring-shaped body made of a metal selected from the group consisting of aluminum and aluminum alloy, the body having a target surface with an inner target rim, an outer target rim, and a ring-shaped curved and substantially concave sputtering surface between the linear and outer target rim.
C. W. Nelson and RD. Weir, assignors Memory Systems Inc., Fremont, Calif
A circularly symmetric ratus with hollow-cathode
Magnetron
to Tulip
sputtering appaplasma devices.
Sputtering
U.S. Pafenf 5,490,913. Feb. 13, 1996 R. Scberfler et al, assignors to Balzers AG, Balzers, Liecbtensfein
Abrasive
A magnetic field enchanced sputtering arrangement with vacuum treatment apparatus.
Sputtering
Target
U.S. Patent 5490,914. Feb. 13, 1996 S. Hurwitl and C. Weiss, assignors to Sony Corp., Tokyo and Materials Research Corp., Orangeburg, N.Y.
A high utilization sputtering target for a cathode assembly.
S
olidstrip’s excellent combination of hardness, density and particle angularity delivers a high stripping rate and consistent performance.
Sputtering
U.S. Pafent5,490,915. Feb. 13, 1996 6. Bracher, assignor to Balzers AG, Balzers, Liechtenstein
Filament
U.S. Patent .5,491,025. Feb. 13, 1996 R.M. Pihl et a/., assignors to 3M Co., St. Paul, Minn.
An abrasive filament comprising a core having a continuous surface throughout its length and consisting essentially of a first thermoplastic elastomer having abrasive particles dispersed and adhered therein; and a sheath coterminous with the core, the sheath consisting essentially of a blend of a second thermoplastic elastomer and a thermoplastic polymer.
QUALITY METALFINISHING FROMEIDSCHUN Eidschun builds dependable, continuous duty process systems for metal finishing that offer lower operating costs, higher productivity and improved product quality. Call todayfor details.
S
olidstrip strips delicate metal and composites safer. And, because it produces minimal dust, Solidstrip provides a safer, cleaner workplace.
C
your media usage up to 50% by using Solidstrip .
ut
EIDSCHUN
ElOOOSystem configured for reel-to-fee/plating
5131113th AvenueNorth*Clearwater FL34620*(313) 572-9367. Fax(813) 573-9193 INTERNET: http://eidschun.com ??e-mail:[email protected]
Circle 113 on reader information card
METAL
FINISHING
.
NOVEMBER
1996
Circle 036 on reader information card
117