4952272 Method of manufacturing probing head for testing equipment of semiconductor large scale integrated circuits

4952272 Method of manufacturing probing head for testing equipment of semiconductor large scale integrated circuits

New Patents The optical fiber backscatter signal generator (OFBSG) generates simulated optical fiber backscatter waveform signals that are used to cha...

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New Patents The optical fiber backscatter signal generator (OFBSG) generates simulated optical fiber backscatter waveform signals that are used to characterize or calibrate an optical time-domain reflectometer (OTDR). An OTDR is a commercially available test instrument that measures loss and length of a fiber optic cable by launching an optical signal into the cable and measuring the power that is reflected back (backscattered) into the OTDR. The OFBSG device creates a simulated optical fiber backscattered signal of a virtual cable and couples this signal into the OTDR so that length accuracy, loss accuracy, and dynamic range of the OTDR can be determined. An electroopticai section, a signal generator section and a microprocessor section that is programmable to simulate a variety of cable anomalies, provide adaptability to accommodate a wide variety of OTDRs and, by reason of its sound engineering design, it is capable of being used under adverse conditions such as those encountered in the field.

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4952272 METHOD OF MANUFACTURING PROBING HEAD FOR TESTING EQUIPMENT OF SEMICONDUCTOR LARGE SCALE INTEGRATED CIRCUITS Hironobu Okino, Akio Fujiwara, Yutaka Akiba, Susumu Kasukabe, Tsuyoshi Fujita, Masao Mitani, Kazuo Hirota, Kawasaki, Japan assigned to Hitachi Ltd A probe head for use with equipment for testing a semiconductor device such as a large scale integrated circuit (LSI) includes electrode pads are formed on a circuit substrate, and a pad protecting conductive layer formed on the pads. A probe pin forming material is grown which is worked into a pin-like configuration, thereby improving a pin assembling property of a probe head portion and this realizes highly accurate pinning with high reliability.

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