Surface Mounted Semiconductors

tempts to fill this gap but unfortunately the authors concentrated mainly on the tools of design more than bit-serial architecture. These tools take the form of a silicon compiler, known as the FIRST compiler (Fast Implementaion of Real-time Signal Transforms) developed in Edinburgh. This term - silicon compiler - can be misleading. It was first coined to describe original work by Johannsen (1978, 1981). The purpose of compilers was to avoid tedium and errors consequent on producing long lists of low-level code. A question is raised to the text as to whether the designer should be system designers rdquiring limited knowledge of the structure of low-level primitives which cannot be answered simply and the text does not give a full answer to this. Structure and methodology is important but this has the damaging effect of producing catalogue designers. After the first chapter which introduces the reader to Bit-Serial architecture, the majority of the text deals largely with the system description language and primitive library, with a large section on worked examples. Design for testability has been well considered in a chapter on testing and self-testing and there is much evidence of practical implementation of the case studies. These case studies take up over half the text and consist of a number of different contributions which include prestige names like Carver Mead. In summary, this text has a lot of merit but I would have doubts as to anyone obtaining its full value without access to the FIRST compiler. It would be advisable reading for a study of design strategy. The title is a bit misleading; a more accurate title would be "FIRST user guide". Richard Bayford February 1986

Surface Mounted Semiconductors Published By: Benn Electronics Publications, Luton, UK Authors: David Taylor & Bob Garner of Product Assessment, London, UK Surface Mounted Semiconductors is one of a number of reports seen recently on the subjects of Surface Mounting, however, this publication is of particular interest since it gives the reader a wealth of practical information essential for starting out in this new technology. The report easily divides into three main sections. An analysis of packaging trends markets and prices together with a detailed review of board assembly techniques; reviews of over 50 suppliers of SM semiconductor components and surface mount board assembly equipment; an extensive directory of supplies of all the components, equipments, materials and services in the USA, Europe and Japan needed for surface mount board assembly. Although surface mount has been used for many years in the consumer products industry a sufficient range of surface mounted semiconductor components in standard packages have not been available for many designs. The publication clearly shows the trends in the industry towards providing these products and details of over 30 semiconductor manufacturers packaging plans and both current and future components available in PLCC and SOIC packages are given in depth. In addition to this a large range of equipment for surface mount are received for over 20 supplies from the worlds leaders such as TDK, Panasonic and Universal to smaller specialised supplies. The publication concentrates on providing practical information of use today as opposed to futuristic conjecture, although very firm information on price and market trends is clearly given. The report concludes that SM is by the end of the year a very real and cost effective production route and this publication is one of the best starting points yet seen for anyone taking an active interest in the new technology. M. Howson

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