- Email: [email protected]
High speed bipolar monolithic memories
World Abstracts on Microelectronics and Reliability Laboratorie d'Electronique et de Technologie de L'Informatique (LETI). It describes the techniques and initial results of analysis of chemical processing solutions used in the fabrication of microelectronic circuits. Two distinct analytical problems are studied', the first concerns the analysis of solutions containing both dissolved and insolu6. M I C R O E L E C T R O N I C S - - C O M P O N E N T S ,
RC active filters for microelectronic realization. F. W. STEPHENSON. Microelectronics. 6, 7 (1975). There has recently been considerable interest in the realization of RC active filters having equal-valued capacitors. Huelsman first suggested the desirability of such a network constraint when considering fabrication in microelectronic form. Subsequent work has produced other circuit forms in which account has been taken of both resistor spread and total resistor sum. These parameters may be minimized with respect to amplifier gain and, in certain cases, are found to be coincident. Figure 1 illustrates the two basic forms of network due to Dutta Roy and Malik (D1, D2). Analysis shows these to be directly equivalent to the Gopal structures shown in Fig. 2, the element numbering in the latter having been altered so as to yield identical voltage transfer functions.
CDl--its capability and application. D. GRUNDY. Microelectronics. 6, 29 (1975). In a previous issue, the Collector Diffused Isolation (CDI) process was compared with MOS type and oxide isolated hi-polar technologies and was shown to give a unique combination of device performance, packing density, reliability and processing simplicity. Over the past two years, the process has been applied to an extremely wide variety of applications with complexity ranging from chip sizes of 30 x 30 mils for simple linear devices to 200 × 200 mils for complex digital devices. In addition, chips containing both linear and digital systems (DIGILIN) have been produced to exacting performance specifications. This paper describes digital, linear and DIGILIN devices and the basic design concepts upon which these are based.
Multilayer interconnection techniques applied to high speed computer systems. K. C. BINGHAMand R. NAYLOR. IEEE Trans. Parts, Hybrids & Packaging. PHP-10, 175 (1974). A microcircuit interconnection system has been developed which utilizes the advantages of a metal substrate for heat conduction and power distribution combined with a superimposed logic interconnection plane fabricated on 25 p,m polyimide film. The copper substrate component of the assembly is capable of dissipating 4 W/cm: to a water-cooled duct and maintaining a chip surface temperature of 45°C above ambient. It supports an expansion matched glass ceramic film which electrically insulates the power distribution plane. All the signal connections are formed by 125 ttm gold conductors supported on the polyimide film in which throughconnections are formed by etched and metallized 38/xm holes. Direct connections to the emitter coupled logic chips are formed by etching away areas of the polyimide film under the conductor tracks to leave beam leads. Finally, in assembly, the back of the chips supported on the polyimide film are soldered to prepared cavities in the substrate. Test assemblies have demonstrated a threefold increase in system speed for 1 nsec integrated circuits as compared with their performance in comparable assemblies on standard printed circuit boards.
High speed bipolar monolithic memories. V. H. GLOCK and H. ERNST. Frequenz 29, 80 (1975). After reviewing the development of main memories over the last 15 yr, the structure, mode of operation and applications of fast bipolar semiconductor memories will be shown. Several
343
ble impurities, while the second concerns the analysis of particulate matter separated from the solutions by ultra filtration techniques to 0.2/xm. The results suggest that considerable quantities of insoluble metallic impurities can be present in semiconductor grade chemicals and that they can be removed by ultra filtration techniques. SYSTEMS
AND
EQUIPMENTS
modern technologies which are used for high-density memory chips will be discussed. The design requirements of the cell matrix and driver circuits of the memory chips will be examined and the influence of chip speed and cost in the system will be shown. In conclusion the advantages and disadvantages of bipolar semiconductor memories will be compared and contrasted with core and MOS memories, and future trends will be discussed.
Minimizing downtime for electronic switching systems. T. F. ARNOLD and W. B. ROHN. Bell Labs. Record. March 1975. p. 157. New maintenance facilities and procedures are being developed for the Traffic Service Position System to minimize downtime due to equipment failures. These developments are the result of applying a new analytical model of electronic switching systems that predicts system downtime and points out ways to minimize system problems.
Controlling data communication systems. J. G. NEWMAN. Electronics & Power. 3 April, 1975. p. 381. No matter how large or sophisticated a data-communication network is, its efficiency is largely covered by fault diagnosis and its fallback capabilities. These facilities are essential in achieving this efficiency, and should therefore be considered at the initial stages of system planning--or, if the opening paragraph of this article is in some way reminiscent of your network, it is not too late to incorporate them. CMOS multiplex data communication offers advantages in different applications. T. PELHAM. Electronics & Power. 3 April, 1975. p. 378. A factor which frequently wields a significant amount of power in influencing the adoption of one data-communication system over another is cost. In this respect, modules designed using standard CMOS integrated circuits can be especially cost-effective.
Diagnostic testing of MOS random acess memories. W. S. RICHARDSON. Solid State Techn. March, 1975. p. 31. Diagnostic testing as performed by a design engineer is described as a necessary and valuable tool. Since diagnostic testing requires flexibility, the specific requirements for a memory test system and the hardware necessary to support the basic memory test system are discussed. An example of a memory disturb problem is explained in detail to illustrate the difficulty in identifying circuit sensitivities in an MOS random access memory.
Four-chip microprocessor family reduces system parts count. D. CHUNG. Electronics. March, 6th, 1975. p. 87. Basic two-chip system, consisting of microprocessor and read-only memory, handles simple applications by itself but can also be built into complex multiprocessing systems with the aid of memory access and interface chips.
An electronic digital dock using integrated circuits for the data logger scanner and recording annunciator system of a nuclear power reactor. S. AMBATI. Int. J. Electron. 38, 177 (1975). This paper deals with the development of a specialized electronic digital clock using integrated circuits for the data logger scanner and recording annunciator system of a nuclear reactor. The clock is built up in such a
RC active filters for microelectronic realization. F. W. STEPHENSON. Microelectronics. 6, 7 (1975). There has recently been considerable interest in the realization of RC active filters having equal-valued capacitors. Huelsman first suggested the desirability of such a network constraint when considering fabrication in microelectronic form. Subsequent work has produced other circuit forms in which account has been taken of both resistor spread and total resistor sum. These parameters may be minimized with respect to amplifier gain and, in certain cases, are found to be coincident. Figure 1 illustrates the two basic forms of network due to Dutta Roy and Malik (D1, D2). Analysis shows these to be directly equivalent to the Gopal structures shown in Fig. 2, the element numbering in the latter having been altered so as to yield identical voltage transfer functions.
CDl--its capability and application. D. GRUNDY. Microelectronics. 6, 29 (1975). In a previous issue, the Collector Diffused Isolation (CDI) process was compared with MOS type and oxide isolated hi-polar technologies and was shown to give a unique combination of device performance, packing density, reliability and processing simplicity. Over the past two years, the process has been applied to an extremely wide variety of applications with complexity ranging from chip sizes of 30 x 30 mils for simple linear devices to 200 × 200 mils for complex digital devices. In addition, chips containing both linear and digital systems (DIGILIN) have been produced to exacting performance specifications. This paper describes digital, linear and DIGILIN devices and the basic design concepts upon which these are based.
Multilayer interconnection techniques applied to high speed computer systems. K. C. BINGHAMand R. NAYLOR. IEEE Trans. Parts, Hybrids & Packaging. PHP-10, 175 (1974). A microcircuit interconnection system has been developed which utilizes the advantages of a metal substrate for heat conduction and power distribution combined with a superimposed logic interconnection plane fabricated on 25 p,m polyimide film. The copper substrate component of the assembly is capable of dissipating 4 W/cm: to a water-cooled duct and maintaining a chip surface temperature of 45°C above ambient. It supports an expansion matched glass ceramic film which electrically insulates the power distribution plane. All the signal connections are formed by 125 ttm gold conductors supported on the polyimide film in which throughconnections are formed by etched and metallized 38/xm holes. Direct connections to the emitter coupled logic chips are formed by etching away areas of the polyimide film under the conductor tracks to leave beam leads. Finally, in assembly, the back of the chips supported on the polyimide film are soldered to prepared cavities in the substrate. Test assemblies have demonstrated a threefold increase in system speed for 1 nsec integrated circuits as compared with their performance in comparable assemblies on standard printed circuit boards.
High speed bipolar monolithic memories. V. H. GLOCK and H. ERNST. Frequenz 29, 80 (1975). After reviewing the development of main memories over the last 15 yr, the structure, mode of operation and applications of fast bipolar semiconductor memories will be shown. Several
343
ble impurities, while the second concerns the analysis of particulate matter separated from the solutions by ultra filtration techniques to 0.2/xm. The results suggest that considerable quantities of insoluble metallic impurities can be present in semiconductor grade chemicals and that they can be removed by ultra filtration techniques. SYSTEMS
AND
EQUIPMENTS
modern technologies which are used for high-density memory chips will be discussed. The design requirements of the cell matrix and driver circuits of the memory chips will be examined and the influence of chip speed and cost in the system will be shown. In conclusion the advantages and disadvantages of bipolar semiconductor memories will be compared and contrasted with core and MOS memories, and future trends will be discussed.
Minimizing downtime for electronic switching systems. T. F. ARNOLD and W. B. ROHN. Bell Labs. Record. March 1975. p. 157. New maintenance facilities and procedures are being developed for the Traffic Service Position System to minimize downtime due to equipment failures. These developments are the result of applying a new analytical model of electronic switching systems that predicts system downtime and points out ways to minimize system problems.
Controlling data communication systems. J. G. NEWMAN. Electronics & Power. 3 April, 1975. p. 381. No matter how large or sophisticated a data-communication network is, its efficiency is largely covered by fault diagnosis and its fallback capabilities. These facilities are essential in achieving this efficiency, and should therefore be considered at the initial stages of system planning--or, if the opening paragraph of this article is in some way reminiscent of your network, it is not too late to incorporate them. CMOS multiplex data communication offers advantages in different applications. T. PELHAM. Electronics & Power. 3 April, 1975. p. 378. A factor which frequently wields a significant amount of power in influencing the adoption of one data-communication system over another is cost. In this respect, modules designed using standard CMOS integrated circuits can be especially cost-effective.
Diagnostic testing of MOS random acess memories. W. S. RICHARDSON. Solid State Techn. March, 1975. p. 31. Diagnostic testing as performed by a design engineer is described as a necessary and valuable tool. Since diagnostic testing requires flexibility, the specific requirements for a memory test system and the hardware necessary to support the basic memory test system are discussed. An example of a memory disturb problem is explained in detail to illustrate the difficulty in identifying circuit sensitivities in an MOS random access memory.
Four-chip microprocessor family reduces system parts count. D. CHUNG. Electronics. March, 6th, 1975. p. 87. Basic two-chip system, consisting of microprocessor and read-only memory, handles simple applications by itself but can also be built into complex multiprocessing systems with the aid of memory access and interface chips.
An electronic digital dock using integrated circuits for the data logger scanner and recording annunciator system of a nuclear power reactor. S. AMBATI. Int. J. Electron. 38, 177 (1975). This paper deals with the development of a specialized electronic digital clock using integrated circuits for the data logger scanner and recording annunciator system of a nuclear reactor. The clock is built up in such a