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The use of the scanning electron microscope in the failure analysis of a typical semiconductor device
520
World Abstracts on Microelectronics and Reliability
which the manufacturer had attained and specified. An acceptance inspection must take both quantities into account. The following contribution deals with: Evaluation of inspection results with the aid of statistical analysis: Definitions of supply quality and AQL iacceptable quality level) as well as methods for assuring reliability; Influence of the assembly techniques lease, internal connection method) on reliability.
The use of the scanning electron microscope in the failure analysis of a typical semiconductor device. A. K. SINHA and M. C. MATHUR. The QR Journal, India, p. 7l (May 1976). The advantage of using the scanning electron microscope (SEM) in the failure analysis of semiconductor device and some of the failure mechanisms of a typical semiconductor device have been discussed. The bonding and foreign particle contamination problems have been discussed in detail. Illustrations are given with some photographs taken with SEM in the study of those failure mechanisms. To the best of our knowledge, this is the first time in India that the SEM has been used for the failure analysis of electronic components.
IC screening. Reliability or ripoff. J. T. HENDERSON. Proc.
A. Reliability and Maintainability Symposium, Nevada, U.S.A.p. 452 (20-22 Jan. 1976). This paper will outline the merits of Specification Control Drawings (SCD's), some of the potential pitfalls of M1L-STD-883A, and the general subject of assuring yourself of a reliable integrated circuit.
Part reliability information management. ROGER L, BOLLENBACHER. Proc. A. Reliability and Maintainability Symposium. Nevada U.S.A.p. 461 (20-22 Jan. 1976). The development of a computerized information management system to maintain, manage, control, and report reliability information is discussed. Reasons for the failure of early forms of the system are presented. A description is given of the present working system, which utilizes some of the latest computer and data base/data communication technology. Reasons for the success of this system and some future plans are then presented.
A comparative evaluation of IC packages in commercial real-time computer terminals. C. M. HALL JR.. E. E. SHAD[: and J. R. SHUKIS. Proc. A. Reliability and Maintainability Symposium, Nevada, U.S,A. p. 170 (20-22 Jan. 1976). In the past few years there has been quite a bit of discussion over the relative merits of the new Epoxy B/Novolac IC packages versus the older style of plastics and Cerdip ceramics. An earlier paper by R. E. Sundius presented failure data on the old style plastic packaged versus Cerdip ceramic packaged IC's and concluded that the old plastics were inadequate for current commercial real-time computer systems reliability requirements. This paper describes a more recent program evaluating all three package types. Upon evaluating the data, the conclusion is presented that. whereas the reliability of the old style plastics was inadequate, the new Epoxy B/Novolac packages are equivalent to the standard Cerdips for bipolar IC's in commercial computer equipment. Is Ruby ready. THOMAS R. GAGNIER. Proc, A. Reliability and Maintainability Symposium. Nevada. U.S.A.p. 269 (20-22 Jan. 1976). Based upon an extensive collection of field failure modes, failure mechanisms, and failure rate data. laser system failure rate prediction models for high population lasers have been defined, quantified, and validated on six laser families: helium/neon, argon ion, CO2 sealed, CO2 flowing, solid-state Nd:YAG, and solid state ruby. This paper describes the derivation and use of the failure rate prediction model for the solid state ruby laser.
Long term dormant storage testing, initial results. THADDEUS K. KOBYLARZ and ALBERT J. GRAF. Proc. A. Reliabilit): and Maintainability Symposium, Nevada, U.S.A.p. 176 (20--22 Jan. 1976). Because the military is confronted with long term dormant storage of its electronic components, a prototype automated testing system has been developed to ascertain the feasibility of accumulating data for the purpose of assessing dormant storage deterioration. Two device types were selected in the initial pursuit. These are the CD40007AD integrated circuit, connected as a triinverter, and the 2N3029 silicon controlled rectifier. All of the measured parameters have manifested time trends in the direction of non-catastrophic failure modes. This paper describes the analyses performed on the accumulated data and some of its consequences, including mean-timeto-failure predictions.
3. C I R C U I T A N D S Y S T E M S R E L I A B I L I T Y , M A I N T E N A N C E On a cumulative damage model with N different components. TOSH10 NAKAGAWA.IEEE Trans. Reliab. R-25 (2), 112 (June 1976). A cumulative damage model with n different components is considered. The joint distribution of the total amounts of damage to n components, the distribution of the time to failure, and the failure rate are derived. The noncumulative damage model is also discussed.
Trends in failure survival techniques for avionic systems. D. C. PRICE. The Radio and Electronic Engineer. 46, (7) 343. (July 1976). Electronic equipment installed in aircraft has to satisfy extremely demanding requirements to achieve the requisite levels of safety and reliability, while operating in a physical environment at variance with the desirable conditions for long life of electronic components. The techniques in present use are reviewed, in particular the use of digital control systems, and likely future developments are surveyed. Reliability demonstration of aerospace devices. N. K. DEBNATH and Mrs. RADHA KRISHNAN. The QR Journal, India p. 59 (May 1976). This paper deals with some specific
AND REDUNDANCY
methods of reliability demonstration for aerospace devices. Each of these methods calls for less number of flight tests to demonstrate the required reliability with a particular confidence level, as compared to the classical reliability demonstration technique. Emphasis is given on engineering confidence, reliability estimation using variable data, reliability estimation from tests on sub-systems and building the confidence through subscale tests.
Important event-tree and fault-tree considerations in the reactor safety study. SAUL LEVINE and WILLIAM E. VESELEY JR. IEEE Trans. Reliab. R-25, (3), 132. (August 1976). This article discusses certain key considerations in using event trees and fault trees for risk analyses, as applied in the Reactor Safety Study. The discussions emphasize applications and practical modeling implementation. Objectives of nuclear system reliability and safety studies. JOSEPH REAGAN PENLAND. IEEE Trans. Reliab. R-25, (3), 147 (August 1976). This paper describes the types of reliability and probabilistic safety studies which have been performed in the commercial nuclear power industry. The role
World Abstracts on Microelectronics and Reliability
which the manufacturer had attained and specified. An acceptance inspection must take both quantities into account. The following contribution deals with: Evaluation of inspection results with the aid of statistical analysis: Definitions of supply quality and AQL iacceptable quality level) as well as methods for assuring reliability; Influence of the assembly techniques lease, internal connection method) on reliability.
The use of the scanning electron microscope in the failure analysis of a typical semiconductor device. A. K. SINHA and M. C. MATHUR. The QR Journal, India, p. 7l (May 1976). The advantage of using the scanning electron microscope (SEM) in the failure analysis of semiconductor device and some of the failure mechanisms of a typical semiconductor device have been discussed. The bonding and foreign particle contamination problems have been discussed in detail. Illustrations are given with some photographs taken with SEM in the study of those failure mechanisms. To the best of our knowledge, this is the first time in India that the SEM has been used for the failure analysis of electronic components.
IC screening. Reliability or ripoff. J. T. HENDERSON. Proc.
A. Reliability and Maintainability Symposium, Nevada, U.S.A.p. 452 (20-22 Jan. 1976). This paper will outline the merits of Specification Control Drawings (SCD's), some of the potential pitfalls of M1L-STD-883A, and the general subject of assuring yourself of a reliable integrated circuit.
Part reliability information management. ROGER L, BOLLENBACHER. Proc. A. Reliability and Maintainability Symposium. Nevada U.S.A.p. 461 (20-22 Jan. 1976). The development of a computerized information management system to maintain, manage, control, and report reliability information is discussed. Reasons for the failure of early forms of the system are presented. A description is given of the present working system, which utilizes some of the latest computer and data base/data communication technology. Reasons for the success of this system and some future plans are then presented.
A comparative evaluation of IC packages in commercial real-time computer terminals. C. M. HALL JR.. E. E. SHAD[: and J. R. SHUKIS. Proc. A. Reliability and Maintainability Symposium, Nevada, U.S,A. p. 170 (20-22 Jan. 1976). In the past few years there has been quite a bit of discussion over the relative merits of the new Epoxy B/Novolac IC packages versus the older style of plastics and Cerdip ceramics. An earlier paper by R. E. Sundius presented failure data on the old style plastic packaged versus Cerdip ceramic packaged IC's and concluded that the old plastics were inadequate for current commercial real-time computer systems reliability requirements. This paper describes a more recent program evaluating all three package types. Upon evaluating the data, the conclusion is presented that. whereas the reliability of the old style plastics was inadequate, the new Epoxy B/Novolac packages are equivalent to the standard Cerdips for bipolar IC's in commercial computer equipment. Is Ruby ready. THOMAS R. GAGNIER. Proc, A. Reliability and Maintainability Symposium. Nevada. U.S.A.p. 269 (20-22 Jan. 1976). Based upon an extensive collection of field failure modes, failure mechanisms, and failure rate data. laser system failure rate prediction models for high population lasers have been defined, quantified, and validated on six laser families: helium/neon, argon ion, CO2 sealed, CO2 flowing, solid-state Nd:YAG, and solid state ruby. This paper describes the derivation and use of the failure rate prediction model for the solid state ruby laser.
Long term dormant storage testing, initial results. THADDEUS K. KOBYLARZ and ALBERT J. GRAF. Proc. A. Reliabilit): and Maintainability Symposium, Nevada, U.S.A.p. 176 (20--22 Jan. 1976). Because the military is confronted with long term dormant storage of its electronic components, a prototype automated testing system has been developed to ascertain the feasibility of accumulating data for the purpose of assessing dormant storage deterioration. Two device types were selected in the initial pursuit. These are the CD40007AD integrated circuit, connected as a triinverter, and the 2N3029 silicon controlled rectifier. All of the measured parameters have manifested time trends in the direction of non-catastrophic failure modes. This paper describes the analyses performed on the accumulated data and some of its consequences, including mean-timeto-failure predictions.
3. C I R C U I T A N D S Y S T E M S R E L I A B I L I T Y , M A I N T E N A N C E On a cumulative damage model with N different components. TOSH10 NAKAGAWA.IEEE Trans. Reliab. R-25 (2), 112 (June 1976). A cumulative damage model with n different components is considered. The joint distribution of the total amounts of damage to n components, the distribution of the time to failure, and the failure rate are derived. The noncumulative damage model is also discussed.
Trends in failure survival techniques for avionic systems. D. C. PRICE. The Radio and Electronic Engineer. 46, (7) 343. (July 1976). Electronic equipment installed in aircraft has to satisfy extremely demanding requirements to achieve the requisite levels of safety and reliability, while operating in a physical environment at variance with the desirable conditions for long life of electronic components. The techniques in present use are reviewed, in particular the use of digital control systems, and likely future developments are surveyed. Reliability demonstration of aerospace devices. N. K. DEBNATH and Mrs. RADHA KRISHNAN. The QR Journal, India p. 59 (May 1976). This paper deals with some specific
AND REDUNDANCY
methods of reliability demonstration for aerospace devices. Each of these methods calls for less number of flight tests to demonstrate the required reliability with a particular confidence level, as compared to the classical reliability demonstration technique. Emphasis is given on engineering confidence, reliability estimation using variable data, reliability estimation from tests on sub-systems and building the confidence through subscale tests.
Important event-tree and fault-tree considerations in the reactor safety study. SAUL LEVINE and WILLIAM E. VESELEY JR. IEEE Trans. Reliab. R-25, (3), 132. (August 1976). This article discusses certain key considerations in using event trees and fault trees for risk analyses, as applied in the Reactor Safety Study. The discussions emphasize applications and practical modeling implementation. Objectives of nuclear system reliability and safety studies. JOSEPH REAGAN PENLAND. IEEE Trans. Reliab. R-25, (3), 147 (August 1976). This paper describes the types of reliability and probabilistic safety studies which have been performed in the commercial nuclear power industry. The role