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Motorola integrated wireless data solution
Microelectronics Journal, 26 (1995) 4
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Motorola integrated wireless data solution Announced at the Wireless Symposium and Exhibition in Santa Clara, the 3-IC chipset from Motorola is aimed specifically at the 2.4-2.5 GHz ISM band for wireless data applications such ¢t~ LANs, datalinks, RFID and cordless phones. The chipset is a textbook example of reconciling the often conflicting demands of performance, efficiency, size and cost for user-friendly portable applications. The chipset from Motorola's Communications Semiconductor Product Division is shown in a simplified block diagram of a radio modem which is a typical application at the 2.4 GHz ISM band, Figure 1. Based on Motorola SPS components this design is intended for GFSK in a FHSS architecture but could be adapted to DSSS or other modulation formats. The design uses the new GaAs chipset together with the Motorola 1.8 GHz GaAs chipset introduced last February. Two other new ICs from other Motorola IC groups are also included - - a frequency synthesizer and wideband FM IF subsystem which are silicon ICs. GaAs was chosen over silicon processes in a performance vs. cost trade-off. Efficiency demands indicate a GaAs option because many proposed 2.4 GHz applications require battery operation. In any case GaAs is the preferred choice for gain and efficiency at these frequencies.
MAFET However, GaAs processes tend to be higher cost and so Motorola has had to develop the MAFET IC process which borrows much from high-volume silicon processing and avoids the typical low-yield processes normally found in recessed gate GaAs MESFET manufacturing. The process is capable of both enhancement and depletion mode FETs for either digital or R.F applications. Motorola says that
0026-2692/95/$7.00 © 1995, Elsevier Science Ltd.
2.4 GHz integrated circuit chip set designed for Wireless Communications. a variety of reasons, including the limited number of mask layers, makes GaAs performance available at BiCMOS prices.
Packaging for cost The partitioning of the chipset was dictated by packaging with cost as a major consideration for Part 15 applications. Multi-function ICs in ceramic packages or multi-pin packages with poor RF performance would not be cost-effective. Low cost SOIC packages were chosen to take advantage of Motorola's volume IC production capability with special leadframes being designed for optimized RF p e r f o r m a n c e . T h e S O I C packages provide compatibility with the P C M C I A form factor expected to be popular for 2.4 Ghz products.
The chipset As shown in the photo, the chipset comprises: MRFIC2401 downconverter ($7.29 ea) MRFIC2403 power amplifier ($6.67 ea) MRFIC2404 single stage exciter amplifier ($4.03 ea)
ix
. . . . . . .
the internal matching of the RF ports which reduces the board space required and minimizing design considerations. The MRFIC2403 power amplifier is a 2-stage power amp designed using the Motorola MAFET planar, refractory gate MESFET IC process. The devices are power dep-mode and require negative gate bias. The IC can be put in sleep mode by decreasing the voltage on the gate bias pins to -3V DC and current drain is thereby reduced to a few hundred l.tmA. The smallest of the three is the exciter amp which as its name suggests, is used to drive the power amp. It has been optimized for ISM operation but can also be used for 2-3 Ghz for telemetry and MMDS wireless cable TV. Performance is suitable for frequency hopping or direct sequence spread spectrum as well as single-frequency applications. It is expected that the new chipset will be seen as both a designer- and user-friendly building block with wide take-up for applications in the exciting new opportunities created within the ISM bands. Contact: Don Sundby, Motorola Inc., E 114, 5005 E. McDowell Rd., Phoenix, A Z 85008 USA. Tel~fax:[I] (602) 244 6108 / 4597.
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Simplified block diagram of radio modem.
housed in a variety of low-cost, low-profile, plastic SOIC packages, prices in brackets are for "low volume quantities", with a production lead time of 8 weeks. The MRFIC2401 downconverter IC consists of a 2-stage GaAs MESFET LNA and single-ended MESFET mixer. Motorola says that the LNA output and mixer stage input have been kept apart to allow the addition of an external image filter - - usually ceramic, it is useful in improving mixer noise figure etc. Few off-chip components are required due to
M O T O R O L A SPS 2.4GHz RADIO DATA
IMAGE FIL~ER OOWNCONVER1ER
r~
,F
FILTER
IF SUBSYSTEM
MPU &
T/R
BASEBAND
MC13158
MRFIC2,101
SWITCH
PROCESSOR MC12210
MRFIC1801
VCO~ POWER AMP
UPCONVERTER
EXCITER
VCO
8YNTHIRIZER ~ MRRC2403
IMAGE FILI~.R MRRC2404
MRFIC1803 i
MC12149
MOTOROLARFIC OTHER MOTOROLAIC
MC145170
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Motorola integrated wireless data solution Announced at the Wireless Symposium and Exhibition in Santa Clara, the 3-IC chipset from Motorola is aimed specifically at the 2.4-2.5 GHz ISM band for wireless data applications such ¢t~ LANs, datalinks, RFID and cordless phones. The chipset is a textbook example of reconciling the often conflicting demands of performance, efficiency, size and cost for user-friendly portable applications. The chipset from Motorola's Communications Semiconductor Product Division is shown in a simplified block diagram of a radio modem which is a typical application at the 2.4 GHz ISM band, Figure 1. Based on Motorola SPS components this design is intended for GFSK in a FHSS architecture but could be adapted to DSSS or other modulation formats. The design uses the new GaAs chipset together with the Motorola 1.8 GHz GaAs chipset introduced last February. Two other new ICs from other Motorola IC groups are also included - - a frequency synthesizer and wideband FM IF subsystem which are silicon ICs. GaAs was chosen over silicon processes in a performance vs. cost trade-off. Efficiency demands indicate a GaAs option because many proposed 2.4 GHz applications require battery operation. In any case GaAs is the preferred choice for gain and efficiency at these frequencies.
MAFET However, GaAs processes tend to be higher cost and so Motorola has had to develop the MAFET IC process which borrows much from high-volume silicon processing and avoids the typical low-yield processes normally found in recessed gate GaAs MESFET manufacturing. The process is capable of both enhancement and depletion mode FETs for either digital or R.F applications. Motorola says that
0026-2692/95/$7.00 © 1995, Elsevier Science Ltd.
2.4 GHz integrated circuit chip set designed for Wireless Communications. a variety of reasons, including the limited number of mask layers, makes GaAs performance available at BiCMOS prices.
Packaging for cost The partitioning of the chipset was dictated by packaging with cost as a major consideration for Part 15 applications. Multi-function ICs in ceramic packages or multi-pin packages with poor RF performance would not be cost-effective. Low cost SOIC packages were chosen to take advantage of Motorola's volume IC production capability with special leadframes being designed for optimized RF p e r f o r m a n c e . T h e S O I C packages provide compatibility with the P C M C I A form factor expected to be popular for 2.4 Ghz products.
The chipset As shown in the photo, the chipset comprises: MRFIC2401 downconverter ($7.29 ea) MRFIC2403 power amplifier ($6.67 ea) MRFIC2404 single stage exciter amplifier ($4.03 ea)
ix
. . . . . . .
the internal matching of the RF ports which reduces the board space required and minimizing design considerations. The MRFIC2403 power amplifier is a 2-stage power amp designed using the Motorola MAFET planar, refractory gate MESFET IC process. The devices are power dep-mode and require negative gate bias. The IC can be put in sleep mode by decreasing the voltage on the gate bias pins to -3V DC and current drain is thereby reduced to a few hundred l.tmA. The smallest of the three is the exciter amp which as its name suggests, is used to drive the power amp. It has been optimized for ISM operation but can also be used for 2-3 Ghz for telemetry and MMDS wireless cable TV. Performance is suitable for frequency hopping or direct sequence spread spectrum as well as single-frequency applications. It is expected that the new chipset will be seen as both a designer- and user-friendly building block with wide take-up for applications in the exciting new opportunities created within the ISM bands. Contact: Don Sundby, Motorola Inc., E 114, 5005 E. McDowell Rd., Phoenix, A Z 85008 USA. Tel~fax:[I] (602) 244 6108 / 4597.
Input Power - -30dBm 17
1.75
16.5
j
/
~
~
Gain
15.5
15
\
/
\
1.65
14.5
]
141
\
la.5 la
\
/
\
12.5
Nols( Figure ~- %
i
/
~\
1.5
1.55
j
12
1.5 2
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Frequency - d B
Simplified block diagram of radio modem.
housed in a variety of low-cost, low-profile, plastic SOIC packages, prices in brackets are for "low volume quantities", with a production lead time of 8 weeks. The MRFIC2401 downconverter IC consists of a 2-stage GaAs MESFET LNA and single-ended MESFET mixer. Motorola says that the LNA output and mixer stage input have been kept apart to allow the addition of an external image filter - - usually ceramic, it is useful in improving mixer noise figure etc. Few off-chip components are required due to
M O T O R O L A SPS 2.4GHz RADIO DATA
IMAGE FIL~ER OOWNCONVER1ER
r~
,F
FILTER
IF SUBSYSTEM
MPU &
T/R
BASEBAND
MC13158
MRFIC2,101
SWITCH
PROCESSOR MC12210
MRFIC1801
VCO~ POWER AMP
UPCONVERTER
EXCITER
VCO
8YNTHIRIZER ~ MRRC2403
IMAGE FILI~.R MRRC2404
MRFIC1803 i
MC12149
MOTOROLARFIC OTHER MOTOROLAIC
MC145170