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4891585 Multiple lead probe for integrated circuits in wafer form
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test contacts. The contact movement is initiated by the components here, while the test contacts are fixed. For this purpose, the components are displaced into the test channel crosswise to the direction of transportation. A shuttle is arranged between the output magazine and a test unit (6) for the components, containing the test channel. The shuttle sits on a shuttle sliding carriage with which it is possible to move along the individual magazine channels. The shuttle may be adjusted in respect of the shuttle sliding carriage executing just the conveying movement, between a loading position, a transporting position and an unloading position. In order to be able to test the components successively in the test unit, they are isolated by means of an isolating apparatus. This consists of two stopping elements which are arranged one after another with interspacing in the direction of transportation of the components, which are capable of being adjusted transverse to the direction of transportation and which are connected with each other by means of a pendulum mechanism. The latter guarantees that the stopping elements are alternately dipped into or drawn out of an isolating channel.
4890148 SEMICONDUCTOR MEMORY C E L L D E V I C E W I T H THICK INSULATIVE LAYER Shuji Ikeda, Kouich Nagasawa, Satoshi Meguro, Sho Y a m a m o t o , Koganei, Japan assigned to Hitachi Ltd A static R A M exhibiting a high reliability and suited to a higher density of integration is disclosed. In each memory cell of this static RAM, the cross coupling of a flip-flop circuit is made by gate electrodes of M I S F E T s constituting this flip-flop circuit. In addition, a source line is formed by the same step as that of a word line. A resistance value of a polycrystalline silicon layer which is a load resistor is changed in accordance with information to be stored. Furthermore, semiconductor regions for preventing soft errors attributed to alpha particles etc. are formed under the M I S F E T s constituting the flip-flop circuit, so that the channels are not adversely affected.
4891585 M U L T I P L E LEAD PROBE FOR INTEGRATED CIRCUITS IN WAFER F O R M Bozidar Janko, Kenneth R Smith assigned to Tektronix Inc A probe assembly for use in testing an integrated circuit embodied in an integrated circuit chip in wafer form, comprises a stiff support member formed with an aperture, and a membrane. Both the support member and the membrane comprise dielectric material and portions of conductive material supported by the dielectric material in electrically-insulated relationship. The portions of conductive material of the membrane constitute inner contact elements distributed over a main face of the membrane in a pattern that corresponds to the pattern in which contact areas are distributed over the contact face of the chip under test, outer contact elements distributed about a peripheral region of the membrane in a second pattern, and transmission lines extending from the inner contact elements to the outer contact elements respectively. The portions of conductive material of the support member comprise inner contact elements distributed about the aperture in a pattern corresponding to the second pattern, and transmission lines extending from the inner contact elements of the support member for connection to testing apparatus. The membrane is secured to the support member in a manner such that the membrane overlies the aperture in the support member. The outer contact elements of the membrane are in electrically-conductive contact with respective inner contact elements of the support member. The inner contact elements of the membrane include contact bumps that project from the membrane beyond other elements that lie at a distance of less than twice the diameter of the wafer from the contact bumps.
4891586 IC GRABBER PROBE David Leber, William B Tuff, Paul Verstrate assigned to Tektronix lnc An electrical test probe has a electrically conductive hollow elongate body with an exterior coating of electrically insulative material. An output connector is formed by soldering an electrically conductive wire to the exterior of the
New Patents
test contacts. The contact movement is initiated by the components here, while the test contacts are fixed. For this purpose, the components are displaced into the test channel crosswise to the direction of transportation. A shuttle is arranged between the output magazine and a test unit (6) for the components, containing the test channel. The shuttle sits on a shuttle sliding carriage with which it is possible to move along the individual magazine channels. The shuttle may be adjusted in respect of the shuttle sliding carriage executing just the conveying movement, between a loading position, a transporting position and an unloading position. In order to be able to test the components successively in the test unit, they are isolated by means of an isolating apparatus. This consists of two stopping elements which are arranged one after another with interspacing in the direction of transportation of the components, which are capable of being adjusted transverse to the direction of transportation and which are connected with each other by means of a pendulum mechanism. The latter guarantees that the stopping elements are alternately dipped into or drawn out of an isolating channel.
4890148 SEMICONDUCTOR MEMORY C E L L D E V I C E W I T H THICK INSULATIVE LAYER Shuji Ikeda, Kouich Nagasawa, Satoshi Meguro, Sho Y a m a m o t o , Koganei, Japan assigned to Hitachi Ltd A static R A M exhibiting a high reliability and suited to a higher density of integration is disclosed. In each memory cell of this static RAM, the cross coupling of a flip-flop circuit is made by gate electrodes of M I S F E T s constituting this flip-flop circuit. In addition, a source line is formed by the same step as that of a word line. A resistance value of a polycrystalline silicon layer which is a load resistor is changed in accordance with information to be stored. Furthermore, semiconductor regions for preventing soft errors attributed to alpha particles etc. are formed under the M I S F E T s constituting the flip-flop circuit, so that the channels are not adversely affected.
4891585 M U L T I P L E LEAD PROBE FOR INTEGRATED CIRCUITS IN WAFER F O R M Bozidar Janko, Kenneth R Smith assigned to Tektronix Inc A probe assembly for use in testing an integrated circuit embodied in an integrated circuit chip in wafer form, comprises a stiff support member formed with an aperture, and a membrane. Both the support member and the membrane comprise dielectric material and portions of conductive material supported by the dielectric material in electrically-insulated relationship. The portions of conductive material of the membrane constitute inner contact elements distributed over a main face of the membrane in a pattern that corresponds to the pattern in which contact areas are distributed over the contact face of the chip under test, outer contact elements distributed about a peripheral region of the membrane in a second pattern, and transmission lines extending from the inner contact elements to the outer contact elements respectively. The portions of conductive material of the support member comprise inner contact elements distributed about the aperture in a pattern corresponding to the second pattern, and transmission lines extending from the inner contact elements of the support member for connection to testing apparatus. The membrane is secured to the support member in a manner such that the membrane overlies the aperture in the support member. The outer contact elements of the membrane are in electrically-conductive contact with respective inner contact elements of the support member. The inner contact elements of the membrane include contact bumps that project from the membrane beyond other elements that lie at a distance of less than twice the diameter of the wafer from the contact bumps.
4891586 IC GRABBER PROBE David Leber, William B Tuff, Paul Verstrate assigned to Tektronix lnc An electrical test probe has a electrically conductive hollow elongate body with an exterior coating of electrically insulative material. An output connector is formed by soldering an electrically conductive wire to the exterior of the