- Email: [email protected]
Zinc phosphate coating for a varistor
ducing a stable contact angle with water of not more than 15”.
Method for Preparing Aluminum Alloy Fasteners U.S.Patent 5614,037. Mar.25, 1997 S.G. Keener, assignor to McDonnell Douglas Corp., Long Beach, Calif. A method for preparing an aluminumalloy article comprising providing a 7050 aluminum-alloy fastener; providing a corrosion-resistant, curable organic coating material comprising a phenolic resin and an organic solvent; applying the material; and heating to a temperature sufficient to simultaneously heat-treat the aluminum-alloy fastener and cure the organic coating.
Apparatus for Chemical Etching U.S.Pafent5,614,056. Mar. 25, 1997 EJ Frankoski et a/., assignors to IBM Cop., Armonk, N. Y
transporting a substrate over the surface characterized in that the apparatus further comprises a plurality of spaced-apart injectors capable of producing a fluid jet, which impinges upon the substrate.
Sputtering Apparatus for Forming Metal Lines U.S. Patent 5,614,070. Mar. 25, 1997 J. Moon, assignor to Samsung Nectronics Co. Ltd., Suwon, Republic of Korea
A sputtering apparatus comprising a vacuum sputtering chamber; a target made of a sputterable source material; a first electrode secured to a side of the target; a silicon carbide chuck disposed in spacedapart, opposed relationship to the target; a second electrode secured to a second side of the chuck; and gas injectors for injecting gases into the interior of the chamber.
Sputtering Shield
An apparatus comprising at least a first surface of finite dimensions including an entrance edge and an exit edge and characterized by an axis extending from the entrance edge to the exit edge and means for
U.S. Patent 5,614,071. Mar. 25,1997 N. Mahvan ef al, assignors to HMT Technology Corp., Fremonf, Calif. A sputtering apparatus shield for capturing sputtered material comprising a support
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-_
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MICRO TUFF is an ultra-modern process that provides greatly extended life for plated and unplated metallic surfaces.
Reduce Costs Superior Plating Speed
??
Technical Support ??
Smoother, Brighter, Harder Deposits
??
Free Bath Analysis ??
Drive, Twinsburg,
Ohio 44087
AIL: [email protected]
Circle 040 on reeder FINISHING
.
DECEMBER
A method of providing a semiconductor device with an inorganic electrically insulative layer, comprising exposing the semiconductor device to a phosphoric acid solution to form a phosphate coating on the exposed semiconductor surfaces, and not on the end terminations, and coating the semiconductor device with an electrically conductive metal in a process in which the device is electrically charged and submerged in a plating solution, the metal being formed on the end terminations and not on the phosphate coating because the phosphate coating is not electrically conductive.
_
??
METAL
U.S. Patent 5,614,074. Mar. 25, 1997 i? Ravindranathan, assignor to Harris Corp., Melbourne, F/a.
????
USER FRIENDLY CHROME BATHS
2030 Midway
Zinc Phosphate Coating for a Varistor
ler Fantastic :inish.
The Future LooksBrighterWith -
having an inner expanse adapted to capture such sputtered material, the expanse defining a two-dimensional array of cavities, each formed of concave wall surfaces, where the intersections of the wall surfaces of adjacent cavities form a two-dimensional array of edges on the expanse.
1997
I
Corrosion Resistance Is Dramatically Increased Greatly Extended Wear Resistance Lubricity Enhanced Impregnates Into Crack Structure Easy In-House Application
Phone (330) 963-6360
Fax (330) 963-6362
INTERNET: plating.com
information card 69
Method for Preparing Aluminum Alloy Fasteners U.S.Patent 5614,037. Mar.25, 1997 S.G. Keener, assignor to McDonnell Douglas Corp., Long Beach, Calif. A method for preparing an aluminumalloy article comprising providing a 7050 aluminum-alloy fastener; providing a corrosion-resistant, curable organic coating material comprising a phenolic resin and an organic solvent; applying the material; and heating to a temperature sufficient to simultaneously heat-treat the aluminum-alloy fastener and cure the organic coating.
Apparatus for Chemical Etching U.S.Pafent5,614,056. Mar. 25, 1997 EJ Frankoski et a/., assignors to IBM Cop., Armonk, N. Y
transporting a substrate over the surface characterized in that the apparatus further comprises a plurality of spaced-apart injectors capable of producing a fluid jet, which impinges upon the substrate.
Sputtering Apparatus for Forming Metal Lines U.S. Patent 5,614,070. Mar. 25, 1997 J. Moon, assignor to Samsung Nectronics Co. Ltd., Suwon, Republic of Korea
A sputtering apparatus comprising a vacuum sputtering chamber; a target made of a sputterable source material; a first electrode secured to a side of the target; a silicon carbide chuck disposed in spacedapart, opposed relationship to the target; a second electrode secured to a second side of the chuck; and gas injectors for injecting gases into the interior of the chamber.
Sputtering Shield
An apparatus comprising at least a first surface of finite dimensions including an entrance edge and an exit edge and characterized by an axis extending from the entrance edge to the exit edge and means for
U.S. Patent 5,614,071. Mar. 25,1997 N. Mahvan ef al, assignors to HMT Technology Corp., Fremonf, Calif. A sputtering apparatus shield for capturing sputtered material comprising a support
_
--
-_
----
MICRO TUFF is an ultra-modern process that provides greatly extended life for plated and unplated metallic surfaces.
Reduce Costs Superior Plating Speed
??
Technical Support ??
Smoother, Brighter, Harder Deposits
??
Free Bath Analysis ??
Drive, Twinsburg,
Ohio 44087
AIL: [email protected]
Circle 040 on reeder FINISHING
.
DECEMBER
A method of providing a semiconductor device with an inorganic electrically insulative layer, comprising exposing the semiconductor device to a phosphoric acid solution to form a phosphate coating on the exposed semiconductor surfaces, and not on the end terminations, and coating the semiconductor device with an electrically conductive metal in a process in which the device is electrically charged and submerged in a plating solution, the metal being formed on the end terminations and not on the phosphate coating because the phosphate coating is not electrically conductive.
_
??
METAL
U.S. Patent 5,614,074. Mar. 25, 1997 i? Ravindranathan, assignor to Harris Corp., Melbourne, F/a.
????
USER FRIENDLY CHROME BATHS
2030 Midway
Zinc Phosphate Coating for a Varistor
ler Fantastic :inish.
The Future LooksBrighterWith -
having an inner expanse adapted to capture such sputtered material, the expanse defining a two-dimensional array of cavities, each formed of concave wall surfaces, where the intersections of the wall surfaces of adjacent cavities form a two-dimensional array of edges on the expanse.
1997
I
Corrosion Resistance Is Dramatically Increased Greatly Extended Wear Resistance Lubricity Enhanced Impregnates Into Crack Structure Easy In-House Application
Phone (330) 963-6360
Fax (330) 963-6362
INTERNET: plating.com
information card 69